SG10201607697VA - Polishing apparatus - Google Patents

Polishing apparatus

Info

Publication number
SG10201607697VA
SG10201607697VA SG10201607697VA SG10201607697VA SG10201607697VA SG 10201607697V A SG10201607697V A SG 10201607697VA SG 10201607697V A SG10201607697V A SG 10201607697VA SG 10201607697V A SG10201607697V A SG 10201607697VA SG 10201607697V A SG10201607697V A SG 10201607697VA
Authority
SG
Singapore
Prior art keywords
polishing apparatus
polishing
Prior art date
Application number
SG10201607697VA
Other languages
English (en)
Inventor
Akira Nakamura
Original Assignee
Ebara Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Ebara Corp filed Critical Ebara Corp
Publication of SG10201607697VA publication Critical patent/SG10201607697VA/en

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/005—Control means for lapping machines or devices
    • B24B37/013—Devices or means for detecting lapping completion
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/11—Lapping tools
    • B24B37/20—Lapping pads for working plane surfaces
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/34—Accessories
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B49/00—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation
    • B24B49/10—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation involving electrical means
    • B24B49/105—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation involving electrical means using eddy currents
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P52/00—Grinding, lapping or polishing of wafers, substrates or parts of devices

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
SG10201607697VA 2015-10-01 2016-09-15 Polishing apparatus SG10201607697VA (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2015195823 2015-10-01
JP2016157717A JP2017064899A (ja) 2015-10-01 2016-08-10 研磨装置

Publications (1)

Publication Number Publication Date
SG10201607697VA true SG10201607697VA (en) 2017-05-30

Family

ID=58491133

Family Applications (1)

Application Number Title Priority Date Filing Date
SG10201607697VA SG10201607697VA (en) 2015-10-01 2016-09-15 Polishing apparatus

Country Status (5)

Country Link
JP (1) JP2017064899A (enExample)
KR (1) KR20170039565A (enExample)
CN (1) CN106863104A (enExample)
SG (1) SG10201607697VA (enExample)
TW (1) TWI719056B (enExample)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN109249304B (zh) * 2018-09-21 2019-09-27 西安理工大学 一种平面研磨精密定尺寸装置及控制方法
CN110625519B (zh) * 2019-08-26 2021-08-03 苏州冠博控制科技有限公司 一种高精度晶圆研磨机
CN114367919A (zh) * 2020-10-14 2022-04-19 长鑫存储技术有限公司 研磨控制方法、装置及存储介质
WO2023283525A1 (en) * 2021-07-06 2023-01-12 Applied Materials, Inc. Coupling of acoustic sensor for chemical mechanical polishing

Family Cites Families (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2002254302A (ja) * 2001-02-23 2002-09-10 Mitsubishi Materials Silicon Corp 厚さ測定装置付き平面研磨装置
JP2005517290A (ja) * 2002-02-06 2005-06-09 アプライド　マテリアルズ　インコーポレイテッド 渦電流モニタリングシステムを備えた化学機械的研磨の為の方法及び装置
US20040248415A1 (en) * 2002-02-20 2004-12-09 Yutaka Wada Polishing method and polishing liquid
CN1445060A (zh) * 2002-03-07 2003-10-01 株式会社荏原制作所 抛光装置
CN100349267C (zh) * 2002-11-27 2007-11-14 东洋橡胶工业株式会社 研磨垫及半导体器件的制造方法
US20050173259A1 (en) * 2004-02-06 2005-08-11 Applied Materials, Inc. Endpoint system for electro-chemical mechanical polishing
JP4451111B2 (ja) * 2003-10-20 2010-04-14 株式会社荏原製作所 渦電流センサ
US7354334B1 (en) * 2004-05-07 2008-04-08 Applied Materials, Inc. Reducing polishing pad deformation
KR101423579B1 (ko) * 2005-08-22 2014-07-25 어플라이드 머티어리얼스, 인코포레이티드 화학적 기계적 폴리싱의 스펙트럼 기반 모니터링을 위한 장치 및 방법
JP5361299B2 (ja) * 2008-09-12 2013-12-04 株式会社東京精密 研磨終了予測・検出方法とその装置
JP5730747B2 (ja) 2010-12-10 2015-06-10 株式会社荏原製作所 渦電流センサ並びに研磨方法および装置
CN106239354A (zh) * 2010-09-30 2016-12-21 内克斯普拉纳公司 用于涡电流终点检测的抛光垫
JP6196858B2 (ja) * 2012-09-24 2017-09-13 株式会社荏原製作所 研磨方法および研磨装置
CN103084968A (zh) * 2013-02-27 2013-05-08 上海华力微电子有限公司 研磨终点探测方法、装置及研磨机台
JP2016087780A (ja) * 2014-10-31 2016-05-23 株式会社荏原製作所 研磨装置および研磨方法

Also Published As

Publication number Publication date
KR20170039565A (ko) 2017-04-11
JP2017064899A (ja) 2017-04-06
TW201720582A (zh) 2017-06-16
CN106863104A (zh) 2017-06-20
TWI719056B (zh) 2021-02-21

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