CN106863104A - 研磨装置 - Google Patents

研磨装置 Download PDF

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Publication number
CN106863104A
CN106863104A CN201610866058.3A CN201610866058A CN106863104A CN 106863104 A CN106863104 A CN 106863104A CN 201610866058 A CN201610866058 A CN 201610866058A CN 106863104 A CN106863104 A CN 106863104A
Authority
CN
China
Prior art keywords
polishing
grinding
polishing pad
layer
protruding member
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CN201610866058.3A
Other languages
English (en)
Chinese (zh)
Inventor
中村显
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Ebara Corp
Original Assignee
Ebara Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Ebara Corp filed Critical Ebara Corp
Publication of CN106863104A publication Critical patent/CN106863104A/zh
Pending legal-status Critical Current

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/005—Control means for lapping machines or devices
    • B24B37/013—Devices or means for detecting lapping completion
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/11—Lapping tools
    • B24B37/20—Lapping pads for working plane surfaces
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/34—Accessories
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B49/00—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation
    • B24B49/10—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation involving electrical means
    • B24B49/105—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation involving electrical means using eddy currents
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P52/00—Grinding, lapping or polishing of wafers, substrates or parts of devices

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
CN201610866058.3A 2015-10-01 2016-09-29 研磨装置 Pending CN106863104A (zh)

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
JP2015-195823 2015-10-01
JP2015195823 2015-10-01
JP2016157717A JP2017064899A (ja) 2015-10-01 2016-08-10 研磨装置
JP2016-157717 2016-08-10

Publications (1)

Publication Number Publication Date
CN106863104A true CN106863104A (zh) 2017-06-20

Family

ID=58491133

Family Applications (1)

Application Number Title Priority Date Filing Date
CN201610866058.3A Pending CN106863104A (zh) 2015-10-01 2016-09-29 研磨装置

Country Status (5)

Country Link
JP (1) JP2017064899A (enExample)
KR (1) KR20170039565A (enExample)
CN (1) CN106863104A (enExample)
SG (1) SG10201607697VA (enExample)
TW (1) TWI719056B (enExample)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN109249304A (zh) * 2018-09-21 2019-01-22 西安理工大学 一种平面研磨精密定尺寸装置及控制方法
CN110625519A (zh) * 2019-08-26 2019-12-31 泉州洛江润美机械科技有限公司 一种高精度晶圆研磨机
WO2022077924A1 (zh) * 2020-10-14 2022-04-21 长鑫存储技术有限公司 研磨控制方法、装置及存储介质

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2023283525A1 (en) * 2021-07-06 2023-01-12 Applied Materials, Inc. Coupling of acoustic sensor for chemical mechanical polishing

Citations (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN1445060A (zh) * 2002-03-07 2003-10-01 株式会社荏原制作所 抛光装置
CN1537324A (zh) * 2002-02-20 2004-10-13 ������������ʽ���� 抛光方法及装置
US20050173259A1 (en) * 2004-02-06 2005-08-11 Applied Materials, Inc. Endpoint system for electro-chemical mechanical polishing
CN1717785A (zh) * 2002-11-27 2006-01-04 东洋橡胶工业株式会社 研磨垫及半导体器件的制造方法
JP2007263981A (ja) * 2003-10-20 2007-10-11 Ebara Corp 渦電流センサ
US20080020690A1 (en) * 2004-05-07 2008-01-24 Applied Materials, Inc. Reducing polishing pad deformation
JP2010067918A (ja) * 2008-09-12 2010-03-25 Tokyo Seimitsu Co Ltd 研磨終了予測・検出方法とその装置
CN103084968A (zh) * 2013-02-27 2013-05-08 上海华力微电子有限公司 研磨终点探测方法、装置及研磨机台
CN103659575A (zh) * 2012-09-24 2014-03-26 株式会社荏原制作所 研磨方法及研磨装置

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2002254302A (ja) * 2001-02-23 2002-09-10 Mitsubishi Materials Silicon Corp 厚さ測定装置付き平面研磨装置
JP2005517290A (ja) * 2002-02-06 2005-06-09 アプライド　マテリアルズ　インコーポレイテッド 渦電流モニタリングシステムを備えた化学機械的研磨の為の方法及び装置
KR101423579B1 (ko) * 2005-08-22 2014-07-25 어플라이드 머티어리얼스, 인코포레이티드 화학적 기계적 폴리싱의 스펙트럼 기반 모니터링을 위한 장치 및 방법
JP5730747B2 (ja) 2010-12-10 2015-06-10 株式会社荏原製作所 渦電流センサ並びに研磨方法および装置
CN106239354A (zh) * 2010-09-30 2016-12-21 内克斯普拉纳公司 用于涡电流终点检测的抛光垫
JP2016087780A (ja) * 2014-10-31 2016-05-23 株式会社荏原製作所 研磨装置および研磨方法

Patent Citations (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN1537324A (zh) * 2002-02-20 2004-10-13 ������������ʽ���� 抛光方法及装置
CN1445060A (zh) * 2002-03-07 2003-10-01 株式会社荏原制作所 抛光装置
CN1717785A (zh) * 2002-11-27 2006-01-04 东洋橡胶工业株式会社 研磨垫及半导体器件的制造方法
CN100349267C (zh) * 2002-11-27 2007-11-14 东洋橡胶工业株式会社 研磨垫及半导体器件的制造方法
JP2007263981A (ja) * 2003-10-20 2007-10-11 Ebara Corp 渦電流センサ
US20050173259A1 (en) * 2004-02-06 2005-08-11 Applied Materials, Inc. Endpoint system for electro-chemical mechanical polishing
US20080020690A1 (en) * 2004-05-07 2008-01-24 Applied Materials, Inc. Reducing polishing pad deformation
JP2010067918A (ja) * 2008-09-12 2010-03-25 Tokyo Seimitsu Co Ltd 研磨終了予測・検出方法とその装置
CN103659575A (zh) * 2012-09-24 2014-03-26 株式会社荏原制作所 研磨方法及研磨装置
CN103084968A (zh) * 2013-02-27 2013-05-08 上海华力微电子有限公司 研磨终点探测方法、装置及研磨机台

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN109249304A (zh) * 2018-09-21 2019-01-22 西安理工大学 一种平面研磨精密定尺寸装置及控制方法
CN109249304B (zh) * 2018-09-21 2019-09-27 西安理工大学 一种平面研磨精密定尺寸装置及控制方法
CN110625519A (zh) * 2019-08-26 2019-12-31 泉州洛江润美机械科技有限公司 一种高精度晶圆研磨机
CN110625519B (zh) * 2019-08-26 2021-08-03 苏州冠博控制科技有限公司 一种高精度晶圆研磨机
WO2022077924A1 (zh) * 2020-10-14 2022-04-21 长鑫存储技术有限公司 研磨控制方法、装置及存储介质

Also Published As

Publication number Publication date
KR20170039565A (ko) 2017-04-11
JP2017064899A (ja) 2017-04-06
TW201720582A (zh) 2017-06-16
SG10201607697VA (en) 2017-05-30
TWI719056B (zh) 2021-02-21

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Application publication date: 20170620

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