CA2778319C - Method of embedding material in a glass substrate - Google Patents

Method of embedding material in a glass substrate Download PDF

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Publication number
CA2778319C
CA2778319C CA2778319A CA2778319A CA2778319C CA 2778319 C CA2778319 C CA 2778319C CA 2778319 A CA2778319 A CA 2778319A CA 2778319 A CA2778319 A CA 2778319A CA 2778319 C CA2778319 C CA 2778319C
Authority
CA
Canada
Prior art keywords
glass
mold substrate
patterned surface
glass composition
substrate
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
CA2778319A
Other languages
English (en)
French (fr)
Other versions
CA2778319A1 (en
Inventor
Razi-Ul Haque
Kensall Wise
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
University of Michigan (System)
Original Assignee
University of Michigan (System)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by University of Michigan (System) filed Critical University of Michigan (System)
Publication of CA2778319A1 publication Critical patent/CA2778319A1/en
Application granted granted Critical
Publication of CA2778319C publication Critical patent/CA2778319C/en
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C03—GLASS; MINERAL OR SLAG WOOL
    • C03C—CHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
    • C03C19/00—Surface treatment of glass, not in the form of fibres or filaments, by mechanical means
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B81—MICROSTRUCTURAL TECHNOLOGY
    • B81C—PROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTURE OR TREATMENT OF MICROSTRUCTURAL DEVICES OR SYSTEMS
    • B81C1/00—Manufacture or treatment of devices or systems in or on a substrate
    • B81C1/00015—Manufacture or treatment of devices or systems in or on a substrate for manufacturing microsystems
    • B81C1/00023—Manufacture or treatment of devices or systems in or on a substrate for manufacturing microsystems without movable or flexible elements
    • B81C1/00095—Interconnects
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F04—POSITIVE - DISPLACEMENT MACHINES FOR LIQUIDS; PUMPS FOR LIQUIDS OR ELASTIC FLUIDS
    • F04B—POSITIVE-DISPLACEMENT MACHINES FOR LIQUIDS; PUMPS
    • F04B19/00—Machines or pumps having pertinent characteristics not provided for in, or of interest apart from, groups F04B1/00 - F04B17/00
    • F04B19/006—Micropumps
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B81—MICROSTRUCTURAL TECHNOLOGY
    • B81B—MICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICAL DEVICES
    • B81B2201/00—Specific applications of microelectromechanical systems
    • B81B2201/03—Microengines and actuators
    • B81B2201/036—Micropumps
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B81—MICROSTRUCTURAL TECHNOLOGY
    • B81B—MICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICAL DEVICES
    • B81B2201/00—Specific applications of microelectromechanical systems
    • B81B2201/05—Microfluidics
    • B81B2201/058—Microfluidics not provided for in B81B2201/051 - B81B2201/054
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/24—Structurally defined web or sheet [e.g., overall dimension, etc.]
    • Y10T428/24479—Structurally defined web or sheet [e.g., overall dimension, etc.] including variation in thickness

Landscapes

  • Engineering & Computer Science (AREA)
  • Chemical & Material Sciences (AREA)
  • Manufacturing & Machinery (AREA)
  • Mechanical Engineering (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Analytical Chemistry (AREA)
  • General Engineering & Computer Science (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • General Chemical & Material Sciences (AREA)
  • Geochemistry & Mineralogy (AREA)
  • Materials Engineering (AREA)
  • Organic Chemistry (AREA)
  • Micromachines (AREA)
  • Surface Treatment Of Glass (AREA)
CA2778319A 2009-10-19 2010-10-19 Method of embedding material in a glass substrate Active CA2778319C (en)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US12/581,695 2009-10-19
US12/581,695 US8707734B2 (en) 2009-10-19 2009-10-19 Method of embedding material in a glass substrate
PCT/US2010/053221 WO2011049963A2 (en) 2009-10-19 2010-10-19 Method of embedding material in a glass substrate

Publications (2)

Publication Number Publication Date
CA2778319A1 CA2778319A1 (en) 2011-04-28
CA2778319C true CA2778319C (en) 2018-04-17

Family

ID=43879519

Family Applications (1)

Application Number Title Priority Date Filing Date
CA2778319A Active CA2778319C (en) 2009-10-19 2010-10-19 Method of embedding material in a glass substrate

Country Status (6)

Country Link
US (1) US8707734B2 (enExample)
EP (1) EP2491587B1 (enExample)
JP (1) JP5964750B2 (enExample)
AU (1) AU2010308235B2 (enExample)
CA (1) CA2778319C (enExample)
WO (1) WO2011049963A2 (enExample)

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US10130946B2 (en) 2011-09-30 2018-11-20 The Regents Of The University Of Michigan System for detecting rare cells
WO2013049636A1 (en) 2011-09-30 2013-04-04 The Regents Of The University Of Michigan System for detecting rare cells
US9981844B2 (en) * 2012-03-08 2018-05-29 Infineon Technologies Ag Method of manufacturing semiconductor device with glass pieces
US10115671B2 (en) 2012-08-03 2018-10-30 Snaptrack, Inc. Incorporation of passives and fine pitch through via for package on package
US10073024B2 (en) 2012-10-29 2018-09-11 The Regents Of The University Of Michigan Microfluidic device and method for detecting rare cells
US9090499B2 (en) 2013-03-10 2015-07-28 Qualcomm Incorporated Method and apparatus for light induced etching of glass substrates in the fabrication of electronic circuits
US20140264655A1 (en) * 2013-03-13 2014-09-18 Invensense, Inc. Surface roughening to reduce adhesion in an integrated mems device
US9730638B2 (en) 2013-03-13 2017-08-15 Glaukos Corporation Intraocular physiological sensor
US9136165B2 (en) * 2013-06-04 2015-09-15 Invensense, Inc. Methods for stiction reduction in MEMS sensors
US10464836B2 (en) 2013-10-10 2019-11-05 Medtronic, Inc. Hermetic conductive feedthroughs for a semiconductor wafer
US10317406B2 (en) 2015-04-06 2019-06-11 The Regents Of The University Of Michigan System for detecting rare cells
US10335978B2 (en) 2016-05-31 2019-07-02 Honeywell International Inc. Fabrication of three-dimensional structures using reflowed molding
JP2022541146A (ja) 2019-07-12 2022-09-22 ニューラリンク コーポレーション プリント回路基板(pcb)が両面において薄膜電極アレイと複数の集積回路(ic)とで挟まれて配置される部品、および製造方法
AU2020315738A1 (en) 2019-07-12 2022-02-10 Neuralink Corp. Real-time neural spike detection
EP3997045B1 (en) 2019-07-12 2025-04-16 Neuralink Corp. Monolithic, biocompatible feedthrough for hermetically sealed electronics and methods of manufacture
JP7198950B2 (ja) 2019-07-12 2023-01-04 ニューラリンク コーポレーション ロボット脳外科手術用の光コヒーレンストモグラフィ

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Also Published As

Publication number Publication date
AU2010308235B2 (en) 2014-11-13
EP2491587B1 (en) 2017-08-16
JP5964750B2 (ja) 2016-08-03
EP2491587A2 (en) 2012-08-29
JP2013508254A (ja) 2013-03-07
EP2491587A4 (en) 2015-11-18
US20110091687A1 (en) 2011-04-21
WO2011049963A2 (en) 2011-04-28
US8707734B2 (en) 2014-04-29
CA2778319A1 (en) 2011-04-28
AU2010308235A1 (en) 2012-05-10
WO2011049963A3 (en) 2011-08-18

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Effective date: 20151007

H11 Ip right ceased following rejected request for revival

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Effective date: 20250422