SG11201509094YA - Workpiece polishing apparatus - Google Patents

Workpiece polishing apparatus

Info

Publication number
SG11201509094YA
SG11201509094YA SG11201509094YA SG11201509094YA SG11201509094YA SG 11201509094Y A SG11201509094Y A SG 11201509094YA SG 11201509094Y A SG11201509094Y A SG 11201509094YA SG 11201509094Y A SG11201509094Y A SG 11201509094YA SG 11201509094Y A SG11201509094Y A SG 11201509094YA
Authority
SG
Singapore
Prior art keywords
polishing apparatus
workpiece polishing
workpiece
polishing
Prior art date
Application number
SG11201509094YA
Other languages
English (en)
Inventor
Hiromasa Hashimoto
Masanao Sasaki
Original Assignee
Shinetsu Handotai Kk
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Shinetsu Handotai Kk filed Critical Shinetsu Handotai Kk
Publication of SG11201509094YA publication Critical patent/SG11201509094YA/en

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/11—Lapping tools
    • B24B37/20—Lapping pads for working plane surfaces
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/27—Work carriers
    • B24B37/30—Work carriers for single side lapping of plane surfaces
    • B24B37/32—Retaining rings
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P90/00—Preparation of wafers not covered by a single main group of this subclass, e.g. wafer reinforcement
    • H10P90/12—Preparing bulk and homogeneous wafers
    • H10P90/129—Preparing bulk and homogeneous wafers by polishing

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
SG11201509094YA 2013-05-16 2014-04-10 Workpiece polishing apparatus SG11201509094YA (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2013103719A JP5870960B2 (ja) 2013-05-16 2013-05-16 ワークの研磨装置
PCT/JP2014/002066 WO2014185003A1 (ja) 2013-05-16 2014-04-10 ワークの研磨装置

Publications (1)

Publication Number Publication Date
SG11201509094YA true SG11201509094YA (en) 2015-12-30

Family

ID=51897996

Family Applications (1)

Application Number Title Priority Date Filing Date
SG11201509094YA SG11201509094YA (en) 2013-05-16 2014-04-10 Workpiece polishing apparatus

Country Status (8)

Country Link
US (1) US20160082567A1 (enExample)
JP (1) JP5870960B2 (enExample)
KR (1) KR102192288B1 (enExample)
CN (1) CN105189045B (enExample)
DE (1) DE112014002107T5 (enExample)
SG (1) SG11201509094YA (enExample)
TW (1) TWI597127B (enExample)
WO (1) WO2014185003A1 (enExample)

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US10333959B2 (en) * 2016-08-31 2019-06-25 Nicira, Inc. Use of public cloud inventory tags to configure data compute node for logical network
JP6312229B1 (ja) * 2017-06-12 2018-04-18 信越半導体株式会社 研磨方法及び研磨装置
JP7139126B2 (ja) * 2018-03-16 2022-09-20 富士紡ホールディングス株式会社 保持具及びその製造方法
CN110394706A (zh) * 2019-07-25 2019-11-01 西安奕斯伟硅片技术有限公司 一种硅片处理装置及方法
CN111644977A (zh) * 2020-07-17 2020-09-11 中国科学院微电子研究所 研磨用固定环以及研磨头

Family Cites Families (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5267418A (en) * 1992-05-27 1993-12-07 International Business Machines Corporation Confined water fixture for holding wafers undergoing chemical-mechanical polishing
TW400567B (en) * 1995-04-10 2000-08-01 Matsushita Electric Industrial Co Ltd The polishing device and its polishing method for the substrate
JP3615592B2 (ja) * 1995-07-11 2005-02-02 不二越機械工業株式会社 研磨装置
JPH1190820A (ja) 1997-09-12 1999-04-06 Shin Etsu Handotai Co Ltd ウエーハ研磨用テンプレートと該テンプレートを利用したウエーハ剥がし方法
US6899610B2 (en) * 2001-06-01 2005-05-31 Raytech Innovative Solutions, Inc. Retaining ring with wear pad for use in chemical mechanical planarization
US6893327B2 (en) * 2001-06-04 2005-05-17 Multi Planar Technologies, Inc. Chemical mechanical polishing apparatus and method having a retaining ring with a contoured surface
JP2005169568A (ja) * 2003-12-11 2005-06-30 Mitsui Chemicals Inc リテーナリング及びそれを用いた研磨装置
US7086939B2 (en) * 2004-03-19 2006-08-08 Saint-Gobain Performance Plastics Corporation Chemical mechanical polishing retaining ring with integral polymer backing
US20080076253A1 (en) * 2004-09-30 2008-03-27 Hiroshi Fukada Adhesive Sheet,Semiconductor Device,and Process for Producing Semiconductor Device
WO2006114854A1 (ja) * 2005-04-12 2006-11-02 Nippon Seimitsu Denshi Co., Ltd. Ｃｍｐ装置用リテーナリングとその製造方法、および、ｃｍｐ装置
JP2008543058A (ja) * 2005-05-24 2008-11-27 インテグリス・インコーポレーテッド Ｃｍｐ保持リング
JP4534165B2 (ja) * 2006-12-18 2010-09-01 エルピーダメモリ株式会社 半導体装置の製造装置及び、半導体装置の製造方法
JP5615589B2 (ja) * 2010-05-07 2014-10-29 富士紡ホールディングス株式会社 枠材および枠材を有する保持具
JP5683398B2 (ja) * 2011-07-06 2015-03-11 株式会社クレハ 研磨装置用ワークピース保持リング

Also Published As

Publication number Publication date
TW201505762A (zh) 2015-02-16
JP5870960B2 (ja) 2016-03-01
DE112014002107T5 (de) 2016-01-14
KR20160008550A (ko) 2016-01-22
US20160082567A1 (en) 2016-03-24
JP2014223692A (ja) 2014-12-04
WO2014185003A1 (ja) 2014-11-20
CN105189045B (zh) 2017-05-10
KR102192288B1 (ko) 2020-12-17
TWI597127B (zh) 2017-09-01
CN105189045A (zh) 2015-12-23

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