CN105189045B - 工件的研磨装置 - Google Patents

工件的研磨装置 Download PDF

Info

Publication number
CN105189045B
CN105189045B CN201480026546.2A CN201480026546A CN105189045B CN 105189045 B CN105189045 B CN 105189045B CN 201480026546 A CN201480026546 A CN 201480026546A CN 105189045 B CN105189045 B CN 105189045B
Authority
CN
China
Prior art keywords
workpiece
polishing
cloth
abrasive
template
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
CN201480026546.2A
Other languages
English (en)
Chinese (zh)
Other versions
CN105189045A (zh
Inventor
桥本浩昌
佐佐木正直
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Shin Etsu Handotai Co Ltd
Original Assignee
Shin Etsu Handotai Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Shin Etsu Handotai Co Ltd filed Critical Shin Etsu Handotai Co Ltd
Publication of CN105189045A publication Critical patent/CN105189045A/zh
Application granted granted Critical
Publication of CN105189045B publication Critical patent/CN105189045B/zh
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/11—Lapping tools
    • B24B37/20—Lapping pads for working plane surfaces
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/27—Work carriers
    • B24B37/30—Work carriers for single side lapping of plane surfaces
    • B24B37/32—Retaining rings
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/02002—Preparing wafers
    • H01L21/02005—Preparing bulk and homogeneous wafers
    • H01L21/02008—Multistep processes
    • H01L21/0201—Specific process step
    • H01L21/02024—Mirror polishing

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
CN201480026546.2A 2013-05-16 2014-04-10 工件的研磨装置 Active CN105189045B (zh)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2013-103719 2013-05-16
JP2013103719A JP5870960B2 (ja) 2013-05-16 2013-05-16 ワークの研磨装置
PCT/JP2014/002066 WO2014185003A1 (ja) 2013-05-16 2014-04-10 ワークの研磨装置

Publications (2)

Publication Number Publication Date
CN105189045A CN105189045A (zh) 2015-12-23
CN105189045B true CN105189045B (zh) 2017-05-10

Family

ID=51897996

Family Applications (1)

Application Number Title Priority Date Filing Date
CN201480026546.2A Active CN105189045B (zh) 2013-05-16 2014-04-10 工件的研磨装置

Country Status (8)

Country Link
US (1) US20160082567A1 (enExample)
JP (1) JP5870960B2 (enExample)
KR (1) KR102192288B1 (enExample)
CN (1) CN105189045B (enExample)
DE (1) DE112014002107T5 (enExample)
SG (1) SG11201509094YA (enExample)
TW (1) TWI597127B (enExample)
WO (1) WO2014185003A1 (enExample)

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US10341371B2 (en) * 2016-08-31 2019-07-02 Nicira, Inc. Identifying and handling threats to data compute nodes in public cloud
JP6312229B1 (ja) * 2017-06-12 2018-04-18 信越半導体株式会社 研磨方法及び研磨装置
JP7139126B2 (ja) * 2018-03-16 2022-09-20 富士紡ホールディングス株式会社 保持具及びその製造方法
CN110394706A (zh) * 2019-07-25 2019-11-01 西安奕斯伟硅片技术有限公司 一种硅片处理装置及方法
CN111644977A (zh) * 2020-07-17 2020-09-11 中国科学院微电子研究所 研磨用固定环以及研磨头

Family Cites Families (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5267418A (en) * 1992-05-27 1993-12-07 International Business Machines Corporation Confined water fixture for holding wafers undergoing chemical-mechanical polishing
TW400567B (en) * 1995-04-10 2000-08-01 Matsushita Electric Industrial Co Ltd The polishing device and its polishing method for the substrate
JP3615592B2 (ja) 1995-07-11 2005-02-02 不二越機械工業株式会社 研磨装置
JPH1190820A (ja) 1997-09-12 1999-04-06 Shin Etsu Handotai Co Ltd ウエーハ研磨用テンプレートと該テンプレートを利用したウエーハ剥がし方法
US6899610B2 (en) * 2001-06-01 2005-05-31 Raytech Innovative Solutions, Inc. Retaining ring with wear pad for use in chemical mechanical planarization
US6893327B2 (en) * 2001-06-04 2005-05-17 Multi Planar Technologies, Inc. Chemical mechanical polishing apparatus and method having a retaining ring with a contoured surface
JP2005169568A (ja) * 2003-12-11 2005-06-30 Mitsui Chemicals Inc リテーナリング及びそれを用いた研磨装置
US7086939B2 (en) * 2004-03-19 2006-08-08 Saint-Gobain Performance Plastics Corporation Chemical mechanical polishing retaining ring with integral polymer backing
WO2006038259A1 (ja) * 2004-09-30 2006-04-13 Renesas Technology Corp. 半導体装置の製造方法
KR20070118277A (ko) * 2005-04-12 2007-12-14 니혼 세이미츠 덴시 가부시키가이샤 Ｃｍｐ 장치용 리테이너링과 그 제조방법 및 ｃｍｐ 장치
JP2008543058A (ja) * 2005-05-24 2008-11-27 インテグリス・インコーポレーテッド Ｃｍｐ保持リング
JP4534165B2 (ja) * 2006-12-18 2010-09-01 エルピーダメモリ株式会社 半導体装置の製造装置及び、半導体装置の製造方法
JP5615589B2 (ja) * 2010-05-07 2014-10-29 富士紡ホールディングス株式会社 枠材および枠材を有する保持具
JP5683398B2 (ja) * 2011-07-06 2015-03-11 株式会社クレハ 研磨装置用ワークピース保持リング

Also Published As

Publication number Publication date
US20160082567A1 (en) 2016-03-24
KR20160008550A (ko) 2016-01-22
KR102192288B1 (ko) 2020-12-17
JP5870960B2 (ja) 2016-03-01
SG11201509094YA (en) 2015-12-30
WO2014185003A1 (ja) 2014-11-20
DE112014002107T5 (de) 2016-01-14
TW201505762A (zh) 2015-02-16
TWI597127B (zh) 2017-09-01
CN105189045A (zh) 2015-12-23
JP2014223692A (ja) 2014-12-04

Similar Documents

Publication Publication Date Title
TWI458592B (zh) Grinding head and grinding device
JP5995825B2 (ja) 少なくとも１つのウエハを研磨する方法
US9333618B2 (en) Method for adjusting height position of polishing head and method for polishing workpiece
US20030022495A1 (en) Wafer manufacturing method, polishing apparatus , and wafer
JP5127882B2 (ja) 半導体ウェハの両面研磨方法
CN105189045B (zh) 工件的研磨装置
WO2001082354A1 (en) Method of manufacturing semiconductor wafer
JP6491812B2 (ja) メンブレン、研磨ヘッド、ワークの研磨装置及び研磨方法、並びに、シリコンウェーハ
JP2011009736A (ja) 半導体ウェーハのエッジを研磨する方法
WO2006046403A1 (ja) 半導体ウエーハの製造方法及び半導体ウエーハ
JP6955537B2 (ja) 多結晶仕上げを有する半導体ウエハを処理する方法
CN1299335C (zh) 晶片的研磨方法及晶片研磨用研磨垫
CN115551676B (zh) 晶片外周部的研磨装置
KR20140056046A (ko) 각형 금형용 기판
US6790129B2 (en) Method for polishing angular substrates
JP2011216884A (ja) 半導体ウエハの研磨方法
JP7099614B1 (ja) テンプレートアセンブリ、研磨ヘッド及びウェーハの研磨方法
US20190001463A1 (en) Workpiece polishing apparatus
WO2017125987A1 (ja) ウェーハの研磨方法、バックパッドの製造方法、バックパッド、及びそのバックパッドを具備する研磨ヘッド
CN118163029A (zh) 提升面内均一性的方法
JP2016047578A (ja) サファイア基板とその研磨方法

Legal Events

Date Code Title Description
C06 Publication
PB01 Publication
C10 Entry into substantive examination
SE01 Entry into force of request for substantive examination
GR01 Patent grant
GR01 Patent grant