JP2016534465A5 - - Google Patents

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Publication number
JP2016534465A5
JP2016534465A5 JP2016538947A JP2016538947A JP2016534465A5 JP 2016534465 A5 JP2016534465 A5 JP 2016534465A5 JP 2016538947 A JP2016538947 A JP 2016538947A JP 2016538947 A JP2016538947 A JP 2016538947A JP 2016534465 A5 JP2016534465 A5 JP 2016534465A5
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JP
Japan
Prior art keywords
substrate
conductive
conductive pattern
pattern
layer
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JP2016538947A
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English (en)
Japanese (ja)
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JP2016534465A (ja
JP6457528B2 (ja
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Priority claimed from PCT/US2014/050471 external-priority patent/WO2015031033A1/en
Publication of JP2016534465A publication Critical patent/JP2016534465A/ja
Publication of JP2016534465A5 publication Critical patent/JP2016534465A5/ja
Application granted granted Critical
Publication of JP6457528B2 publication Critical patent/JP6457528B2/ja
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JP2016538947A 2013-08-28 2014-08-11 以降の処理工程中における、正確な位置合わせのための、基準マークを備える電子アセンブリ Active JP6457528B2 (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US201361871244P 2013-08-28 2013-08-28
US61/871,244 2013-08-28
PCT/US2014/050471 WO2015031033A1 (en) 2013-08-28 2014-08-11 Electronic assembly with fiducial marks for precision registration during subsequent processing steps

Publications (3)

Publication Number Publication Date
JP2016534465A JP2016534465A (ja) 2016-11-04
JP2016534465A5 true JP2016534465A5 (enExample) 2017-08-17
JP6457528B2 JP6457528B2 (ja) 2019-01-23

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ID=52587201

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2016538947A Active JP6457528B2 (ja) 2013-08-28 2014-08-11 以降の処理工程中における、正確な位置合わせのための、基準マークを備える電子アセンブリ

Country Status (7)

Country Link
US (1) US9807871B2 (enExample)
EP (1) EP3039949A4 (enExample)
JP (1) JP6457528B2 (enExample)
KR (1) KR102182751B1 (enExample)
CN (1) CN105474760B (enExample)
SG (1) SG11201601075PA (enExample)
WO (1) WO2015031033A1 (enExample)

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JP5687175B2 (ja) * 2011-11-28 2015-03-18 有限会社 ナプラ 微細空間内に機能部分を形成する方法
US9766732B2 (en) * 2014-06-20 2017-09-19 3M Innovative Properties Company Printing of multiple inks to achieve precision registration during subsequent processing
TWI564762B (zh) * 2015-04-22 2017-01-01 恆顥科技股份有限公司 觸控薄膜疊層卷的製作方法與所製得之觸控薄膜疊層片
US20170148152A1 (en) * 2015-11-25 2017-05-25 General Electric Company Systems and Methods for Monitoring Component Strain
GB2551502A (en) * 2016-06-17 2017-12-27 M-Solv Ltd Apparatus and methods for manufacturing a sensor and a display, and a sensor and a display
US11279859B2 (en) 2016-12-07 2022-03-22 3M Innovative Properties Company Methods of passivating adhesives
CN113226572A (zh) * 2018-12-26 2021-08-06 日东电工株式会社 可剥离涂膜的剥离方法及物品
CN113302555A (zh) * 2018-12-27 2021-08-24 富士胶片株式会社 导电性转印材料、附有图案的基板的制造方法、层叠体及触控面板
WO2020170817A1 (ja) * 2019-02-20 2020-08-27 日東電工株式会社 積層体
US12365174B2 (en) 2023-09-12 2025-07-22 Eastman Kodak Company Ink tray insert
US12311652B2 (en) 2023-09-12 2025-05-27 Eastman Kodak Company Inking system with plurality of fountain roller elements
WO2025058912A1 (en) 2023-09-12 2025-03-20 Eastman Kodak Company Inking system with segmented fountain roller
US12220904B1 (en) 2023-09-12 2025-02-11 Eastman Kodak Company Inking system with segmented fountain roller

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WO2014088950A1 (en) 2012-12-07 2014-06-12 3M Innovative Properties Company Method of making transparent conductors on a substrate
WO2014099507A1 (en) 2012-12-20 2014-06-26 3M Innovative Properties Company Printing of multiple inks to achieve precision registration during subsequent processing
CN103034366B (zh) 2012-12-21 2016-08-31 北京京东方光电科技有限公司 一种显示基板制作方法及黑矩阵、显示基板、显示装置

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