TWI719056B - 研磨裝置 - Google Patents

研磨裝置 Download PDF

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Publication number
TWI719056B
TWI719056B TW105131245A TW105131245A TWI719056B TW I719056 B TWI719056 B TW I719056B TW 105131245 A TW105131245 A TW 105131245A TW 105131245 A TW105131245 A TW 105131245A TW I719056 B TWI719056 B TW I719056B
Authority
TW
Taiwan
Prior art keywords
polishing
polishing pad
stage
protruding member
eddy current
Prior art date
Application number
TW105131245A
Other languages
English (en)
Chinese (zh)
Other versions
TW201720582A (zh
Inventor
中村顕
Original Assignee
荏原製作所股份有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 荏原製作所股份有限公司 filed Critical 荏原製作所股份有限公司
Publication of TW201720582A publication Critical patent/TW201720582A/zh
Application granted granted Critical
Publication of TWI719056B publication Critical patent/TWI719056B/zh

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Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/005—Control means for lapping machines or devices
    • B24B37/013—Devices or means for detecting lapping completion
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/11—Lapping tools
    • B24B37/20—Lapping pads for working plane surfaces
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/34—Accessories
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B49/00—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation
    • B24B49/10—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation involving electrical means
    • B24B49/105—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation involving electrical means using eddy currents
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P52/00—Grinding, lapping or polishing of wafers, substrates or parts of devices

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
TW105131245A 2015-10-01 2016-09-29 研磨裝置 TWI719056B (zh)

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
JP2015195823 2015-10-01
JP2015-195823 2015-10-01
JP2016157717A JP2017064899A (ja) 2015-10-01 2016-08-10 研磨装置
JP2016-157717 2016-08-10

Publications (2)

Publication Number Publication Date
TW201720582A TW201720582A (zh) 2017-06-16
TWI719056B true TWI719056B (zh) 2021-02-21

Family

ID=58491133

Family Applications (1)

Application Number Title Priority Date Filing Date
TW105131245A TWI719056B (zh) 2015-10-01 2016-09-29 研磨裝置

Country Status (5)

Country Link
JP (1) JP2017064899A (enExample)
KR (1) KR20170039565A (enExample)
CN (1) CN106863104A (enExample)
SG (1) SG10201607697VA (enExample)
TW (1) TWI719056B (enExample)

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN109249304B (zh) * 2018-09-21 2019-09-27 西安理工大学 一种平面研磨精密定尺寸装置及控制方法
CN110625519B (zh) * 2019-08-26 2021-08-03 苏州冠博控制科技有限公司 一种高精度晶圆研磨机
CN114367919A (zh) * 2020-10-14 2022-04-19 长鑫存储技术有限公司 研磨控制方法、装置及存储介质
CN117615879A (zh) * 2021-07-06 2024-02-27 应用材料公司 用于化学机械抛光的声学传感器的耦合
TWI879629B (zh) 2021-07-06 2025-04-01 美商應用材料股份有限公司 用於化學機械拋光之包含聲學窗口的拋光墊、包含其之化學機械拋光設備及製造其之方法

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20050173259A1 (en) * 2004-02-06 2005-08-11 Applied Materials, Inc. Endpoint system for electro-chemical mechanical polishing
CN100369210C (zh) * 2002-02-20 2008-02-13 株式会社荏原制作所 抛光方法
CN103659575A (zh) * 2012-09-24 2014-03-26 株式会社荏原制作所 研磨方法及研磨装置

Family Cites Families (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2002254302A (ja) * 2001-02-23 2002-09-10 Mitsubishi Materials Silicon Corp 厚さ測定装置付き平面研磨装置
WO2003066284A1 (en) * 2002-02-06 2003-08-14 Applied Materials, Inc. Method and apparatus for chemical mechanical polishing with an eddy current monitoring system
CN1445060A (zh) * 2002-03-07 2003-10-01 株式会社荏原制作所 抛光装置
CN100349267C (zh) * 2002-11-27 2007-11-14 东洋橡胶工业株式会社 研磨垫及半导体器件的制造方法
JP4451111B2 (ja) * 2003-10-20 2010-04-14 株式会社荏原製作所 渦電流センサ
US7354334B1 (en) * 2004-05-07 2008-04-08 Applied Materials, Inc. Reducing polishing pad deformation
CN102626895B (zh) * 2005-08-22 2016-05-25 应用材料公司 基于光谱的监测化学机械研磨的装置及方法
JP5361299B2 (ja) * 2008-09-12 2013-12-04 株式会社東京精密 研磨終了予測・検出方法とその装置
JP5730747B2 (ja) 2010-12-10 2015-06-10 株式会社荏原製作所 渦電流センサ並びに研磨方法および装置
KR101495143B1 (ko) * 2010-09-30 2015-02-24 넥스플래너 코퍼레이션 와전류 종료­시점 검출을 위한 연마 패드를 제조하는 방법
CN103084968A (zh) * 2013-02-27 2013-05-08 上海华力微电子有限公司 研磨终点探测方法、装置及研磨机台
JP2016087780A (ja) * 2014-10-31 2016-05-23 株式会社荏原製作所 研磨装置および研磨方法

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN100369210C (zh) * 2002-02-20 2008-02-13 株式会社荏原制作所 抛光方法
US20050173259A1 (en) * 2004-02-06 2005-08-11 Applied Materials, Inc. Endpoint system for electro-chemical mechanical polishing
CN103659575A (zh) * 2012-09-24 2014-03-26 株式会社荏原制作所 研磨方法及研磨装置

Also Published As

Publication number Publication date
KR20170039565A (ko) 2017-04-11
JP2017064899A (ja) 2017-04-06
CN106863104A (zh) 2017-06-20
TW201720582A (zh) 2017-06-16
SG10201607697VA (en) 2017-05-30

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