JP2014223692A5 - - Google Patents

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Publication number
JP2014223692A5
JP2014223692A5 JP2013103719A JP2013103719A JP2014223692A5 JP 2014223692 A5 JP2014223692 A5 JP 2014223692A5 JP 2013103719 A JP2013103719 A JP 2013103719A JP 2013103719 A JP2013103719 A JP 2013103719A JP 2014223692 A5 JP2014223692 A5 JP 2014223692A5
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JP
Japan
Prior art keywords
workpiece
polishing
less
template
filler
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP2013103719A
Other languages
English (en)
Japanese (ja)
Other versions
JP5870960B2 (ja
JP2014223692A (ja
Filing date
Publication date
Application filed filed Critical
Priority claimed from JP2013103719A external-priority patent/JP5870960B2/ja
Priority to JP2013103719A priority Critical patent/JP5870960B2/ja
Priority to CN201480026546.2A priority patent/CN105189045B/zh
Priority to SG11201509094YA priority patent/SG11201509094YA/en
Priority to KR1020157032613A priority patent/KR102192288B1/ko
Priority to DE112014002107.5T priority patent/DE112014002107T5/de
Priority to US14/787,659 priority patent/US20160082567A1/en
Priority to PCT/JP2014/002066 priority patent/WO2014185003A1/ja
Priority to TW103114539A priority patent/TWI597127B/zh
Publication of JP2014223692A publication Critical patent/JP2014223692A/ja
Publication of JP2014223692A5 publication Critical patent/JP2014223692A5/ja
Publication of JP5870960B2 publication Critical patent/JP5870960B2/ja
Application granted granted Critical
Priority to US16/123,383 priority patent/US20190001463A1/en
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

JP2013103719A 2013-05-16 2013-05-16 ワークの研磨装置 Active JP5870960B2 (ja)

Priority Applications (9)

Application Number Priority Date Filing Date Title
JP2013103719A JP5870960B2 (ja) 2013-05-16 2013-05-16 ワークの研磨装置
US14/787,659 US20160082567A1 (en) 2013-05-16 2014-04-10 Workpiece polishing apparatus
PCT/JP2014/002066 WO2014185003A1 (ja) 2013-05-16 2014-04-10 ワークの研磨装置
SG11201509094YA SG11201509094YA (en) 2013-05-16 2014-04-10 Workpiece polishing apparatus
KR1020157032613A KR102192288B1 (ko) 2013-05-16 2014-04-10 워크의 연마장치
DE112014002107.5T DE112014002107T5 (de) 2013-05-16 2014-04-10 Werkstück-Poliergerät
CN201480026546.2A CN105189045B (zh) 2013-05-16 2014-04-10 工件的研磨装置
TW103114539A TWI597127B (zh) 2013-05-16 2014-04-22 Workpiece grinding device
US16/123,383 US20190001463A1 (en) 2013-05-16 2018-09-06 Workpiece polishing apparatus

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2013103719A JP5870960B2 (ja) 2013-05-16 2013-05-16 ワークの研磨装置

Publications (3)

Publication Number Publication Date
JP2014223692A JP2014223692A (ja) 2014-12-04
JP2014223692A5 true JP2014223692A5 (enExample) 2015-12-17
JP5870960B2 JP5870960B2 (ja) 2016-03-01

Family

ID=51897996

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2013103719A Active JP5870960B2 (ja) 2013-05-16 2013-05-16 ワークの研磨装置

Country Status (8)

Country Link
US (1) US20160082567A1 (enExample)
JP (1) JP5870960B2 (enExample)
KR (1) KR102192288B1 (enExample)
CN (1) CN105189045B (enExample)
DE (1) DE112014002107T5 (enExample)
SG (1) SG11201509094YA (enExample)
TW (1) TWI597127B (enExample)
WO (1) WO2014185003A1 (enExample)

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US10341371B2 (en) * 2016-08-31 2019-07-02 Nicira, Inc. Identifying and handling threats to data compute nodes in public cloud
JP6312229B1 (ja) * 2017-06-12 2018-04-18 信越半導体株式会社 研磨方法及び研磨装置
JP7139126B2 (ja) * 2018-03-16 2022-09-20 富士紡ホールディングス株式会社 保持具及びその製造方法
CN110394706A (zh) * 2019-07-25 2019-11-01 西安奕斯伟硅片技术有限公司 一种硅片处理装置及方法
CN111644977A (zh) * 2020-07-17 2020-09-11 中国科学院微电子研究所 研磨用固定环以及研磨头

Family Cites Families (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5267418A (en) * 1992-05-27 1993-12-07 International Business Machines Corporation Confined water fixture for holding wafers undergoing chemical-mechanical polishing
TW400567B (en) * 1995-04-10 2000-08-01 Matsushita Electric Industrial Co Ltd The polishing device and its polishing method for the substrate
JP3615592B2 (ja) 1995-07-11 2005-02-02 不二越機械工業株式会社 研磨装置
JPH1190820A (ja) 1997-09-12 1999-04-06 Shin Etsu Handotai Co Ltd ウエーハ研磨用テンプレートと該テンプレートを利用したウエーハ剥がし方法
US6899610B2 (en) * 2001-06-01 2005-05-31 Raytech Innovative Solutions, Inc. Retaining ring with wear pad for use in chemical mechanical planarization
US6893327B2 (en) * 2001-06-04 2005-05-17 Multi Planar Technologies, Inc. Chemical mechanical polishing apparatus and method having a retaining ring with a contoured surface
JP2005169568A (ja) * 2003-12-11 2005-06-30 Mitsui Chemicals Inc リテーナリング及びそれを用いた研磨装置
US7086939B2 (en) * 2004-03-19 2006-08-08 Saint-Gobain Performance Plastics Corporation Chemical mechanical polishing retaining ring with integral polymer backing
WO2006038259A1 (ja) * 2004-09-30 2006-04-13 Renesas Technology Corp. 半導体装置の製造方法
KR20070118277A (ko) * 2005-04-12 2007-12-14 니혼 세이미츠 덴시 가부시키가이샤 Ｃｍｐ 장치용 리테이너링과 그 제조방법 및 ｃｍｐ 장치
JP2008543058A (ja) * 2005-05-24 2008-11-27 インテグリス・インコーポレーテッド Ｃｍｐ保持リング
JP4534165B2 (ja) * 2006-12-18 2010-09-01 エルピーダメモリ株式会社 半導体装置の製造装置及び、半導体装置の製造方法
JP5615589B2 (ja) * 2010-05-07 2014-10-29 富士紡ホールディングス株式会社 枠材および枠材を有する保持具
JP5683398B2 (ja) * 2011-07-06 2015-03-11 株式会社クレハ 研磨装置用ワークピース保持リング

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