CN105189045B - Workpiece polishing device - Google Patents
Workpiece polishing device Download PDFInfo
- Publication number
- CN105189045B CN105189045B CN201480026546.2A CN201480026546A CN105189045B CN 105189045 B CN105189045 B CN 105189045B CN 201480026546 A CN201480026546 A CN 201480026546A CN 105189045 B CN105189045 B CN 105189045B
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- China
- Prior art keywords
- workpiece
- grinding
- template
- abrasive cloth
- recess
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B37/00—Lapping machines or devices; Accessories
- B24B37/11—Lapping tools
- B24B37/20—Lapping pads for working plane surfaces
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B37/00—Lapping machines or devices; Accessories
- B24B37/27—Work carriers
- B24B37/30—Work carriers for single side lapping of plane surfaces
- B24B37/32—Retaining rings
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/02002—Preparing wafers
- H01L21/02005—Preparing bulk and homogeneous wafers
- H01L21/02008—Multistep processes
- H01L21/0201—Specific process step
- H01L21/02024—Mirror polishing
Abstract
The present invention is a workpiece polishing device comprising a polishing cloth for polishing a workpiece, a polish supply mechanism for supplying polish, and a polishing head for holding the workpiece; the polishing head holding the back surface of the workpiece by a backing pad and holding the edge part of the workpiece by an annular template, and pressing the workpiece and the template against the polishing cloth, whereby the workpiece is rubbed against the polishing cloth and the workpiece is polished, wherein the workpiece polishing device is characterized in that the template is composed of a resin to which a filler is added or a resin in which a woven cloth is included, and minuscule concavities are formed in the surface pressing against the polishing cloth by exposing the filler or the woven cloth on the surface. A workpiece polishing device is thereby provided in which the speed of polishing the outer periphery of the workpiece is stable and the workpiece can be polished with high flatness.
Description
Technical field
The present invention relates to a kind of lapping device of workpiece.
Background technology
In the case of the semiconductor crystal wafer of manufacture Silicon Wafer etc., one of important operation is the surface for improving wafer
Roughness and improve the grinding step of flatness.
With the high precision int of component in recent years, the semiconductor crystal wafer used in establishment of component is required with very high
Precision being planarized.For this requirement, using cmp (CMP；Chemical Mechanical
Polishing) it is used as the technology of the surface planarisation of semiconductor crystal wafer.
Used as the device of the surface of the work of grinding Silicon Wafer etc., exist carries out the one side grinding that one side grinds one by one by workpiece
Device and two-sided while the double-side polishing apparatus being ground.
General single-sided grinding device for example shown in Fig. 7, is supplied by the rotating disk 104, grinding agent for being pasted with abrasive cloth 107
Mechanism 108, grinding head 102 etc. are constituted.In this lapping device 101, workpiece W is kept using grinding head 102, by grinding agent
Feed mechanism 108 supplies grinding agent 109 to abrasive cloth 107, and rotating disk 104 and grinding head 102 is rotated respectively so that
Sliding contact is made on the surface of workpiece W on abrasive cloth 107, is thus ground.
, there is following method in the method as workpiece is kept：Via bonding agents such as waxes so that workpiece is affixed to into flat circle
The method on plate on disk；The method for entering water-filling patch using soft liner (back lining materials)；Enter vacuum adsorbed method
Deng.
Paste the bullets such as polyurethane in the grinding head 102 of Fig. 7, the bottom surface of the holding plate 106 on the disk being made up of ceramics etc.
Property liner (back pad) 105, and the elastic insert 105 is absorbed moisture and workpiece W is kept by surface tension.Additionally,
In order to prevent workpiece W from coming off from holding plate 106 in grinding, and guided rings 103 are provided with around holding plate 106.
The lapping device 101 is easily subjected to keep due to pushing workpiece W indirectly via holding plate 106
The change in size caused by deformation and back lining when the precision of the flatness of plate 106, plus-pressure are acted on holding plate 106
The impact of the precision of the thickness of pad 105 etc., can there is a problem of being difficult to by very high precision come the entire surface of grinding work-piece.
Additionally, the peripheral part of workpiece has ground many tendencies, that is, the turned-down edge of periphery is susceptible to, and is directed to the whole of workpiece
In the case where very high-precision flatness is required, existing can not corresponding technical problem in face.
For above-mentioned technical problem, in patent document 1, it is proposed that grinding head as shown in Figure 8, Figure 9, it is used as one kind
Grinding head, can be such that workpiece entire surface is equably pushed with equably grinding work-piece entire surface towards abradant surface, prevent work
The turned-down edge of part periphery, and it is capable of the flatness on lifting workpieces surface.Fig. 8 is the overall skeleton diagram of grinding head.Fig. 9 is existing
The enlarged drawing of a grinding head part.
The grinding head 117 possesses：Head part 120, its maintaining part possesses recess open downward；Holding member 121,
It is configured in the recess inner side of the head part 120；Elastomeric element 110, its outside portion is fixed on the wall portion of head part 120,
And inside portion is fixed on holding member 121, and can allow towards above-below direction and horizontal direction to move in small scope
Dynamic mode keeps the holding member 121 to suspend in midair；First pressure room 111, the inside of head part 120 is passed through holding member by it
121 and elastomeric element dividing setting；Elastic film 112, it is constituted by having resilient film, in holding member 121
Exterior side is fixed by peripheral part, and is configured to that workpiece W is abutted using lateral surface by workpiece W towards rotating disk
Abradant surface is pushed；Second pressure room 113, it is drawn by the lateral surface 116a and elastic film medial surface 112a of holding plate 116
Point.The fluid of authorized pressure is supplied towards first pressure room 111 by first fluid feedway 122, and by second
Fluid supply apparatus 123 supply the fluid of authorized pressure towards second pressure room 113.
Elastic film 112 is making elastic film peripheral part 112b using the fastening of bolt (not shown) by retainer ring 115
The mode clamped and the exterior side for being fixed on holding plate 116.The elastic film 112 is abutted to workpiece W and profit with its lateral surface
Workpiece W can be arranged towards the mode that the abradant surface of rotating disk carries out uniform pushing with the effect of air bag (エ ア バ ッ Network).This
Outward, workpiece W is effectively to be affixed to the surface of elastic film 112 by the surface tension of the liquid such as water.
Template 114 is ring-type plectane, and it is being installed in the exterior side (bottom surface) of elastic film 112 and can surround workpiece
The mode of W forms to prevent sliding laterally for workpiece W.The inner peripheral portion of template 114 is with workpiece W continuously and by elastic film 112
And pushed simultaneously；The thickness of template 114 is configured to equal with the thickness of workpiece W, thus comes to apply equal to workpiece W peripheral parts
Even load, and can suppress the periphery of workpiece W that turned-down edge occurs.
Prior art literature
Patent document
Patent document 1：Japanese Patent Publication is into 9-29618 publications
Patent document 2：Japanese Patent Publication is into 11-90820 publications
The content of the invention
(1) technical problem to be solved
But, even using the grinding head 117 described in patent document 1 come in the case of being ground, workpiece it is flat
Smooth degree still can deteriorate.The present inventor etc. are studied for that reason in this pin and are learnt following item.
Inner peripheral portion due to template 114 is equably pushed, and the gap between template 114 and abrasive cloth 107 can diminish, and make
Obtain grinding agent and be difficult to supply between template 114 and abrasive cloth 107.As a result, supply to abrasive cloth and Workpiece periphery portion it
Between the amount of grinding agent become unstable so that there is deviation in the wear particle concentration of grinding agent.
Further, the grinding tolerance (fininsh allowance of the workpiece after the present inventor etc. investigates the wear particle concentration of grinding agent and grinds；
Take り generations) relation of deviation.Using the grinding head of Fig. 8 as grinding head, and using 300mm minute surface Silicon Wafers as grinding crystal wafer.
The WaferSight (model) manufactured using KLA-Tencor companies is measuring in advance the sectional thickness shape of wafer.Using in city
It is used as template containing the plywood for being soaked with epoxy resin in the glass woven fabric sold.Using the colloidal silica of market sale
Slurries are used as grinding agent.It is used as abrasive particle using colloidal silica of the average grain diameter for 35nm～70nm, is used pure water
It is diluted, adds potassium hydroxide, makes pH value become 10.5.
Abrasive cloth is to use commercially available adhesive-bonded fabric type, and in grinding, grinding head is each carried out with grinding rotating disk with 30rpm
Rotation.The grinding pressure (pressure of fluid) of wafer is set to 150g/cm2.Change the dilution rate of grinding agent, change wear particle concentration
And carry out the attrition process of three Silicon Wafers.After wafer after cleaning grinding, KLA-Tencor is used in the same manner as before grinding
The WaferSight of company's manufacture with the Difference Calculation of the thickness before and after being ground, evaluates brilliant measuring sectional thickness shape
Circle grinding tolerance.As shown in figure 4, known abrasive concentration has correlation with wafer grinding tolerance, the concentration of abrasive particle is denseer, wafer mill
Cutting nargin can change in turned-down edge side.
Therefore, in grinding work-piece, if supplying to the wear particle concentration of the grinding agent between abrasive cloth and the peripheral part of workpiece
Generation deviation, then the deviation of the wear particle concentration can promote the destabilization of the peripheral shape of workpiece, that is to say, that workpiece it is flat
Degree can deteriorate.
Additionally, as grinding agent is sufficiently fed to the countermeasure between template and abrasive cloth, being known to a kind of template (reference
Patent document 2), it is characterised in that arrange in template by from outer circumference end insertion to institutes such as the ditch at inner circumferential end, hole or recessed paths
The stream of composition.If using the countermeasure, there are the following problems：The density of grinding agent can be to outside workpiece under the influence of ditch, hole
Bring impact in all portions, and makes to produce undulations on circumferencial direction, and deteriorates the flatness of workpiece.
As the countermeasure of abrasive cloth side, it is known on the surface of abrasive cloth and ditch is set, but the workpiece after attrition process
The problem of trickle roughness can occur on surface because of ditch.
Additionally, also there is a kind of patent, its template is incited somebody to action by finishing (the De レ ッ シ Application グ) body that dual-purpose is abrasive cloth surface
The surface of the abrasive cloth side of template is set to the concavo-convex finishing acting surface with finishing.But, if making to grind in attrition process
The abrasive action face of mill cloth becomes coarse, then can produce swarf, thereby results in grinding and to occur to damage super on crystal column surface
10% fraction defective is crossed, and it is impracticable.As the example of the finishing body, it is formed with fine irregularities and is embossed (エ Application ボ ス), thin
The depression (デ ィ Application プ Le) of micro- and gentle recess, formed centered on repairing the central part of acting surface (comprising circumferentia)
Actinoid jog etc., and the size of this jog, for example, 50 μm or so.
The present invention is completed in view of the above problems, be its object is to, there is provided a kind of lapping device of workpiece, its via
Between template and abrasive cloth, the amount for making supply to the grinding agent between abrasive cloth and the peripheral part of workpiece is stablized, and suppresses this to grind
The deviation of the wear particle concentration of grinding agent, its result is that the grinding rate that can make Workpiece periphery portion is stablized, high flat degree ground grinding work
Part.
(2) technical scheme
To achieve these goals, according to the present invention, there is provided a kind of lapping device of workpiece, it possesses for grinding work-piece
Abrasive cloth, the grinding agent feed mechanism for supplying grinding agent, and for keeping the grinding head of workpiece, the grinding head passes through
Back pad keeps the edge part of the workpiece by the template of ring-type keeping the back side of the workpiece, and will be described
Workpiece and the template are urged on the abrasive cloth, thus making the workpiece make sliding contact on the abrasive cloth, are come
The workpiece is ground, the lapping device of the workpiece is characterised by, the template is by the resin for being added with filler or containing knitting
The resin of cloth is constituted, expose in the pressing surface for pushing the abrasive cloth described filler or it is described weave cotton cloth, thus pushing away this
Pressure surface has trickle recess.
If the lapping device of this workpiece, via the trickle recess in the pressing surface of template, thus hold grinding agent
Change places and be circulated between template and abrasive cloth, the amount for making supply to the grinding agent between abrasive cloth and the peripheral part of workpiece is stablized,
Grinding agent is supplied to surface of the work and abrasive cloth surface with uniform wear particle concentration.As a result, due to making outside workpiece
The shape in all portions is flat, therefore, it is possible to obtain high flat workpiece.If additionally, template is by the resin for being added with filler or contains
The resin weaved cotton cloth is constituted, and is exposed filler in the pressing surface for pushing abrasive cloth or weaved cotton cloth, then can be simply formed uniform
And trickle recess.And, such recess can make abrasive cloth produce swarf, without producing damage on wafer.
Now, in the pressing surface of the template for pushing the abrasive cloth surface occupation rate of the filler for exposing or
The surface occupation rate weaved cotton cloth is preferably less than more than 5% 85%.
So, if filler or the surface occupation rate weaved cotton cloth are more than 5%, grinding agent is more effectively made uniformly and easily
It is circulated between template and abrasive cloth, the deviation of the wear particle concentration of grinding agent can be suppressed, as a result, can more effectively carries
The flatness of high workpiece.Further, since the surface occupation rate is less than 85% such that it is able to effectively obtain damage fraction defective low
Workpiece.
Additionally, now preferably the depth of the recess is more than 0.05mm.
If so, then can more effectively make grinding agent easily be circulated between template and abrasive cloth, supply is made extremely
The amount of the grinding agent between abrasive cloth and workpiece is more stable, so as to further suppress the grinding between abrasive cloth and Workpiece periphery portion
The deviation of the wear particle concentration of agent.As a result, enabling in particular to make the grinding rate in Workpiece periphery portion more stable, grind high flat degree
Grinder part.
Further, preferably the A/F of the recess is at intervals of below 10mm between below 5mm, and recess.
In such manner, it is possible to suppress the fluctuating produced on the circumferencial direction of workpiece.As a result, it is better to obtain flatness
Good workpiece.
Now, preferably the recess and the contact angle of the abrasive cloth are less than 90 °.
If so, then the grinding of workpiece can be carried out in the way of not injuring abrasive cloth.As a result, can obtain
Damage the lower workpiece of fraction defective.
(3) beneficial effect
The lapping device of the present invention, its template is constituted by the resin for being added with filler or containing the resin weaved cotton cloth, and is being pushed away
Expose filler or weave cotton cloth in the pressing surface of pressure abrasive cloth, thus making the pressing surface that there is trickle recess, therefore via template
Recess, make grinding agent uniform and be easily circulated between template and abrasive cloth, and make supply to abrasive cloth and the spy of workpiece
Be not that the amount of grinding agent between peripheral part is stablized, with uniform wear particle concentration by grinding agent supply to Workpiece periphery portion surface with
Abrasive cloth surface.As a result, the shape in Workpiece periphery portion can be made flat, and the workpiece of high flat degree can be obtained.Additionally,
Because template is constituted by the resin for being added with filler or containing the resin weaved cotton cloth, and expose in the pressing surface for pushing abrasive cloth
Filler is weaved cotton cloth, therefore, it is possible to simple and be formed uniformly in fine recesses, and workpiece after grinding and be difficult to rise and fall
Or damage.
Description of the drawings
Fig. 1 is the skeleton diagram of the lapping device one for representing the present invention.
Fig. 2 is the amplification of of the template periphery for being added with filler of the grinding head of the lapping device for representing the present invention
Figure.
Fig. 3 is the enlarged drawing of containing the template periphery weaved cotton cloth of the grinding head of the lapping device for representing the present invention.
Fig. 4 is the figure of the relation of the grinding tolerance deviation of the workpiece after representing the wear particle concentration of grinding agent and grinding.
Fig. 5 is that the recess surface of the pushing surface side for representing the template that abrasive cloth is pushed in embodiment 1,2 and comparative example is accounted for
There is the figure of rate and the relation of the surface flatness of workpiece.
Fig. 6 is that the recess surface of the pushing surface side for representing the template that abrasive cloth is pushed in embodiment 1,2 and comparative example is accounted for
There is the figure of rate and the relation of the damage fraction defective on the surface of workpiece.
Fig. 7 is the skeleton diagram for representing existing lapping device one.
Fig. 8 is the skeleton diagram of the first example of grinding for representing existing lapping device.
Fig. 9 is the enlarged drawing of a part for the grinding head for representing existing lapping device.
Specific embodiment
Below, pin embodiment bright for purposes of the invention, but the present invention is not limited to this.
As described above, in the grinding of workpiece, the inner peripheral portion due to template is equably pushed, grinding agent is caused to be difficult to supply
To between template and abrasive cloth so that grinding agent is difficult to supply between abrasive cloth and Workpiece periphery portion, therefore is easily grinding
The wear particle concentration of the grinding agent between mill cloth and workpiece produces deviation.As a result, the deviation of wear particle concentration can promote to be particularly
The destabilization of the peripheral shape of workpiece, so as to there is a problem of that workpiece flatness deteriorates.
Therefore, the present inventor etc. have made intensive studies in the grinding of workpiece in order to obtain the workpiece of high flat degree.
As a result, expecting a kind of lapping device, its template is constituted by the resin for being added with filler or containing the resin weaved cotton cloth, and is being pushed away
Expose filler on the face of pressure abrasive cloth or weave cotton cloth, thus the face pushed this has trickle recess.In this device
In, grinding agent is uniform via recess and is easily circulated between template and abrasive cloth, makes supply outer with workpiece to abrasive cloth
The amount of the grinding agent between all portions is stablized, and grinding agent is supplied to surface of the work and abrasive cloth surface with uniform wear particle concentration.
As a result, expect the shape in particularly Workpiece periphery portion can be made flat, therefore, it is possible to obtain the workpiece of high flat degree, with complete
Into the present invention.
Below, it is described in detail referring to the drawings the lapping device of the workpiece to the present invention, but the present invention is not only restricted to
This.
As shown in figure 1, the lapping device 1 of the present invention is by the abrasive cloth 4 for grinding work-piece, for supplying grinding agent 8
Grinding agent feed mechanism 7, and for keeping the grinding head 2 of workpiece W to be constituted.Abrasive cloth 4 is secured on rotating disk 3.Grind
Bistrique 2, with for keeping the back pad 5 and mould for keeping the ring-type of the edge part of workpiece W of workpiece W from the back side
Plate 6.
In the lapping device 1, the back side of workpiece W is kept by back pad 5, keep workpiece W's by template 6
Edge part, and grinding agent 8 is supplied to abrasive cloth 4 by grinding agent feed mechanism 7, and while make rotating disk 3 and grinding head 2
Each spinning, while workpiece W and template 6 are urged on abrasive cloth 4, thus making workpiece W connect as slip on abrasive cloth 4
Touch, to carry out the grinding of workpiece W.
Fig. 2, Fig. 3 are the skeleton diagrams of the periphery 9 of enlarged representation grinding head.As shown in Fig. 2 template 6 is filled out by being added with
The resin of material 10 is constituted, and filler 10 exposes in the pressing surface of the template 6 of pushing abrasive cloth 4, thus making the pushing mask
There is trickle recess 12.Or, as shown in figure 3, template 6 be containing weave cotton cloth 11 resin, 11 expose to abrasive cloth 4 weaving cotton cloth
The face that pushes of carrying out on, thus making the pressing surface that there is trickle recess 12.
The miscellaneous part of grinding head 2 is not particularly limited, as long as can respectively with back pad and with above-mentioned recess
Template keeping the back side and the edge part of workpiece, either which kind of structure.
If this lapping device 1, then via the recess 12 of template 6, grinding agent 8 is uniform and is easily circulated to template 6
Between abrasive cloth 4, the amount for making the grinding agent 8 between the peripheral part of supply to abrasive cloth 4 and workpiece W is stablized, can be with uniform
Wear particle concentration grinding agent 8 is supplied to workpiece W surface and the surface of abrasive cloth 4.As a result, due to making particularly in work
The grinding rate of part W peripheral parts is stable in circumference and makes the shape in Workpiece periphery portion flat, therefore, it is possible to obtain high flat degree
Workpiece W.Additionally, by be added with filler 10 resin or containing weave cotton cloth 11 resin, be made the template 6 that thickness has suitably been changed,
And make filler 10 or weave cotton cloth on the face for pushing abrasive cloth 4 11 to expose, thus, it is possible to simple and be formed uniformly trickle recess
12.Therefore, there is no need to complicated processing unit (plant) or processing method for processing trickle recess 12 also can suppress low
Cost.
Now, it is preferable that the surface occupation rate of filler 10 exposed in the pressing surface for pushing the template 6 of abrasive cloth 4, or
Person weave cotton cloth 11 surface occupation rate be less than more than 5% 85%, more preferably less than 80%.
So, if filler 10 or the 11 surface occupation rate of weaving cotton cloth are more than 5%, supply is made to abrasive cloth 4 and workpiece W
The amount of the grinding agent 8 between peripheral part is stablized, and can suppress the abrasive particle of the grinding agent 8 between the peripheral part of abrasive cloth 4 and workpiece W
The deviation of concentration, and can more effectively improve the flatness of workpiece W.Additionally, by making the surface occupation rate be less than 85%,
The abrasion of the pressing surface of the template 6 for pushing abrasive cloth 4 can be then reduced, the generation of swarf can be suppressed.As a result, can cut
Obtain on the spot damaging the low workpiece W of fraction defective.
Additionally, now, the depth of recess 12 is preferably more than 0.05mm.
If such template, even if then in the grinding of workpiece, the surface of template 6 is also ground together, also can be longer
Time maintains recess 12, therefore, it is possible to the life-span of climbing shuttering.
Further, it is preferable that the A/F of recess 12 is below 5mm, the spacing between recess 12 is below 10mm.
If such template, then the impact that the density of grinding agent 8 can be suppressed to bring to Workpiece periphery portion, and can press down
The situation that workpiece W processed occurs to rise and fall in circumferencial direction.As a result, the better workpiece W of flatness can be obtained.
Now, recess 12 is preferably less than 90 ° with the contact angle of abrasive cloth 4.
If such template, then the grinding of workpiece W can be carried out in the way of recess 12 will not injure abrasive cloth 4.Its
As a result, it is possible to obtain damaging the lower workpiece W of fraction defective.
Embodiment
Below, represent embodiments of the invention and comparative example to further illustrate the present invention, but the present invention is unrestricted
In these examples.
(embodiment 1)
The grinding of workpiece is carried out using the lapping device of workpiece of the invention, and evaluates the flatness of the workpiece after grinding
With damage fraction defective.
The lapping device of Fig. 1 has been used in embodiment 1.Grinding head that the lapping device possesses as shown in Fig. 2 except
Beyond template, using the grinding head identical grinding head with Fig. 8.Template now is by the following method making.First prepare double
Phenol A type epoxy resin, it is added with the glass system filler for adjusting that the maximum appearance and size after concentration is 2mm, then makes interior
Epoxy resin preimpregnation material (プ リ プ レ グ) containing glass fibre, it is coated with bisphenol A type epoxy resin using sprayer,
And by the preimpregnation material be layered in push abrasive cloth pushing surface side, and press molding and make circlewise.The thickness of the template is
750 μm, the surface occupation rate of the filler exposed in the pressing surface for pushing abrasive cloth is 25%.
Additionally, as grinding object, using diameter 300mm Silicon Wafers.Grinding agent is to use to be diluted with pure water, and with
PH value becomes the commercially available colloidal silica slurry that 10.5 mode is added with potassium hydroxide.Now, colloidal silica
The average grain diameter of abrasive particle is 35nm～70nm.Abrasive cloth be use commercially available adhesive-bonded fabric type, grinding when, grinding head with grinding
Rotating disk is each rotated with 30rpm.The grinding pressure (pressure of fluid) of wafer is set to 150g/cm2.The grinding of wafer terminates
Afterwards, cleaning wafer, and the WaferSight manufactured using KLA-Tencor companies carry out wafer flatness test, and evaluate
SFQRmax (maximum partly flat degree).Additionally, the SP-1 (model) manufactured using KLA-Tencor companies is evaluating the damage on surface
Hinder fraction defective.
(embodiment 2)
Except template from it is as described below it is different in addition to, the grinding of workpiece is carried out with condition similarly to Example 1, and
Evaluate the flatness of the workpiece after grinding and damage fraction defective.Template now is made by following method.With bisphenol-A
Type epoxy resin is the glass fabric of 0.5mm come the spacing in length and breadth for being impregnated with the plain weave of thickness 0.18mm, and is dried to make
It is used as the prepreg on surface.By this prepreg be layered in push abrasive cloth pushing surface side, and press molding and be made thickness 760
μm ring-type.Then, the pressing surface to pushing abrasive cloth is ground processing, so as to glass fibre exposes reticulate.The template
The surface occupation rate of the glass fabric exposed in the pressing surface for pushing abrasive cloth is 16%.
(comparative example)
In addition to using the existing template without the such recess of the present invention, entered with condition similarly to Example 1
The grinding of row workpiece, and evaluate the flatness of the workpiece after grinding and damage fraction defective.Template now be use it is commercially available interior
Epoxy resin rounding plate containing glass fibre is making.The thickness of the template is 750 μm, and is not had in the pressing surface for pushing abrasive cloth
The surface occupation rate for having the recess caused by the filler or glass fabric due to exposing, i.e. recess is 0%.
Recess surface occupation rate in embodiment 1, embodiment 2 is changed into into 40%, 60%, 80%, 85%, with same
Reiteration is ground.Its result is as shown in Figure 5, Figure 6.Fig. 5 is recessed in the pressing surface for represent the template for pushing abrasive cloth
The figure of portion surface occupation rate and the correlation of SFQRmax.When the flatness of embodiment 1,2 and comparative example is measured, in embodiment
1st, the wafer peripheral shape of any one is expressed as to be flat to turned-down edge shape somewhat in 2, SFQRmax is good.In comparative example
In, used as wafer peripheral part shape, it was observed that many tilt strong wafer, SFQRmax deteriorates.
Additionally, Fig. 6 is recess surface occupation rate and damage fraction defective in the pressing surface for represent the template for pushing abrasive cloth
Correlation figure.After the damage fraction defective of measurement embodiment 1,2 and comparative example as a result, when recess surface occupation rate is
40%th, 60%, 80% when, can obtain almost not damaging bad wafer.Additionally, when recess surface occupation rate is 85%
When, damaging fraction defective can somewhat rise, but even if so, compared to the existing damage fraction defective more than 10%, still be able to
Suppress into than relatively low.
In addition, the present invention is not only restricted to above-mentioned embodiment.Above-mentioned embodiment is to illustrate, as long as the right with the present invention
Technological thought described in claim has substantially the same structure, and plays same purpose effect, no matter whichever is included in
In the technical scope of the present invention.
Claims (5)
1. a kind of lapping device of workpiece, it possesses the abrasive cloth for grinding work-piece, the grinding agent for supplying grinding agent and supplies
To mechanism, and for keeping the grinding head of workpiece；The grinding head keeps the back side of the workpiece by back pad, and leads to
Cross the template of ring-type to keep the edge part of the workpiece, and the workpiece and the template be urged on the abrasive cloth,
Thus making the workpiece make sliding contact on the abrasive cloth, to grind the workpiece；The spy of the lapping device of the workpiece
Levy and be,
The template is constituted by the resin for being added with filler or containing the resin weaved cotton cloth, in the pushing for pushing the abrasive cloth
Expose on face described filler or it is described weave cotton cloth, thus making the pressing surface that there is trickle recess, pushing the abrasive cloth
The surface occupation rate of the described filler exposed in the pressing surface of the template or the surface occupation rate weaved cotton cloth be more than 5% 85% with
Under.
2. the lapping device of workpiece according to claim 1, it is characterised in that the depth of the recess be 0.05mm with
On.
3. the lapping device of workpiece according to claim 1 and 2, it is characterised in that the A/F of the recess is 5mm
Hereinafter, and between recess at intervals of below 10mm.
4. the lapping device of workpiece according to claim 1 and 2, it is characterised in that the recess and the abrasive cloth
Contact angle is less than 90 °.
5. the lapping device of workpiece according to claim 3, it is characterised in that recess contact with the abrasive cloth
Angle is less than 90 °.
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2013-103719 | 2013-05-16 | ||
| JP2013103719A JP5870960B2 (en) | 2013-05-16 | 2013-05-16 | Work polishing equipment |
| PCT/JP2014/002066 WO2014185003A1 (en) | 2013-05-16 | 2014-04-10 | Workpiece polishing device |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN105189045A CN105189045A (en) | 2015-12-23 |
| CN105189045B true CN105189045B (en) | 2017-05-10 |
Family
ID=51897996
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201480026546.2A Active CN105189045B (en) | 2013-05-16 | 2014-04-10 | Workpiece polishing device |
Country Status (8)
| Country | Link |
|---|---|
| US (1) | US20160082567A1 (en) |
| JP (1) | JP5870960B2 (en) |
| KR (1) | KR102192288B1 (en) |
| CN (1) | CN105189045B (en) |
| DE (1) | DE112014002107T5 (en) |
| SG (1) | SG11201509094YA (en) |
| TW (1) | TWI597127B (en) |
| WO (1) | WO2014185003A1 (en) |
Families Citing this family (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US10333959B2 (en) * | 2016-08-31 | 2019-06-25 | Nicira, Inc. | Use of public cloud inventory tags to configure data compute node for logical network |
| JP6312229B1 (en) * | 2017-06-12 | 2018-04-18 | 信越半導体株式会社 | Polishing method and polishing apparatus |
| JP7139126B2 (en) * | 2018-03-16 | 2022-09-20 | 富士紡ホールディングス株式会社 | Holder and manufacturing method thereof |
| CN110394706A (en) * | 2019-07-25 | 2019-11-01 | 西安奕斯伟硅片技术有限公司 | A kind of silicon wafer processing unit and method |
| CN111644977A (en) * | 2020-07-17 | 2020-09-11 | 中国科学院微电子研究所 | Polishing retainer ring and polishing head |
Family Cites Families (14)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5267418A (en) * | 1992-05-27 | 1993-12-07 | International Business Machines Corporation | Confined water fixture for holding wafers undergoing chemical-mechanical polishing |
| TW353203B (en) * | 1995-04-10 | 1999-02-21 | Matsushita Electric Ind Co Ltd | Apparatus for holding substrate to be polished |
| JP3615592B2 (en) | 1995-07-11 | 2005-02-02 | 不二越機械工業株式会社 | Polishing equipment |
| JPH1190820A (en) | 1997-09-12 | 1999-04-06 | Shin Etsu Handotai Co Ltd | Wafer polishing template and wafer peeling method utilizing it |
| US6899610B2 (en) * | 2001-06-01 | 2005-05-31 | Raytech Innovative Solutions, Inc. | Retaining ring with wear pad for use in chemical mechanical planarization |
| US6893327B2 (en) * | 2001-06-04 | 2005-05-17 | Multi Planar Technologies, Inc. | Chemical mechanical polishing apparatus and method having a retaining ring with a contoured surface |
| JP2005169568A (en) * | 2003-12-11 | 2005-06-30 | Mitsui Chemicals Inc | Retainer ring and polishing device using the same |
| US7086939B2 (en) * | 2004-03-19 | 2006-08-08 | Saint-Gobain Performance Plastics Corporation | Chemical mechanical polishing retaining ring with integral polymer backing |
| CN101023511A (en) * | 2004-09-30 | 2007-08-22 | 株式会社瑞萨科技 | Method for manufacturing semiconductor device |
| WO2006114854A1 (en) * | 2005-04-12 | 2006-11-02 | Nippon Seimitsu Denshi Co., Ltd. | Retainer ring for cmp device, method of manufacturing the same, and cmp device |
| US20070224864A1 (en) * | 2005-05-24 | 2007-09-27 | John Burns | CMP retaining ring |
| JP4534165B2 (en) * | 2006-12-18 | 2010-09-01 | エルピーダメモリ株式会社 | Semiconductor device manufacturing apparatus and semiconductor device manufacturing method |
| JP5615589B2 (en) * | 2010-05-07 | 2014-10-29 | 富士紡ホールディングス株式会社 | Frame material and holder having frame material |
| JP5683398B2 (en) * | 2011-07-06 | 2015-03-11 | 株式会社クレハ | Workpiece holding ring for polishing equipment |
-
2013
- 2013-05-16 JP JP2013103719A patent/JP5870960B2/en active Active
-
2014
- 2014-04-10 DE DE112014002107.5T patent/DE112014002107T5/en not_active Withdrawn
- 2014-04-10 KR KR1020157032613A patent/KR102192288B1/en active IP Right Grant
- 2014-04-10 US US14/787,659 patent/US20160082567A1/en not_active Abandoned
- 2014-04-10 WO PCT/JP2014/002066 patent/WO2014185003A1/en active Application Filing
- 2014-04-10 CN CN201480026546.2A patent/CN105189045B/en active Active
- 2014-04-10 SG SG11201509094YA patent/SG11201509094YA/en unknown
- 2014-04-22 TW TW103114539A patent/TWI597127B/en active
Also Published As
| Publication number | Publication date |
|---|---|
| JP5870960B2 (en) | 2016-03-01 |
| TW201505762A (en) | 2015-02-16 |
| JP2014223692A (en) | 2014-12-04 |
| KR102192288B1 (en) | 2020-12-17 |
| CN105189045A (en) | 2015-12-23 |
| DE112014002107T5 (en) | 2016-01-14 |
| WO2014185003A1 (en) | 2014-11-20 |
| TWI597127B (en) | 2017-09-01 |
| US20160082567A1 (en) | 2016-03-24 |
| KR20160008550A (en) | 2016-01-22 |
| SG11201509094YA (en) | 2015-12-30 |
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