JP2017092411A - 配線基板、半導体装置及び配線基板の製造方法 - Google Patents
配線基板、半導体装置及び配線基板の製造方法 Download PDFInfo
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- JP2017092411A JP2017092411A JP2015224688A JP2015224688A JP2017092411A JP 2017092411 A JP2017092411 A JP 2017092411A JP 2015224688 A JP2015224688 A JP 2015224688A JP 2015224688 A JP2015224688 A JP 2015224688A JP 2017092411 A JP2017092411 A JP 2017092411A
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Abstract
【解決手段】配線基板12は、最外層の絶縁層51と、絶縁層51を厚さ方向に貫通する貫通孔51Y内に形成されたビア配線61と、ビア配線61と同一の材料からなり、絶縁層51の上面51Aに形成された導電パターン62とを有する。配線基板12は、導電パターン62の上面62Aよりも凹むようにビア配線61の上面に形成された凹部61Xと、凹部61Xを充填し、導電パターン62及びビア配線61を被覆するように絶縁層51の上面51Aに形成されたソルダレジスト層53とを有する。ビア配線61と導電パターン62と凹部61Xとソルダレジスト層53とによって識別マーク15が構成されている。凹部61Xの内側面は曲面である。ビア配線61上に形成されたソルダレジスト層53は、導電パターン62上に形成されたソルダレジスト層53よりも厚く形成されている。
【選択図】図2
Description
なお、添付図面は、特徴を分かりやすくするために便宜上特徴となる部分を拡大して示している場合があり、各構成要素の寸法比率などが実際と同じであるとは限らない。また、断面図では、各部材の断面構造を分かりやすくするために、一部の部材のハッチングを梨地模様に代えて示し、一部の部材のハッチングを省略している。
図1(a)に示すように、配線基板10は、例えば、シート状の配線基板である。配線基板10は、例えば、平面視略矩形状に形成されている。配線基板10は、複数(ここでは、3つ)のブロック11と、複数のブロック11を囲むように形成された外枠20とを有している。複数のブロック11は互いに分離して画定されている。各ブロック11には、単位配線基板(配線基板)12がマトリクス状(ここでは、3×3)に複数個連設して設けられている。配線基板10は、切断位置A1において切断されることにより個片化され、個々の単位配線基板12となる。なお、外枠20は、個片化の際に廃棄される部分である。
まず、識別マーク15及びその周辺の構造について詳述する。
図1(b)に示すように、識別マーク25の平面形状は、特定の文字・記号(図示の例では、「□」)として識別可能なように形成されている。本例の識別マーク25は、7セグメント式表示における4つのセグメントによって表現された「□」として識別可能なように形成されている。
半導体装置70は、配線基板12と、その配線基板12に実装された半導体チップ71と、アンダーフィル樹脂73と、外部接続端子74とを有している。
まず、図6(b)に従って、従来の配線基板に形成された識別マーク15Aについて説明する。識別マーク15Aは、配線パターン110を被覆する絶縁層111に形成された貫通孔111Xと、貫通孔111Xの内面及び絶縁層111の上面を連続的に被覆するめっき層112とから構成されている。貫通孔111Xは、図6(b)において上側から下側に向かうに連れて径が小さくなるテーパ状に形成されている。このため、貫通孔111Xの内側面を被覆するめっき層112は、配線パターン110の上面に対して直線状に傾斜して形成されている。すなわち、貫通孔111Xの内側面を被覆するめっき層112の表面は平面に形成されている。このような識別マーク15Aでは、配線パターン110の上面に対して垂直に入射する入射光Aは、貫通孔111Xの底部に形成されためっき層112で反射し、反射光Bのように上方に反射する。一方、入射光C,Eのように配線パターン110の上面に対して斜めに入射する光は、貫通孔111Xの内側面に形成されためっき層112で反射する。このとき、上述したように、貫通孔111Xの内側面を被覆するめっき層112の表面が平面に形成されている。このため、貫通孔111Xの内側面を被覆するめっき層112の表面では拡散反射(乱反射)が起こりにくい。この結果、識別マーク15Aでは、絶縁層111の上面に形成されためっき層112に入射された入射光Gの反射光Hと、貫通孔111X内に形成されためっき層112から上方に反射された反射光との強度の差が小さくなる。このため、貫通孔111X内に形成されためっき層112と、絶縁層111の上面に形成されためっき層112とのコントラストが弱くなり、識別マーク15Aの視認性が低くなる。
まず、図7(a)に示す工程では、基板本体30を準備する。基板本体30は、配線基板12(図2(a)参照)が形成される基板形成領域A2を複数有するとともに、それら基板形成領域A2の外側に形成され、外枠20(図2(a)参照)が形成される外枠形成領域A3を有している。続いて、基板本体30の上面に、配線パターン50A,50B,50Cを有する配線層50を形成し、基板本体30の下面に配線層40を形成する。配線層40,50は、例えば、セミアディティブ法やサブトラクティブ法などの各種の配線形成方法を用いて形成することができる。
次に、図13(a)に示した構造体を切断位置A1に沿ってダイシングブレード等によって切断する。これにより、図13(b)に示すように、配線基板12が個片化され、複数の配線基板12が製造される。なお、本工程において、外枠20(図13(a)参照)は廃棄される。
(1)貫通孔51Yに形成されたビア配線61と、導電パターン62と、ビア配線61の上面に形成された凹部61Xと、凹部61Xを充填し、ビア配線61及び導電パターン62を被覆するソルダレジスト層53とによって識別マーク15を構成した。また、凹部61Xの内側面を曲面に形成した。これにより、導電パターン62の上面62Aとビア配線61の上面とのコントラストが強くなる。このため、ビア配線61の上面に形成された凹部61Xによって形作られた識別マーク15の視認性を向上させることができる。
なお、上記実施形態は、これを適宜変更した以下の態様にて実施することもできる。
・上記実施形態では、凹部61X,66Xを断面視略半円状に形成した。すなわち、凹部61X,66Xの内側面及び底面を曲面に形成した。これに限らず、例えば、凹部61X,66Xの底面を平坦面に形成するようにしてもよい。すなわち、凹部61X,66Xの内側面が曲面であれば、凹部61X,66Xの底面の形状は特に限定されない。
・上記実施形態の配線パターン50Cを省略してもよい。
・上記実施形態では、7セグメント式数字として識別される識別マーク15に具体化した。これに限らず、7セグメント式数字以外の文字・記号として識別される識別マーク15に具体化してもよい。例えば、図14(a)及び図14(b)に示すように、複数の凹部61Xの配置によって形作られる文字・記号(図14(a)では、アラビア数字の「4」、図14(b)では「+」)として識別される識別マーク15に具体化してもよい。すなわち、図14(a)及び図14(b)に示した複数の凹部61Xは、平面視したときの全体像が特定の形状として識別可能となるように、その特定の形状を形作るように配置されている。なお、識別マーク25についても識別マーク15と同様に変更可能である。
・上記実施形態の配線基板12における配線層40,50,42,52及び絶縁層41,51の層数や配線の取り回しなどは様々に変形・変更することが可能である。
11 ブロック
12 配線基板
15,25 識別マーク
20 外枠
50 配線層
50A 配線パターン(第2配線パターン)
50B,50C 配線パターン(第1配線パターン)
51 絶縁層
51X 貫通孔(第2貫通孔)
51Y,51Z 貫通孔(第1貫通孔)
52 配線層
53 ソルダレジスト層(保護絶縁層)
53X 開口部
54 ビア配線(第2ビア配線)
61,66 ビア配線(第1ビア配線)
61X,66X 凹部
62,67 導電パターン
70 半導体装置
71 半導体チップ
P2 接続パッド
Claims (10)
- 最外層の絶縁層と、
前記絶縁層を厚さ方向に貫通し、文字及び記号を含む特定の形状に形作られた第1貫通孔と、
前記第1貫通孔内に形成された第1ビア配線と、
前記第1ビア配線と同一の材料からなり、前記第1ビア配線と接続され、前記絶縁層の上面に形成された導電パターンと、
前記導電パターンの上面よりも前記第1貫通孔の底面側に凹むように前記第1ビア配線の上面に形成された凹部と、
前記凹部を充填し、前記導電パターン及び前記第1ビア配線を被覆するように前記絶縁層の上面に形成された保護絶縁層と、を有し、
前記第1ビア配線と前記導電パターンと前記凹部と前記保護絶縁層とは、前記特定の形状として識別可能に構成された識別マークを構成し、
前記凹部の内側面は曲面であり、
前記第1ビア配線上に形成された前記保護絶縁層は、前記導電パターン上に形成された前記保護絶縁層よりも厚く形成されていることを特徴とする配線基板。 - 前記凹部の底面は、前記絶縁層の上面よりも前記第1貫通孔の底面側の位置に形成されていることを特徴とする請求項1に記載の配線基板。
- 前記導電パターンは、前記識別マークが形成された領域全体に形成されていることを特徴とする請求項1又は2に記載の配線基板。
- 前記第1貫通孔は、前記絶縁層の上面側から前記第1貫通孔の底面に向かうに連れて開口幅が小さくなるテーパ状に形成されていることを特徴とする請求項1〜3のいずれか一項に記載の配線基板。
- 前記保護絶縁層は、ソルダレジスト層であることを特徴とする請求項1〜4のいずれか一項に記載の配線基板。
- 前記特定の形状は、7セグメント式文字であることを特徴とする請求項1〜5のいずれか一項に記載の配線基板。
- 前記絶縁層の下層に形成された第1配線パターン及び第2配線パターンと、
前記絶縁層を厚さ方向に貫通して前記第1配線パターンの上面の一部を露出する前記第1貫通孔と、
前記絶縁層を厚さ方向に貫通して前記第2配線パターンの上面の一部を露出する第2貫通孔と、
前記第2貫通孔を充填する第2ビア配線と、
前記第2ビア配線を介して前記第2配線パターンと電気的に接続され、前記絶縁層の上面に形成された配線層と、を有し、
前記保護絶縁層は、前記配線層の少なくとも一部を接続パッドとして露出させるための開口部を有し、
前記第1貫通孔は、前記第2貫通孔よりも体積が大きくなるように形成されていることを特徴とする請求項1〜6のいずれか一項に記載の配線基板。 - 請求項7に記載の配線基板と、
前記接続パッドと電気的に接続され、前記配線基板に実装された半導体チップと、
を有することを特徴とする半導体装置。 - 最外層の絶縁層を形成する工程と、
前記最外層の絶縁層を厚さ方向に貫通し、平面形状が文字及び記号を含む特定の形状に形作られた第1貫通孔を形成する工程と、
前記第1貫通孔に対応する平面形状の凹部が上面に形成された第1ビア配線を前記第1貫通孔内に形成するとともに、前記第1ビア配線と同一の材料からなり、前記第1ビア配線と接続される導電パターンを前記絶縁層の上面に形成する工程と、
前記凹部を充填し、前記導電パターン及び前記第1ビア配線を被覆する保護絶縁層を前記絶縁層の上面に形成し、前記第1ビア配線と前記導電パターンと前記凹部と前記保護絶縁層とから構成され、前記特定の形状として識別可能に構成された識別マークを形成する工程と、を有し、
前記凹部は、前記導電パターンの上面よりも前記第1貫通孔の底面側に凹むように形成され、
前記凹部の内側面は、曲面に形成され、
前記第1ビア配線上に形成された前記保護絶縁層は、前記導電パターン上に形成された前記保護絶縁層よりも厚く形成されることを特徴とする配線基板の製造方法。 - 第1配線パターン及び第2配線パターンを被覆する最外層の絶縁層を形成する工程と、
前記絶縁層を厚さ方向に貫通して前記第1配線パターンの上面の一部を露出し、平面形状が文字及び記号を含む特定の形状に形作られた第1貫通孔を形成するとともに、前記絶縁層を厚さ方向に貫通して前記第2配線パターンの上面の一部を露出する第2貫通孔を形成する工程と、
前記第1貫通孔に対応する平面形状の凹部が上面に形成された第1ビア配線を前記第1貫通孔内に形成し、前記第1ビア配線と同一の材料からなり、前記第1ビア配線と接続される導電パターンを前記絶縁層の上面に形成するとともに、前記第2貫通孔を充填する第2ビア配線を形成し、前記第2ビア配線を介して前記第2配線パターンと電気的に接続される配線層を前記絶縁層の上面に形成する工程と、
前記配線層の少なくとも一部を接続パッドとして露出させる開口部を有し、前記凹部を充填するとともに、前記導電パターン及び前記第1ビア配線を被覆する保護絶縁層を前記絶縁層の上面に形成し、前記第1ビア配線と前記導電パターンと前記凹部と前記保護絶縁層とから構成され、前記特定の形状として識別可能に構成された識別マークを形成する工程と、を有し、
前記第1貫通孔と前記第2貫通孔とは、レーザ加工法により形成され、
前記第1貫通孔は、前記第2貫通孔よりも体積が大きくなるように形成され、
前記凹部は、前記絶縁層の上面よりも前記第1貫通孔の底面側に凹むように形成され、
前記凹部の内側面は、曲面に形成され、
前記第1ビア配線上に形成された前記保護絶縁層は、前記導電パターン上に形成された前記保護絶縁層よりも厚く形成されることを特徴とする配線基板の製造方法。
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