JP2013508254A5 - - Google Patents

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Publication number
JP2013508254A5
JP2013508254A5 JP2012535306A JP2012535306A JP2013508254A5 JP 2013508254 A5 JP2013508254 A5 JP 2013508254A5 JP 2012535306 A JP2012535306 A JP 2012535306A JP 2012535306 A JP2012535306 A JP 2012535306A JP 2013508254 A5 JP2013508254 A5 JP 2013508254A5
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JP
Japan
Prior art keywords
mold substrate
glass
patterned surface
layer
glass component
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP2012535306A
Other languages
English (en)
Japanese (ja)
Other versions
JP5964750B2 (ja
JP2013508254A (ja
Filing date
Publication date
Priority claimed from US12/581,695 external-priority patent/US8707734B2/en
Application filed filed Critical
Publication of JP2013508254A publication Critical patent/JP2013508254A/ja
Publication of JP2013508254A5 publication Critical patent/JP2013508254A5/ja
Application granted granted Critical
Publication of JP5964750B2 publication Critical patent/JP5964750B2/ja
Expired - Fee Related legal-status Critical Current
Anticipated expiration legal-status Critical

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JP2012535306A 2009-10-19 2010-10-19 ガラス基板に物質を埋め込む方法 Expired - Fee Related JP5964750B2 (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US12/581,695 US8707734B2 (en) 2009-10-19 2009-10-19 Method of embedding material in a glass substrate
US12/581,695 2009-10-19
PCT/US2010/053221 WO2011049963A2 (en) 2009-10-19 2010-10-19 Method of embedding material in a glass substrate

Publications (3)

Publication Number Publication Date
JP2013508254A JP2013508254A (ja) 2013-03-07
JP2013508254A5 true JP2013508254A5 (enExample) 2013-12-05
JP5964750B2 JP5964750B2 (ja) 2016-08-03

Family

ID=43879519

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2012535306A Expired - Fee Related JP5964750B2 (ja) 2009-10-19 2010-10-19 ガラス基板に物質を埋め込む方法

Country Status (6)

Country Link
US (1) US8707734B2 (enExample)
EP (1) EP2491587B1 (enExample)
JP (1) JP5964750B2 (enExample)
AU (1) AU2010308235B2 (enExample)
CA (1) CA2778319C (enExample)
WO (1) WO2011049963A2 (enExample)

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US9645149B2 (en) 2011-09-30 2017-05-09 The Regents Of The University Of Michigan System for detecting rare cells
US9981844B2 (en) * 2012-03-08 2018-05-29 Infineon Technologies Ag Method of manufacturing semiconductor device with glass pieces
US10115671B2 (en) 2012-08-03 2018-10-30 Snaptrack, Inc. Incorporation of passives and fine pitch through via for package on package
WO2014070776A1 (en) 2012-10-29 2014-05-08 The Regents Of The University Of Michigan Microfluidic device and method for detecting rare cells
US9090499B2 (en) 2013-03-10 2015-07-28 Qualcomm Incorporated Method and apparatus for light induced etching of glass substrates in the fabrication of electronic circuits
US20140264655A1 (en) * 2013-03-13 2014-09-18 Invensense, Inc. Surface roughening to reduce adhesion in an integrated mems device
US9730638B2 (en) 2013-03-13 2017-08-15 Glaukos Corporation Intraocular physiological sensor
US9136165B2 (en) * 2013-06-04 2015-09-15 Invensense, Inc. Methods for stiction reduction in MEMS sensors
US10464836B2 (en) 2013-10-10 2019-11-05 Medtronic, Inc. Hermetic conductive feedthroughs for a semiconductor wafer
US10317406B2 (en) 2015-04-06 2019-06-11 The Regents Of The University Of Michigan System for detecting rare cells
US10335978B2 (en) 2016-05-31 2019-07-02 Honeywell International Inc. Fabrication of three-dimensional structures using reflowed molding
US11107703B2 (en) 2019-07-12 2021-08-31 Neuralink Corp. Monolithic, biocompatible feedthrough for hermetically sealed electronics and methods of manufacture
JP7198950B2 (ja) 2019-07-12 2023-01-04 ニューラリンク コーポレーション ロボット脳外科手術用の光コヒーレンストモグラフィ
JP2022541146A (ja) 2019-07-12 2022-09-22 ニューラリンク コーポレーション プリント回路基板（ｐｃｂ）が両面において薄膜電極アレイと複数の集積回路（ｉｃ）とで挟まれて配置される部品、および製造方法

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