JP2017064899A5 - - Google Patents

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Publication number
JP2017064899A5
JP2017064899A5 JP2016157717A JP2016157717A JP2017064899A5 JP 2017064899 A5 JP2017064899 A5 JP 2017064899A5 JP 2016157717 A JP2016157717 A JP 2016157717A JP 2016157717 A JP2016157717 A JP 2016157717A JP 2017064899 A5 JP2017064899 A5 JP 2017064899A5
Authority
JP
Japan
Prior art keywords
polishing
polishing pad
pad
layer
backing layer
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2016157717A
Other languages
English (en)
Japanese (ja)
Other versions
JP2017064899A (ja
Filing date
Publication date
Application filed filed Critical
Priority to SG10201607697VA priority Critical patent/SG10201607697VA/en
Priority to KR1020160121233A priority patent/KR20170039565A/ko
Priority to TW105131245A priority patent/TWI719056B/zh
Priority to CN201610866058.3A priority patent/CN106863104A/zh
Priority to US15/283,212 priority patent/US10160089B2/en
Publication of JP2017064899A publication Critical patent/JP2017064899A/ja
Publication of JP2017064899A5 publication Critical patent/JP2017064899A5/ja
Pending legal-status Critical Current

Links

JP2016157717A 2015-10-01 2016-08-10 研磨装置 Pending JP2017064899A (ja)

Priority Applications (5)

Application Number Priority Date Filing Date Title
SG10201607697VA SG10201607697VA (en) 2015-10-01 2016-09-15 Polishing apparatus
KR1020160121233A KR20170039565A (ko) 2015-10-01 2016-09-22 연마 장치
TW105131245A TWI719056B (zh) 2015-10-01 2016-09-29 研磨裝置
CN201610866058.3A CN106863104A (zh) 2015-10-01 2016-09-29 研磨装置
US15/283,212 US10160089B2 (en) 2015-10-01 2016-09-30 Polishing apparatus

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2015195823 2015-10-01
JP2015195823 2015-10-01

Publications (2)

Publication Number Publication Date
JP2017064899A JP2017064899A (ja) 2017-04-06
JP2017064899A5 true JP2017064899A5 (enExample) 2019-09-12

Family

ID=58491133

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2016157717A Pending JP2017064899A (ja) 2015-10-01 2016-08-10 研磨装置

Country Status (5)

Country Link
JP (1) JP2017064899A (enExample)
KR (1) KR20170039565A (enExample)
CN (1) CN106863104A (enExample)
SG (1) SG10201607697VA (enExample)
TW (1) TWI719056B (enExample)

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN109249304B (zh) * 2018-09-21 2019-09-27 西安理工大学 一种平面研磨精密定尺寸装置及控制方法
CN110625519B (zh) * 2019-08-26 2021-08-03 苏州冠博控制科技有限公司 一种高精度晶圆研磨机
CN114367919A (zh) * 2020-10-14 2022-04-19 长鑫存储技术有限公司 研磨控制方法、装置及存储介质
CN117615879A (zh) * 2021-07-06 2024-02-27 应用材料公司 用于化学机械抛光的声学传感器的耦合
TWI879629B (zh) 2021-07-06 2025-04-01 美商應用材料股份有限公司 用於化學機械拋光之包含聲學窗口的拋光墊、包含其之化學機械拋光設備及製造其之方法

Family Cites Families (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2002254302A (ja) * 2001-02-23 2002-09-10 Mitsubishi Materials Silicon Corp 厚さ測定装置付き平面研磨装置
WO2003066284A1 (en) * 2002-02-06 2003-08-14 Applied Materials, Inc. Method and apparatus for chemical mechanical polishing with an eddy current monitoring system
WO2003071592A1 (en) * 2002-02-20 2003-08-28 Ebara Corporation Method and device for polishing
CN1445060A (zh) * 2002-03-07 2003-10-01 株式会社荏原制作所 抛光装置
CN100349267C (zh) * 2002-11-27 2007-11-14 东洋橡胶工业株式会社 研磨垫及半导体器件的制造方法
US20050173259A1 (en) * 2004-02-06 2005-08-11 Applied Materials, Inc. Endpoint system for electro-chemical mechanical polishing
JP4451111B2 (ja) * 2003-10-20 2010-04-14 株式会社荏原製作所 渦電流センサ
US7354334B1 (en) * 2004-05-07 2008-04-08 Applied Materials, Inc. Reducing polishing pad deformation
CN102626895B (zh) * 2005-08-22 2016-05-25 应用材料公司 基于光谱的监测化学机械研磨的装置及方法
JP5361299B2 (ja) * 2008-09-12 2013-12-04 株式会社東京精密 研磨終了予測・検出方法とその装置
JP5730747B2 (ja) 2010-12-10 2015-06-10 株式会社荏原製作所 渦電流センサ並びに研磨方法および装置
KR101495143B1 (ko) * 2010-09-30 2015-02-24 넥스플래너 코퍼레이션 와전류 종료­시점 검출을 위한 연마 패드를 제조하는 방법
JP6196858B2 (ja) * 2012-09-24 2017-09-13 株式会社荏原製作所 研磨方法および研磨装置
CN103084968A (zh) * 2013-02-27 2013-05-08 上海华力微电子有限公司 研磨终点探测方法、装置及研磨机台
JP2016087780A (ja) * 2014-10-31 2016-05-23 株式会社荏原製作所 研磨装置および研磨方法

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