KR20170039565A - 연마 장치 - Google Patents

연마 장치 Download PDF

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Publication number
KR20170039565A
KR20170039565A KR1020160121233A KR20160121233A KR20170039565A KR 20170039565 A KR20170039565 A KR 20170039565A KR 1020160121233 A KR1020160121233 A KR 1020160121233A KR 20160121233 A KR20160121233 A KR 20160121233A KR 20170039565 A KR20170039565 A KR 20170039565A
Authority
KR
South Korea
Prior art keywords
polishing
polishing pad
eddy current
current sensor
layer
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
KR1020160121233A
Other languages
English (en)
Korean (ko)
Inventor
아키라 나카무라
Original Assignee
가부시키가이샤 에바라 세이사꾸쇼
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 가부시키가이샤 에바라 세이사꾸쇼 filed Critical 가부시키가이샤 에바라 세이사꾸쇼
Publication of KR20170039565A publication Critical patent/KR20170039565A/ko
Ceased legal-status Critical Current

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Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/005—Control means for lapping machines or devices
    • B24B37/013—Devices or means for detecting lapping completion
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/11—Lapping tools
    • B24B37/20—Lapping pads for working plane surfaces
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/34—Accessories
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B49/00—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation
    • B24B49/10—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation involving electrical means
    • B24B49/105—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation involving electrical means using eddy currents
    • H01L21/304—
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P52/00—Grinding, lapping or polishing of wafers, substrates or parts of devices

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  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
KR1020160121233A 2015-10-01 2016-09-22 연마 장치 Ceased KR20170039565A (ko)

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
JP2015195823 2015-10-01
JPJP-P-2015-195823 2015-10-01
JP2016157717A JP2017064899A (ja) 2015-10-01 2016-08-10 研磨装置
JPJP-P-2016-157717 2016-08-10

Publications (1)

Publication Number Publication Date
KR20170039565A true KR20170039565A (ko) 2017-04-11

Family

ID=58491133

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020160121233A Ceased KR20170039565A (ko) 2015-10-01 2016-09-22 연마 장치

Country Status (5)

Country Link
JP (1) JP2017064899A (enExample)
KR (1) KR20170039565A (enExample)
CN (1) CN106863104A (enExample)
SG (1) SG10201607697VA (enExample)
TW (1) TWI719056B (enExample)

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN109249304B (zh) * 2018-09-21 2019-09-27 西安理工大学 一种平面研磨精密定尺寸装置及控制方法
CN110625519B (zh) * 2019-08-26 2021-08-03 苏州冠博控制科技有限公司 一种高精度晶圆研磨机
CN114367919A (zh) * 2020-10-14 2022-04-19 长鑫存储技术有限公司 研磨控制方法、装置及存储介质
CN117615879A (zh) * 2021-07-06 2024-02-27 应用材料公司 用于化学机械抛光的声学传感器的耦合
TWI879629B (zh) 2021-07-06 2025-04-01 美商應用材料股份有限公司 用於化學機械拋光之包含聲學窗口的拋光墊、包含其之化學機械拋光設備及製造其之方法

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2012135865A (ja) 2010-12-10 2012-07-19 Ebara Corp 渦電流センサ並びに研磨方法および装置

Family Cites Families (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2002254302A (ja) * 2001-02-23 2002-09-10 Mitsubishi Materials Silicon Corp 厚さ測定装置付き平面研磨装置
WO2003066284A1 (en) * 2002-02-06 2003-08-14 Applied Materials, Inc. Method and apparatus for chemical mechanical polishing with an eddy current monitoring system
WO2003071592A1 (en) * 2002-02-20 2003-08-28 Ebara Corporation Method and device for polishing
CN1445060A (zh) * 2002-03-07 2003-10-01 株式会社荏原制作所 抛光装置
CN100349267C (zh) * 2002-11-27 2007-11-14 东洋橡胶工业株式会社 研磨垫及半导体器件的制造方法
US20050173259A1 (en) * 2004-02-06 2005-08-11 Applied Materials, Inc. Endpoint system for electro-chemical mechanical polishing
JP4451111B2 (ja) * 2003-10-20 2010-04-14 株式会社荏原製作所 渦電流センサ
US7354334B1 (en) * 2004-05-07 2008-04-08 Applied Materials, Inc. Reducing polishing pad deformation
CN102626895B (zh) * 2005-08-22 2016-05-25 应用材料公司 基于光谱的监测化学机械研磨的装置及方法
JP5361299B2 (ja) * 2008-09-12 2013-12-04 株式会社東京精密 研磨終了予測・検出方法とその装置
KR101495143B1 (ko) * 2010-09-30 2015-02-24 넥스플래너 코퍼레이션 와전류 종료­시점 검출을 위한 연마 패드를 제조하는 방법
JP6196858B2 (ja) * 2012-09-24 2017-09-13 株式会社荏原製作所 研磨方法および研磨装置
CN103084968A (zh) * 2013-02-27 2013-05-08 上海华力微电子有限公司 研磨终点探测方法、装置及研磨机台
JP2016087780A (ja) * 2014-10-31 2016-05-23 株式会社荏原製作所 研磨装置および研磨方法

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2012135865A (ja) 2010-12-10 2012-07-19 Ebara Corp 渦電流センサ並びに研磨方法および装置

Also Published As

Publication number Publication date
TWI719056B (zh) 2021-02-21
JP2017064899A (ja) 2017-04-06
CN106863104A (zh) 2017-06-20
TW201720582A (zh) 2017-06-16
SG10201607697VA (en) 2017-05-30

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