JP2017052077A5 - - Google Patents
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- Publication number
- JP2017052077A5 JP2017052077A5 JP2016125337A JP2016125337A JP2017052077A5 JP 2017052077 A5 JP2017052077 A5 JP 2017052077A5 JP 2016125337 A JP2016125337 A JP 2016125337A JP 2016125337 A JP2016125337 A JP 2016125337A JP 2017052077 A5 JP2017052077 A5 JP 2017052077A5
- Authority
- JP
- Japan
- Prior art keywords
- liquid polymer
- surfactant
- substrate
- pores
- polishing pad
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 229920000642 polymer Polymers 0.000 claims 23
- 239000007788 liquid Substances 0.000 claims 17
- 239000011148 porous material Substances 0.000 claims 17
- 239000000758 substrate Substances 0.000 claims 12
- 238000000034 method Methods 0.000 claims 9
- 238000005498 polishing Methods 0.000 claims 8
- 239000002563 ionic surfactant Substances 0.000 claims 6
- 239000007787 solid Substances 0.000 claims 6
- 239000003093 cationic surfactant Substances 0.000 claims 4
- 239000002736 nonionic surfactant Substances 0.000 claims 4
- 239000003945 anionic surfactant Substances 0.000 claims 2
- 238000004519 manufacturing process Methods 0.000 claims 2
- 230000003287 optical effect Effects 0.000 claims 2
- 229920001296 polysiloxane Polymers 0.000 claims 2
- 239000004065 semiconductor Substances 0.000 claims 2
- 239000004094 surface-active agent Substances 0.000 claims 2
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US14/751,328 | 2015-06-26 | ||
| US14/751,328 US10005172B2 (en) | 2015-06-26 | 2015-06-26 | Controlled-porosity method for forming polishing pad |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JP2017052077A JP2017052077A (ja) | 2017-03-16 |
| JP2017052077A5 true JP2017052077A5 (enExample) | 2019-07-11 |
| JP6870927B2 JP6870927B2 (ja) | 2021-05-12 |
Family
ID=57537555
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2016125337A Active JP6870927B2 (ja) | 2015-06-26 | 2016-06-24 | 研磨パッドを形成するための気孔率制御方法 |
Country Status (7)
| Country | Link |
|---|---|
| US (1) | US10005172B2 (enExample) |
| JP (1) | JP6870927B2 (enExample) |
| KR (1) | KR102514354B1 (enExample) |
| CN (1) | CN107695903B (enExample) |
| DE (1) | DE102016007777A1 (enExample) |
| FR (1) | FR3037833B1 (enExample) |
| TW (1) | TWI704976B (enExample) |
Families Citing this family (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US9776300B2 (en) | 2015-06-26 | 2017-10-03 | Rohm And Haas Electronic Materials Cmp Holdings Inc. | Chemical mechanical polishing pad and method of making same |
| US10092998B2 (en) | 2015-06-26 | 2018-10-09 | Rohm And Haas Electronic Materials Cmp Holdings, Inc. | Method of making composite polishing layer for chemical mechanical polishing pad |
| US10144115B2 (en) | 2015-06-26 | 2018-12-04 | Rohm And Haas Electronic Materials Cmp Holdings, Inc. | Method of making polishing layer for chemical mechanical polishing pad |
| US10086494B2 (en) * | 2016-09-13 | 2018-10-02 | Rohm And Haas Electronic Materials Cmp Holdings, Inc. | High planarization efficiency chemical mechanical polishing pads and methods of making |
| US10208154B2 (en) | 2016-11-30 | 2019-02-19 | Rohm And Haas Electronic Materials Cmp Holdings, Inc. | Formulations for chemical mechanical polishing pads and CMP pads made therewith |
| TWI642516B (zh) * | 2017-10-02 | 2018-12-01 | 智勝科技股份有限公司 | 研磨墊以及研磨方法 |
| US10464187B2 (en) * | 2017-12-01 | 2019-11-05 | Rohm And Haas Electronic Materials Cmp Holdings, Inc. | High removal rate chemical mechanical polishing pads from amine initiated polyol containing curatives |
| US20230390970A1 (en) * | 2022-06-02 | 2023-12-07 | Rohm And Haas Electronic Materials Cmp Holdings, Inc. | Method of making low specific gravity polishing pads |
Family Cites Families (24)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE1916330A1 (de) | 1969-03-29 | 1970-10-08 | Richard Zippel & Co Kg Farbspr | Anlage zur Herstellung von grossen oder kompliziert geformten Formteilen aus fluessigen Mehrkomponenten-Kunststoffen |
| US3705821A (en) | 1970-08-07 | 1972-12-12 | Bayer Ag | Process and apparatus for applying polyurethane foam-forming composition |
| US3954544A (en) | 1974-06-20 | 1976-05-04 | Thomas Hooker | Foam applying apparatus |
| DE2538437C3 (de) | 1975-08-29 | 1980-05-08 | Elastogran Maschinenbau Gmbh & Co, 8021 Strasslach | Mischvorrichtung für Mehrkomponentenkunststoffe mit Poren- oder Zellenstruktur, insbesondere Polyurethan |
| US4158535A (en) | 1977-01-25 | 1979-06-19 | Olin Corporation | Generation of polyurethane foam |
| US5163584A (en) | 1990-12-18 | 1992-11-17 | Polyfoam Products, Inc. | Method and apparatus for mixing and dispensing foam with injected low pressure gas |
| US6315820B1 (en) | 1999-10-19 | 2001-11-13 | Ford Global Technologies, Inc. | Method of manufacturing thin metal alloy foils |
| WO2001064396A1 (en) * | 2000-02-28 | 2001-09-07 | Rodel Holdings, Inc. | Polishing pad surface texture formed by solid phase droplets |
| KR100495404B1 (ko) * | 2002-09-17 | 2005-06-14 | 한국포리올 주식회사 | 임베디드 액상 미소요소를 함유하는 연마 패드 및 그 제조방법 |
| US7311862B2 (en) * | 2002-10-28 | 2007-12-25 | Cabot Microelectronics Corporation | Method for manufacturing microporous CMP materials having controlled pore size |
| JP3776428B2 (ja) | 2002-12-27 | 2006-05-17 | 株式会社加平 | ポリウレタン発泡体シート及びそれを用いた積層体シートの製造方法 |
| CN1765423A (zh) * | 2005-11-07 | 2006-05-03 | 四川大学 | 生物活性多孔支架材料的制备方法 |
| DE102005058292A1 (de) | 2005-12-07 | 2007-06-14 | Hennecke Gmbh | Verfahren und Vorrichtung zur Herstellung von beschichteten Formteilen |
| JP4954762B2 (ja) | 2007-03-27 | 2012-06-20 | 東洋ゴム工業株式会社 | ポリウレタン発泡体の製造方法 |
| JP5308637B2 (ja) * | 2007-07-11 | 2013-10-09 | 東洋ゴム工業株式会社 | 研磨パッド |
| US20090094900A1 (en) | 2007-10-15 | 2009-04-16 | Ppg Industries Ohio, Inc. | Method of forming a polyurea polyurethane elastomer containing chemical mechanical polishing pad |
| SG181890A1 (en) * | 2009-12-22 | 2012-07-30 | 3M Innovative Properties Co | Polishing pad and method of making the same |
| KR101485073B1 (ko) * | 2010-09-15 | 2015-01-22 | 주식회사 엘지화학 | 지지 패드용 폴리우레탄 수지 조성물 및 이를 이용한 폴리우레탄 지지 패드 |
| CN102875769A (zh) * | 2011-07-15 | 2013-01-16 | 株式会社Lg化学 | 聚氨酯树脂组合物及聚氨酯支撑垫片 |
| US8709114B2 (en) * | 2012-03-22 | 2014-04-29 | Rohm And Haas Electronic Materials Cmp Holdings, Inc. | Method of manufacturing chemical mechanical polishing layers |
| US20150038066A1 (en) * | 2013-07-31 | 2015-02-05 | Nexplanar Corporation | Low density polishing pad |
| US9421666B2 (en) * | 2013-11-04 | 2016-08-23 | Applied Materials, Inc. | Printed chemical mechanical polishing pad having abrasives therein |
| US9993907B2 (en) * | 2013-12-20 | 2018-06-12 | Applied Materials, Inc. | Printed chemical mechanical polishing pad having printed window |
| TWM494688U (zh) * | 2014-01-09 | 2015-02-01 | Chuang-Mao Wang | ３ｄ列印機成型基板 |
-
2015
- 2015-06-26 US US14/751,328 patent/US10005172B2/en active Active
-
2016
- 2016-06-13 TW TW105118459A patent/TWI704976B/zh active
- 2016-06-23 CN CN201610464131.4A patent/CN107695903B/zh active Active
- 2016-06-23 KR KR1020160078606A patent/KR102514354B1/ko active Active
- 2016-06-24 DE DE102016007777.8A patent/DE102016007777A1/de not_active Withdrawn
- 2016-06-24 JP JP2016125337A patent/JP6870927B2/ja active Active
- 2016-06-27 FR FR1655963A patent/FR3037833B1/fr not_active Expired - Fee Related
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