JP2017064899A - 研磨装置 - Google Patents

研磨装置 Download PDF

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Publication number
JP2017064899A
JP2017064899A JP2016157717A JP2016157717A JP2017064899A JP 2017064899 A JP2017064899 A JP 2017064899A JP 2016157717 A JP2016157717 A JP 2016157717A JP 2016157717 A JP2016157717 A JP 2016157717A JP 2017064899 A JP2017064899 A JP 2017064899A
Authority
JP
Japan
Prior art keywords
polishing
eddy current
layer
polishing pad
current sensor
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2016157717A
Other languages
English (en)
Japanese (ja)
Other versions
JP2017064899A5 (enExample
Inventor
顕 中村
Akira Nakamura
顕 中村
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Ebara Corp
Original Assignee
Ebara Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Ebara Corp filed Critical Ebara Corp
Priority to SG10201607697VA priority Critical patent/SG10201607697VA/en
Priority to KR1020160121233A priority patent/KR20170039565A/ko
Priority to TW105131245A priority patent/TWI719056B/zh
Priority to CN201610866058.3A priority patent/CN106863104A/zh
Priority to US15/283,212 priority patent/US10160089B2/en
Publication of JP2017064899A publication Critical patent/JP2017064899A/ja
Publication of JP2017064899A5 publication Critical patent/JP2017064899A5/ja
Pending legal-status Critical Current

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Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/005—Control means for lapping machines or devices
    • B24B37/013—Devices or means for detecting lapping completion
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/11—Lapping tools
    • B24B37/20—Lapping pads for working plane surfaces
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/34—Accessories
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B49/00—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation
    • B24B49/10—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation involving electrical means
    • B24B49/105—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation involving electrical means using eddy currents
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P52/00—Grinding, lapping or polishing of wafers, substrates or parts of devices

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  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
JP2016157717A 2015-10-01 2016-08-10 研磨装置 Pending JP2017064899A (ja)

Priority Applications (5)

Application Number Priority Date Filing Date Title
SG10201607697VA SG10201607697VA (en) 2015-10-01 2016-09-15 Polishing apparatus
KR1020160121233A KR20170039565A (ko) 2015-10-01 2016-09-22 연마 장치
TW105131245A TWI719056B (zh) 2015-10-01 2016-09-29 研磨裝置
CN201610866058.3A CN106863104A (zh) 2015-10-01 2016-09-29 研磨装置
US15/283,212 US10160089B2 (en) 2015-10-01 2016-09-30 Polishing apparatus

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2015195823 2015-10-01
JP2015195823 2015-10-01

Publications (2)

Publication Number Publication Date
JP2017064899A true JP2017064899A (ja) 2017-04-06
JP2017064899A5 JP2017064899A5 (enExample) 2019-09-12

Family

ID=58491133

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2016157717A Pending JP2017064899A (ja) 2015-10-01 2016-08-10 研磨装置

Country Status (5)

Country Link
JP (1) JP2017064899A (enExample)
KR (1) KR20170039565A (enExample)
CN (1) CN106863104A (enExample)
SG (1) SG10201607697VA (enExample)
TW (1) TWI719056B (enExample)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN109249304B (zh) * 2018-09-21 2019-09-27 西安理工大学 一种平面研磨精密定尺寸装置及控制方法
CN110625519B (zh) * 2019-08-26 2021-08-03 苏州冠博控制科技有限公司 一种高精度晶圆研磨机
CN114367919A (zh) * 2020-10-14 2022-04-19 长鑫存储技术有限公司 研磨控制方法、装置及存储介质
WO2023283525A1 (en) * 2021-07-06 2023-01-12 Applied Materials, Inc. Coupling of acoustic sensor for chemical mechanical polishing

Citations (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2002254302A (ja) * 2001-02-23 2002-09-10 Mitsubishi Materials Silicon Corp 厚さ測定装置付き平面研磨装置
JP2005517290A (ja) * 2002-02-06 2005-06-09 アプライド　マテリアルズ　インコーポレイテッド 渦電流モニタリングシステムを備えた化学機械的研磨の為の方法及び装置
JP2007263981A (ja) * 2003-10-20 2007-10-11 Ebara Corp 渦電流センサ
US20080020690A1 (en) * 2004-05-07 2008-01-24 Applied Materials, Inc. Reducing polishing pad deformation
JP2010067918A (ja) * 2008-09-12 2010-03-25 Tokyo Seimitsu Co Ltd 研磨終了予測・検出方法とその装置
JP2013539233A (ja) * 2010-09-30 2013-10-17 ネクスプラナー コーポレイション 渦電流終点検出のための研磨パッド
JP2015079984A (ja) * 2005-08-22 2015-04-23 アプライド マテリアルズ インコーポレイテッドＡｐｐｌｉｅｄ Ｍａｔｅｒｉａｌｓ，Ｉｎｃｏｒｐｏｒａｔｅｄ 化学機械的研磨のスペクトルに基づく監視のための装置および方法
JP2016087780A (ja) * 2014-10-31 2016-05-23 株式会社荏原製作所 研磨装置および研磨方法

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20040248415A1 (en) * 2002-02-20 2004-12-09 Yutaka Wada Polishing method and polishing liquid
CN1445060A (zh) * 2002-03-07 2003-10-01 株式会社荏原制作所 抛光装置
CN100349267C (zh) * 2002-11-27 2007-11-14 东洋橡胶工业株式会社 研磨垫及半导体器件的制造方法
US20050173259A1 (en) * 2004-02-06 2005-08-11 Applied Materials, Inc. Endpoint system for electro-chemical mechanical polishing
JP5730747B2 (ja) 2010-12-10 2015-06-10 株式会社荏原製作所 渦電流センサ並びに研磨方法および装置
JP6196858B2 (ja) * 2012-09-24 2017-09-13 株式会社荏原製作所 研磨方法および研磨装置
CN103084968A (zh) * 2013-02-27 2013-05-08 上海华力微电子有限公司 研磨终点探测方法、装置及研磨机台

Patent Citations (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2002254302A (ja) * 2001-02-23 2002-09-10 Mitsubishi Materials Silicon Corp 厚さ測定装置付き平面研磨装置
JP2005517290A (ja) * 2002-02-06 2005-06-09 アプライド　マテリアルズ　インコーポレイテッド 渦電流モニタリングシステムを備えた化学機械的研磨の為の方法及び装置
JP2007263981A (ja) * 2003-10-20 2007-10-11 Ebara Corp 渦電流センサ
US20080020690A1 (en) * 2004-05-07 2008-01-24 Applied Materials, Inc. Reducing polishing pad deformation
JP2015079984A (ja) * 2005-08-22 2015-04-23 アプライド マテリアルズ インコーポレイテッドＡｐｐｌｉｅｄ Ｍａｔｅｒｉａｌｓ，Ｉｎｃｏｒｐｏｒａｔｅｄ 化学機械的研磨のスペクトルに基づく監視のための装置および方法
JP2010067918A (ja) * 2008-09-12 2010-03-25 Tokyo Seimitsu Co Ltd 研磨終了予測・検出方法とその装置
JP2013539233A (ja) * 2010-09-30 2013-10-17 ネクスプラナー コーポレイション 渦電流終点検出のための研磨パッド
JP2016087780A (ja) * 2014-10-31 2016-05-23 株式会社荏原製作所 研磨装置および研磨方法

Also Published As

Publication number Publication date
KR20170039565A (ko) 2017-04-11
TW201720582A (zh) 2017-06-16
SG10201607697VA (en) 2017-05-30
CN106863104A (zh) 2017-06-20
TWI719056B (zh) 2021-02-21

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