JP2013215813A5 - - Google Patents
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- JP2013215813A5 JP2013215813A5 JP2012086335A JP2012086335A JP2013215813A5 JP 2013215813 A5 JP2013215813 A5 JP 2013215813A5 JP 2012086335 A JP2012086335 A JP 2012086335A JP 2012086335 A JP2012086335 A JP 2012086335A JP 2013215813 A5 JP2013215813 A5 JP 2013215813A5
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- Prior art keywords
- workpiece
- static pressure
- pressure pad
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- gap
- Prior art date
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Priority Applications (5)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2012086335A JP5872947B2 (ja) | 2012-04-05 | 2012-04-05 | 両頭平面研削におけるワーク搬入出方法及び両頭平面研削盤 |
| DE102013205446A DE102013205446A1 (de) | 2012-04-05 | 2013-03-27 | Werkstückeinbring- und Ausbringverfahren beim Doppelendflächenschleifen und eine Doppelendflächenschleifmaschine |
| KR1020130033289A KR102015666B1 (ko) | 2012-04-05 | 2013-03-28 | 양두 평면 연삭에 있어서의 워크 반입출 방법 및 양두 평면 연삭기 |
| TW102111803A TWI574781B (zh) | 2012-04-05 | 2013-04-02 | 在兩頭平面硏磨的工件搬入出方法及兩頭平面硏磨盤 |
| SG2013024195A SG193771A1 (en) | 2012-04-05 | 2013-04-02 | Workpiece carrying-in-and-out method in double-end surface grinding and double disk surface grinder |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2012086335A JP5872947B2 (ja) | 2012-04-05 | 2012-04-05 | 両頭平面研削におけるワーク搬入出方法及び両頭平面研削盤 |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JP2013215813A JP2013215813A (ja) | 2013-10-24 |
| JP2013215813A5 true JP2013215813A5 (enExample) | 2014-08-14 |
| JP5872947B2 JP5872947B2 (ja) | 2016-03-01 |
Family
ID=49290307
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2012086335A Active JP5872947B2 (ja) | 2012-04-05 | 2012-04-05 | 両頭平面研削におけるワーク搬入出方法及び両頭平面研削盤 |
Country Status (5)
| Country | Link |
|---|---|
| JP (1) | JP5872947B2 (enExample) |
| KR (1) | KR102015666B1 (enExample) |
| DE (1) | DE102013205446A1 (enExample) |
| SG (1) | SG193771A1 (enExample) |
| TW (1) | TWI574781B (enExample) |
Families Citing this family (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP6250435B2 (ja) * | 2014-02-26 | 2017-12-20 | 光洋機械工業株式会社 | 両頭平面研削法 |
| JP6183301B2 (ja) * | 2014-06-16 | 2017-08-23 | 信越半導体株式会社 | 自動ハンドリング装置 |
| JP6383700B2 (ja) * | 2015-04-07 | 2018-08-29 | 光洋機械工業株式会社 | 薄板状ワークの製造方法及び両頭平面研削装置 |
| JP6707831B2 (ja) | 2015-10-09 | 2020-06-10 | 株式会社Sumco | 研削装置および研削方法 |
| CN105448795B (zh) * | 2015-11-30 | 2018-03-16 | 北京中电科电子装备有限公司 | 一种晶圆抓取系统 |
| CN114227524A (zh) * | 2021-12-30 | 2022-03-25 | 西安奕斯伟材料科技有限公司 | 双面研磨装置和双面研磨方法 |
| CN115070604B (zh) * | 2022-06-09 | 2023-09-29 | 西安奕斯伟材料科技股份有限公司 | 双面研磨装置和双面研磨方法 |
| CN114986381B (zh) * | 2022-06-16 | 2023-08-22 | 西安奕斯伟材料科技股份有限公司 | 双面研磨装置和双面研磨方法 |
| CN117206999B (zh) * | 2023-11-08 | 2024-02-20 | 瓦房店威远滚动体制造有限公司 | 一种能够提高打磨精度的双端面磨床 |
Family Cites Families (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH10249687A (ja) * | 1997-03-07 | 1998-09-22 | Super Silicon Kenkyusho:Kk | 薄板状工作物の両面研削・研磨装置 |
| JP3951496B2 (ja) * | 1999-03-30 | 2007-08-01 | 光洋機械工業株式会社 | 薄板円板状ワークの両面研削装置 |
| JP4798480B2 (ja) * | 2005-05-25 | 2011-10-19 | Ｓｕｍｃｏ Ｔｅｃｈｘｉｖ株式会社 | 半導体ウェーハの製造方法および両面研削方法並びに半導体ウェーハの両面研削装置 |
| JP4621261B2 (ja) * | 2008-02-01 | 2011-01-26 | 株式会社住友金属ファインテック | 両面研摩装置 |
-
2012
- 2012-04-05 JP JP2012086335A patent/JP5872947B2/ja active Active
-
2013
- 2013-03-27 DE DE102013205446A patent/DE102013205446A1/de active Pending
- 2013-03-28 KR KR1020130033289A patent/KR102015666B1/ko active Active
- 2013-04-02 TW TW102111803A patent/TWI574781B/zh active
- 2013-04-02 SG SG2013024195A patent/SG193771A1/en unknown