JP2017064899A5 - - Google Patents
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- Publication number
- JP2017064899A5 JP2017064899A5 JP2016157717A JP2016157717A JP2017064899A5 JP 2017064899 A5 JP2017064899 A5 JP 2017064899A5 JP 2016157717 A JP2016157717 A JP 2016157717A JP 2016157717 A JP2016157717 A JP 2016157717A JP 2017064899 A5 JP2017064899 A5 JP 2017064899A5
- Authority
- JP
- Japan
- Prior art keywords
- polishing
- polishing pad
- pad
- layer
- backing layer
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000005498 polishing Methods 0.000 claims description 111
- 238000001514 detection method Methods 0.000 claims description 8
- 230000000149 penetrating effect Effects 0.000 claims description 3
- 239000000463 material Substances 0.000 description 3
- HBMJWWWQQXIZIP-UHFFFAOYSA-N silicon carbide Chemical compound [Si+]#[C-] HBMJWWWQQXIZIP-UHFFFAOYSA-N 0.000 description 2
- 229910010271 silicon carbide Inorganic materials 0.000 description 1
- 229910001220 stainless steel Inorganic materials 0.000 description 1
- 239000010935 stainless steel Substances 0.000 description 1
Priority Applications (5)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| SG10201607697VA SG10201607697VA (en) | 2015-10-01 | 2016-09-15 | Polishing apparatus |
| KR1020160121233A KR20170039565A (ko) | 2015-10-01 | 2016-09-22 | 연마 장치 |
| TW105131245A TWI719056B (zh) | 2015-10-01 | 2016-09-29 | 研磨裝置 |
| CN201610866058.3A CN106863104A (zh) | 2015-10-01 | 2016-09-29 | 研磨装置 |
| US15/283,212 US10160089B2 (en) | 2015-10-01 | 2016-09-30 | Polishing apparatus |
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2015195823 | 2015-10-01 | ||
| JP2015195823 | 2015-10-01 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JP2017064899A JP2017064899A (ja) | 2017-04-06 |
| JP2017064899A5 true JP2017064899A5 (enExample) | 2019-09-12 |
Family
ID=58491133
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2016157717A Pending JP2017064899A (ja) | 2015-10-01 | 2016-08-10 | 研磨装置 |
Country Status (5)
| Country | Link |
|---|---|
| JP (1) | JP2017064899A (enExample) |
| KR (1) | KR20170039565A (enExample) |
| CN (1) | CN106863104A (enExample) |
| SG (1) | SG10201607697VA (enExample) |
| TW (1) | TWI719056B (enExample) |
Families Citing this family (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109249304B (zh) * | 2018-09-21 | 2019-09-27 | 西安理工大学 | 一种平面研磨精密定尺寸装置及控制方法 |
| CN110625519B (zh) * | 2019-08-26 | 2021-08-03 | 苏州冠博控制科技有限公司 | 一种高精度晶圆研磨机 |
| CN114367919A (zh) * | 2020-10-14 | 2022-04-19 | 长鑫存储技术有限公司 | 研磨控制方法、装置及存储介质 |
| WO2023283525A1 (en) * | 2021-07-06 | 2023-01-12 | Applied Materials, Inc. | Coupling of acoustic sensor for chemical mechanical polishing |
Family Cites Families (15)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2002254302A (ja) * | 2001-02-23 | 2002-09-10 | Mitsubishi Materials Silicon Corp | 厚さ測定装置付き平面研磨装置 |
| JP2005517290A (ja) * | 2002-02-06 | 2005-06-09 | アプライド マテリアルズ インコーポレイテッド | 渦電流モニタリングシステムを備えた化学機械的研磨の為の方法及び装置 |
| US20040248415A1 (en) * | 2002-02-20 | 2004-12-09 | Yutaka Wada | Polishing method and polishing liquid |
| CN1445060A (zh) * | 2002-03-07 | 2003-10-01 | 株式会社荏原制作所 | 抛光装置 |
| CN100349267C (zh) * | 2002-11-27 | 2007-11-14 | 东洋橡胶工业株式会社 | 研磨垫及半导体器件的制造方法 |
| US20050173259A1 (en) * | 2004-02-06 | 2005-08-11 | Applied Materials, Inc. | Endpoint system for electro-chemical mechanical polishing |
| JP4451111B2 (ja) * | 2003-10-20 | 2010-04-14 | 株式会社荏原製作所 | 渦電流センサ |
| US7354334B1 (en) * | 2004-05-07 | 2008-04-08 | Applied Materials, Inc. | Reducing polishing pad deformation |
| KR101423579B1 (ko) * | 2005-08-22 | 2014-07-25 | 어플라이드 머티어리얼스, 인코포레이티드 | 화학적 기계적 폴리싱의 스펙트럼 기반 모니터링을 위한 장치 및 방법 |
| JP5361299B2 (ja) * | 2008-09-12 | 2013-12-04 | 株式会社東京精密 | 研磨終了予測・検出方法とその装置 |
| JP5730747B2 (ja) | 2010-12-10 | 2015-06-10 | 株式会社荏原製作所 | 渦電流センサ並びに研磨方法および装置 |
| CN106239354A (zh) * | 2010-09-30 | 2016-12-21 | 内克斯普拉纳公司 | 用于涡电流终点检测的抛光垫 |
| JP6196858B2 (ja) * | 2012-09-24 | 2017-09-13 | 株式会社荏原製作所 | 研磨方法および研磨装置 |
| CN103084968A (zh) * | 2013-02-27 | 2013-05-08 | 上海华力微电子有限公司 | 研磨终点探测方法、装置及研磨机台 |
| JP2016087780A (ja) * | 2014-10-31 | 2016-05-23 | 株式会社荏原製作所 | 研磨装置および研磨方法 |
-
2016
- 2016-08-10 JP JP2016157717A patent/JP2017064899A/ja active Pending
- 2016-09-15 SG SG10201607697VA patent/SG10201607697VA/en unknown
- 2016-09-22 KR KR1020160121233A patent/KR20170039565A/ko not_active Ceased
- 2016-09-29 TW TW105131245A patent/TWI719056B/zh active
- 2016-09-29 CN CN201610866058.3A patent/CN106863104A/zh active Pending
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