JP2017021878A - 回路付きサスペンション基板集合体シート、その製造方法およびその検査方法 - Google Patents

回路付きサスペンション基板集合体シート、その製造方法およびその検査方法 Download PDF

Info

Publication number
JP2017021878A
JP2017021878A JP2015139801A JP2015139801A JP2017021878A JP 2017021878 A JP2017021878 A JP 2017021878A JP 2015139801 A JP2015139801 A JP 2015139801A JP 2015139801 A JP2015139801 A JP 2015139801A JP 2017021878 A JP2017021878 A JP 2017021878A
Authority
JP
Japan
Prior art keywords
inspection
circuit
insulating layer
suspension
substrate
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2015139801A
Other languages
English (en)
Japanese (ja)
Other versions
JP2017021878A5 (https=
Inventor
悠 杉本
Yu Sugimoto
悠 杉本
浩之 田辺
Hiroyuki Tanabe
浩之 田辺
直弘 寺田
Naohiro Terada
直弘 寺田
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Nitto Denko Corp
Original Assignee
Nitto Denko Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nitto Denko Corp filed Critical Nitto Denko Corp
Priority to JP2015139801A priority Critical patent/JP2017021878A/ja
Priority to US15/208,655 priority patent/US10201077B2/en
Priority to CN201610552187.5A priority patent/CN106356079B/zh
Publication of JP2017021878A publication Critical patent/JP2017021878A/ja
Publication of JP2017021878A5 publication Critical patent/JP2017021878A5/ja
Pending legal-status Critical Current

Links

Images

Classifications

    • G—PHYSICS
    • G11—INFORMATION STORAGE
    • G11B—INFORMATION STORAGE BASED ON RELATIVE MOVEMENT BETWEEN RECORD CARRIER AND TRANSDUCER
    • G11B5/00—Recording by magnetisation or demagnetisation of a record carrier; Reproducing by magnetic means; Record carriers therefor
    • G11B5/48—Disposition or mounting of heads or head supports relative to record carriers ; arrangements of heads, e.g. for scanning the record carrier to increase the relative speed
    • G11B5/4806—Disposition or mounting of heads or head supports relative to record carriers ; arrangements of heads, e.g. for scanning the record carrier to increase the relative speed specially adapted for disk drive assemblies, e.g. assembly prior to operation, hard or flexible disk drives
    • G11B5/484—Integrated arm assemblies, e.g. formed by material deposition or by etching from single piece of metal or by lamination of materials forming a single arm/suspension/head unit
    • G—PHYSICS
    • G11—INFORMATION STORAGE
    • G11B—INFORMATION STORAGE BASED ON RELATIVE MOVEMENT BETWEEN RECORD CARRIER AND TRANSDUCER
    • G11B5/00—Recording by magnetisation or demagnetisation of a record carrier; Reproducing by magnetic means; Record carriers therefor
    • G11B5/48—Disposition or mounting of heads or head supports relative to record carriers ; arrangements of heads, e.g. for scanning the record carrier to increase the relative speed
    • G11B5/4806—Disposition or mounting of heads or head supports relative to record carriers ; arrangements of heads, e.g. for scanning the record carrier to increase the relative speed specially adapted for disk drive assemblies, e.g. assembly prior to operation, hard or flexible disk drives
    • G11B5/486—Disposition or mounting of heads or head supports relative to record carriers ; arrangements of heads, e.g. for scanning the record carrier to increase the relative speed specially adapted for disk drive assemblies, e.g. assembly prior to operation, hard or flexible disk drives with provision for mounting or arranging electrical conducting means or circuits on or along the arm assembly
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/04—Housings; Supporting members; Arrangements of terminals
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0266—Marks, test patterns or identification means
    • H05K1/0268—Marks, test patterns or identification means for electrical inspection or testing
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/11—Printed elements for providing electric connections to or between printed circuits
    • H05K1/115—Via connections; Lands around holes or via connections
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/14—Structural association of two or more printed circuits
    • H05K1/142—Arrangements of planar printed circuit boards in the same plane, e.g. auxiliary printed circuit insert mounted in a main printed circuit
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/0097—Processing two or more printed circuits simultaneously, e.g. made from a common substrate, or temporarily stacked circuit boards
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
    • H05K3/42—Plated through-holes or plated via connections
    • H05K3/423—Plated through-holes or plated via connections characterised by electroplating method
    • H05K3/424—Plated through-holes or plated via connections characterised by electroplating method by direct electroplating
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28—Testing of electronic circuits, e.g. by signal tracer
    • G01R31/2801—Testing of printed circuits, backplanes, motherboards, hybrid circuits or carriers for multichip packages [MCP]
    • G01R31/2818—Testing of printed circuits, backplanes, motherboards, hybrid circuits or carriers for multichip packages [MCP] using test structures on, or modifications of, the card under test, made for the purpose of testing, e.g. additional components or connectors
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/05—Insulated conductive substrates, e.g. insulated metal substrate
    • H05K1/056—Insulated conductive substrates, e.g. insulated metal substrate the metal substrate being covered by an organic insulating layer
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/01—Tools for processing; Objects used during processing
    • H05K2203/0147—Carriers and holders
    • H05K2203/0165—Holder for holding a Printed Circuit Board [PCB] during processing, e.g. during screen printing
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/16—Inspection; Monitoring; Aligning
    • H05K2203/162—Testing a finished product, e.g. heat cycle testing of solder joints

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)
  • Adjustment Of The Magnetic Head Position Track Following On Tapes (AREA)
  • Supporting Of Heads In Record-Carrier Devices (AREA)
  • Insulated Metal Substrates For Printed Circuits (AREA)
  • Testing Of Short-Circuits, Discontinuities, Leakage, Or Incorrect Line Connections (AREA)
JP2015139801A 2015-07-13 2015-07-13 回路付きサスペンション基板集合体シート、その製造方法およびその検査方法 Pending JP2017021878A (ja)

Priority Applications (3)

Application Number Priority Date Filing Date Title
JP2015139801A JP2017021878A (ja) 2015-07-13 2015-07-13 回路付きサスペンション基板集合体シート、その製造方法およびその検査方法
US15/208,655 US10201077B2 (en) 2015-07-13 2016-07-13 Suspension board assembly sheet having circuits, method of manufacturing the same and method of inspecting the same
CN201610552187.5A CN106356079B (zh) 2015-07-13 2016-07-13 带电路的悬挂基板集合体片及其制造方法和检查方法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2015139801A JP2017021878A (ja) 2015-07-13 2015-07-13 回路付きサスペンション基板集合体シート、その製造方法およびその検査方法

Publications (2)

Publication Number Publication Date
JP2017021878A true JP2017021878A (ja) 2017-01-26
JP2017021878A5 JP2017021878A5 (https=) 2017-03-02

Family

ID=57775416

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2015139801A Pending JP2017021878A (ja) 2015-07-13 2015-07-13 回路付きサスペンション基板集合体シート、その製造方法およびその検査方法

Country Status (3)

Country Link
US (1) US10201077B2 (https=)
JP (1) JP2017021878A (https=)
CN (1) CN106356079B (https=)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2022113649A1 (ja) * 2020-11-25 2022-06-02 日東電工株式会社 配線回路基板
JP2024015875A (ja) * 2022-07-25 2024-02-06 日東電工株式会社 配線回路基板の導通検査方法および配線回路基板の製造方法

Families Citing this family (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR102352316B1 (ko) * 2015-08-11 2022-01-18 삼성전자주식회사 인쇄 회로 기판
KR102432541B1 (ko) * 2015-09-24 2022-08-17 주식회사 기가레인 벤딩 내구성이 개선된 연성회로기판 및 그 제조방법
CN108886032A (zh) * 2017-01-03 2018-11-23 深圳市汇顶科技股份有限公司 一种封装芯片的基板结构
TWI639365B (zh) 2017-05-15 2018-10-21 欣興電子股份有限公司 線路基板及線路基板的製造方法
CN108962867B (zh) * 2017-05-22 2020-08-11 欣兴电子股份有限公司 线路基板及线路基板的制造方法
JP2019096508A (ja) * 2017-11-24 2019-06-20 川崎重工業株式会社 筐体
JP7060450B2 (ja) * 2018-05-31 2022-04-26 日東電工株式会社 配線回路基板集合体シート、その製造方法および配線回路基板の製造方法

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2013109803A (ja) * 2011-11-21 2013-06-06 Nitto Denko Corp 配線回路基板およびその製造方法
JP2014096423A (ja) * 2012-11-08 2014-05-22 Nitto Denko Corp 回路付きサスペンション基板集合体シートおよびその製造方法

Family Cites Families (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5494300B2 (ja) 2010-07-06 2014-05-14 大日本印刷株式会社 支持枠付サスペンション用基板およびその製造方法
CN102446513B (zh) 2010-10-12 2015-09-23 日东电工株式会社 带电路的悬挂基板及其制造方法
JP5996850B2 (ja) 2010-10-12 2016-09-21 日東電工株式会社 回路付サスペンション基板およびその製造方法
JP5093701B2 (ja) * 2010-12-28 2012-12-12 大日本印刷株式会社 サスペンション用基板、サスペンション、ヘッド付サスペンション、およびハードディスクドライブ、並びにサスペンション用基板の製造方法
JP5896845B2 (ja) 2011-08-22 2016-03-30 日東電工株式会社 配線回路基板
JP6043613B2 (ja) * 2012-12-11 2016-12-14 日東電工株式会社 回路付サスペンション基板
JP6125305B2 (ja) * 2013-04-19 2017-05-10 日東電工株式会社 回路付きサスペンション基板および回路付きサスペンション基板集合体シートならびにこれらの製造方法
US9025283B1 (en) * 2013-09-18 2015-05-05 Western Digital Technologies, Inc. Laminated suspension flexure with open polyimide base
JP6180920B2 (ja) 2013-12-19 2017-08-16 日東電工株式会社 回路付きサスペンション基板集合体シートおよびその製造方法
JP6228454B2 (ja) * 2013-12-26 2017-11-08 日東電工株式会社 回路付サスペンション基板およびその製造方法

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2013109803A (ja) * 2011-11-21 2013-06-06 Nitto Denko Corp 配線回路基板およびその製造方法
JP2014096423A (ja) * 2012-11-08 2014-05-22 Nitto Denko Corp 回路付きサスペンション基板集合体シートおよびその製造方法

Cited By (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2022113649A1 (ja) * 2020-11-25 2022-06-02 日東電工株式会社 配線回路基板
JP2022083877A (ja) * 2020-11-25 2022-06-06 日東電工株式会社 配線回路基板
JP7179044B2 (ja) 2020-11-25 2022-11-28 日東電工株式会社 配線回路基板
JP2023009177A (ja) * 2020-11-25 2023-01-19 日東電工株式会社 配線回路基板
JP7499823B2 (ja) 2020-11-25 2024-06-14 日東電工株式会社 配線回路基板
US12598703B2 (en) 2020-11-25 2026-04-07 Nitto Denko Corporation Wiring circuit board
JP2024015875A (ja) * 2022-07-25 2024-02-06 日東電工株式会社 配線回路基板の導通検査方法および配線回路基板の製造方法

Also Published As

Publication number Publication date
US10201077B2 (en) 2019-02-05
CN106356079B (zh) 2020-08-28
CN106356079A (zh) 2017-01-25
US20170019985A1 (en) 2017-01-19

Similar Documents

Publication Publication Date Title
JP2017021878A (ja) 回路付きサスペンション基板集合体シート、その製造方法およびその検査方法
JP4547035B2 (ja) 配線回路基板およびその製造方法
JP6042484B2 (ja) 回路付サスペンション基板およびその製造方法
JP5484176B2 (ja) 配線回路基板およびその製造方法
JP2009206281A (ja) 配線回路基板
JP5562619B2 (ja) 電子部品と配線回路基板との接続構造、配線回路基板アッセンブリ、および、電子部品の検査方法
CN101155467B (zh) 布线电路基板的制造方法
JP2009129490A (ja) 配線回路基板
JP2012009111A (ja) フレキシャ及びその配線部形成方法
JP2010114366A (ja) 配線回路基板およびその製造方法
US9451704B2 (en) Suspension board assembly sheet with circuits and method for manufacturing the same
JP6129465B2 (ja) サスペンション用基板、サスペンション、ヘッド付サスペンション、およびハードディスクドライブ、並びにサスペンション用基板の製造方法
US9648726B2 (en) Suspension board assembly sheet with circuits and manufacturing method of the same
JP2013211092A (ja) サスペンション用基板、サスペンション、ヘッド付サスペンション、およびハードディスクドライブ、並びにサスペンション用基板の製造方法
US20100110649A1 (en) Suspension board with circuit
TWI439187B (zh) 可撓性印刷配線板薄片及其製造方法
US9576603B2 (en) Suspension board with circuit
JP5924909B2 (ja) 配線回路基板およびその製造方法
CN101504836B (zh) 配线电路基板及其制造方法
JP2018200742A (ja) 回路付サスペンション基板およびその製造方法

Legal Events

Date Code Title Description
A521 Request for written amendment filed

Free format text: JAPANESE INTERMEDIATE CODE: A523

Effective date: 20161220

A621 Written request for application examination

Free format text: JAPANESE INTERMEDIATE CODE: A621

Effective date: 20180523

A977 Report on retrieval

Free format text: JAPANESE INTERMEDIATE CODE: A971007

Effective date: 20190206

A131 Notification of reasons for refusal

Free format text: JAPANESE INTERMEDIATE CODE: A131

Effective date: 20190305

A521 Request for written amendment filed

Free format text: JAPANESE INTERMEDIATE CODE: A523

Effective date: 20190422

A02 Decision of refusal

Free format text: JAPANESE INTERMEDIATE CODE: A02

Effective date: 20190625