JP5870960B2 - ワークの研磨装置 - Google Patents

ワークの研磨装置 Download PDF

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Publication number
JP5870960B2
JP5870960B2 JP2013103719A JP2013103719A JP5870960B2 JP 5870960 B2 JP5870960 B2 JP 5870960B2 JP 2013103719 A JP2013103719 A JP 2013103719A JP 2013103719 A JP2013103719 A JP 2013103719A JP 5870960 B2 JP5870960 B2 JP 5870960B2
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JP
Japan
Prior art keywords
polishing
workpiece
template
abrasive
cloth
Prior art date
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Active
Application number
JP2013103719A
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English (en)
Japanese (ja)
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JP2014223692A5 (enExample
JP2014223692A (ja
Inventor
浩昌 橋本
浩昌 橋本
正直 佐々木
正直 佐々木
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Shin Etsu Handotai Co Ltd
Original Assignee
Shin Etsu Handotai Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority to JP2013103719A priority Critical patent/JP5870960B2/ja
Application filed by Shin Etsu Handotai Co Ltd filed Critical Shin Etsu Handotai Co Ltd
Priority to SG11201509094YA priority patent/SG11201509094YA/en
Priority to DE112014002107.5T priority patent/DE112014002107T5/de
Priority to US14/787,659 priority patent/US20160082567A1/en
Priority to PCT/JP2014/002066 priority patent/WO2014185003A1/ja
Priority to CN201480026546.2A priority patent/CN105189045B/zh
Priority to KR1020157032613A priority patent/KR102192288B1/ko
Priority to TW103114539A priority patent/TWI597127B/zh
Publication of JP2014223692A publication Critical patent/JP2014223692A/ja
Publication of JP2014223692A5 publication Critical patent/JP2014223692A5/ja
Application granted granted Critical
Publication of JP5870960B2 publication Critical patent/JP5870960B2/ja
Priority to US16/123,383 priority patent/US20190001463A1/en
Active legal-status Critical Current
Anticipated expiration legal-status Critical

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Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/11—Lapping tools
    • B24B37/20—Lapping pads for working plane surfaces
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/27—Work carriers
    • B24B37/30—Work carriers for single side lapping of plane surfaces
    • B24B37/32—Retaining rings
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/02002—Preparing wafers
    • H01L21/02005—Preparing bulk and homogeneous wafers
    • H01L21/02008—Multistep processes
    • H01L21/0201—Specific process step
    • H01L21/02024—Mirror polishing

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
JP2013103719A 2013-05-16 2013-05-16 ワークの研磨装置 Active JP5870960B2 (ja)

Priority Applications (9)

Application Number Priority Date Filing Date Title
JP2013103719A JP5870960B2 (ja) 2013-05-16 2013-05-16 ワークの研磨装置
DE112014002107.5T DE112014002107T5 (de) 2013-05-16 2014-04-10 Werkstück-Poliergerät
US14/787,659 US20160082567A1 (en) 2013-05-16 2014-04-10 Workpiece polishing apparatus
PCT/JP2014/002066 WO2014185003A1 (ja) 2013-05-16 2014-04-10 ワークの研磨装置
CN201480026546.2A CN105189045B (zh) 2013-05-16 2014-04-10 工件的研磨装置
KR1020157032613A KR102192288B1 (ko) 2013-05-16 2014-04-10 워크의 연마장치
SG11201509094YA SG11201509094YA (en) 2013-05-16 2014-04-10 Workpiece polishing apparatus
TW103114539A TWI597127B (zh) 2013-05-16 2014-04-22 Workpiece grinding device
US16/123,383 US20190001463A1 (en) 2013-05-16 2018-09-06 Workpiece polishing apparatus

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2013103719A JP5870960B2 (ja) 2013-05-16 2013-05-16 ワークの研磨装置

Publications (3)

Publication Number Publication Date
JP2014223692A JP2014223692A (ja) 2014-12-04
JP2014223692A5 JP2014223692A5 (enExample) 2015-12-17
JP5870960B2 true JP5870960B2 (ja) 2016-03-01

Family

ID=51897996

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2013103719A Active JP5870960B2 (ja) 2013-05-16 2013-05-16 ワークの研磨装置

Country Status (8)

Country Link
US (1) US20160082567A1 (enExample)
JP (1) JP5870960B2 (enExample)
KR (1) KR102192288B1 (enExample)
CN (1) CN105189045B (enExample)
DE (1) DE112014002107T5 (enExample)
SG (1) SG11201509094YA (enExample)
TW (1) TWI597127B (enExample)
WO (1) WO2014185003A1 (enExample)

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US10333959B2 (en) * 2016-08-31 2019-06-25 Nicira, Inc. Use of public cloud inventory tags to configure data compute node for logical network
JP6312229B1 (ja) * 2017-06-12 2018-04-18 信越半導体株式会社 研磨方法及び研磨装置
JP7139126B2 (ja) * 2018-03-16 2022-09-20 富士紡ホールディングス株式会社 保持具及びその製造方法
CN110394706A (zh) * 2019-07-25 2019-11-01 西安奕斯伟硅片技术有限公司 一种硅片处理装置及方法
CN111644977A (zh) * 2020-07-17 2020-09-11 中国科学院微电子研究所 研磨用固定环以及研磨头

Family Cites Families (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5267418A (en) * 1992-05-27 1993-12-07 International Business Machines Corporation Confined water fixture for holding wafers undergoing chemical-mechanical polishing
TW353203B (en) * 1995-04-10 1999-02-21 Matsushita Electric Industrial Co Ltd Apparatus for holding substrate to be polished
JP3615592B2 (ja) * 1995-07-11 2005-02-02 不二越機械工業株式会社 研磨装置
JPH1190820A (ja) 1997-09-12 1999-04-06 Shin Etsu Handotai Co Ltd ウエーハ研磨用テンプレートと該テンプレートを利用したウエーハ剥がし方法
US6899610B2 (en) * 2001-06-01 2005-05-31 Raytech Innovative Solutions, Inc. Retaining ring with wear pad for use in chemical mechanical planarization
US6893327B2 (en) * 2001-06-04 2005-05-17 Multi Planar Technologies, Inc. Chemical mechanical polishing apparatus and method having a retaining ring with a contoured surface
JP2005169568A (ja) * 2003-12-11 2005-06-30 Mitsui Chemicals Inc リテーナリング及びそれを用いた研磨装置
US7086939B2 (en) * 2004-03-19 2006-08-08 Saint-Gobain Performance Plastics Corporation Chemical mechanical polishing retaining ring with integral polymer backing
CN101023511A (zh) * 2004-09-30 2007-08-22 株式会社瑞萨科技 半导体器件的制造方法
KR20070118277A (ko) * 2005-04-12 2007-12-14 니혼 세이미츠 덴시 가부시키가이샤 Ｃｍｐ 장치용 리테이너링과 그 제조방법 및 ｃｍｐ 장치
US20070224864A1 (en) * 2005-05-24 2007-09-27 John Burns CMP retaining ring
JP4534165B2 (ja) * 2006-12-18 2010-09-01 エルピーダメモリ株式会社 半導体装置の製造装置及び、半導体装置の製造方法
JP5615589B2 (ja) * 2010-05-07 2014-10-29 富士紡ホールディングス株式会社 枠材および枠材を有する保持具
JP5683398B2 (ja) * 2011-07-06 2015-03-11 株式会社クレハ 研磨装置用ワークピース保持リング

Also Published As

Publication number Publication date
KR102192288B1 (ko) 2020-12-17
DE112014002107T5 (de) 2016-01-14
US20160082567A1 (en) 2016-03-24
CN105189045B (zh) 2017-05-10
TWI597127B (zh) 2017-09-01
JP2014223692A (ja) 2014-12-04
TW201505762A (zh) 2015-02-16
WO2014185003A1 (ja) 2014-11-20
KR20160008550A (ko) 2016-01-22
SG11201509094YA (en) 2015-12-30
CN105189045A (zh) 2015-12-23

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