JP2016534465A5 - - Google Patents

Download PDF

Info

Publication number
JP2016534465A5
JP2016534465A5 JP2016538947A JP2016538947A JP2016534465A5 JP 2016534465 A5 JP2016534465 A5 JP 2016534465A5 JP 2016538947 A JP2016538947 A JP 2016538947A JP 2016538947 A JP2016538947 A JP 2016538947A JP 2016534465 A5 JP2016534465 A5 JP 2016534465A5
Authority
JP
Japan
Prior art keywords
substrate
conductive
conductive pattern
pattern
layer
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP2016538947A
Other languages
English (en)
Japanese (ja)
Other versions
JP6457528B2 (ja
JP2016534465A (ja
Filing date
Publication date
Application filed filed Critical
Priority claimed from PCT/US2014/050471 external-priority patent/WO2015031033A1/en
Publication of JP2016534465A publication Critical patent/JP2016534465A/ja
Publication of JP2016534465A5 publication Critical patent/JP2016534465A5/ja
Application granted granted Critical
Publication of JP6457528B2 publication Critical patent/JP6457528B2/ja
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

JP2016538947A 2013-08-28 2014-08-11 以降の処理工程中における、正確な位置合わせのための、基準マークを備える電子アセンブリ Active JP6457528B2 (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US201361871244P 2013-08-28 2013-08-28
US61/871,244 2013-08-28
PCT/US2014/050471 WO2015031033A1 (en) 2013-08-28 2014-08-11 Electronic assembly with fiducial marks for precision registration during subsequent processing steps

Publications (3)

Publication Number Publication Date
JP2016534465A JP2016534465A (ja) 2016-11-04
JP2016534465A5 true JP2016534465A5 (enExample) 2017-08-17
JP6457528B2 JP6457528B2 (ja) 2019-01-23

Family

ID=52587201

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2016538947A Active JP6457528B2 (ja) 2013-08-28 2014-08-11 以降の処理工程中における、正確な位置合わせのための、基準マークを備える電子アセンブリ

Country Status (7)

Country Link
US (1) US9807871B2 (enExample)
EP (1) EP3039949A4 (enExample)
JP (1) JP6457528B2 (enExample)
KR (1) KR102182751B1 (enExample)
CN (1) CN105474760B (enExample)
SG (1) SG11201601075PA (enExample)
WO (1) WO2015031033A1 (enExample)

Families Citing this family (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5687175B2 (ja) * 2011-11-28 2015-03-18 有限会社 ナプラ 微細空間内に機能部分を形成する方法
CN109353136B (zh) * 2014-06-20 2020-08-04 3M创新有限公司 在后续处理期间实现精确配准的多种油墨的印刷
TWI564762B (zh) * 2015-04-22 2017-01-01 恆顥科技股份有限公司 觸控薄膜疊層卷的製作方法與所製得之觸控薄膜疊層片
US20170148152A1 (en) * 2015-11-25 2017-05-25 General Electric Company Systems and Methods for Monitoring Component Strain
GB2551502A (en) * 2016-06-17 2017-12-27 M-Solv Ltd Apparatus and methods for manufacturing a sensor and a display, and a sensor and a display
EP3551347B1 (en) 2016-12-07 2024-03-27 3M Innovative Properties Company Methods of passivating adhesives
US20220089884A1 (en) * 2018-12-26 2022-03-24 Nitto Denko Corporation Method for debonding debondable coating film and article
CN113302555A (zh) * 2018-12-27 2021-08-24 富士胶片株式会社 导电性转印材料、附有图案的基板的制造方法、层叠体及触控面板
KR20210132035A (ko) * 2019-02-20 2021-11-03 닛토덴코 가부시키가이샤 적층체
EP4777336A1 (en) 2023-09-12 2026-07-22 Eastman Kodak Company Inking system with segmented fountain roller
US12311652B2 (en) 2023-09-12 2025-05-27 Eastman Kodak Company Inking system with plurality of fountain roller elements
US12365174B2 (en) 2023-09-12 2025-07-22 Eastman Kodak Company Ink tray insert
US12220904B1 (en) 2023-09-12 2025-02-11 Eastman Kodak Company Inking system with segmented fountain roller

Family Cites Families (42)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4165688A (en) 1977-04-14 1979-08-28 Magna-Graphics Corporation Ink dam for printing press
FR2421732A1 (fr) 1978-04-07 1979-11-02 Sarda Jean Lucien Procede et mecanisme d'encrage en une ou plusieurs couleurs pour impressions typographiques, offset ou autres
JPS5752021A (en) * 1980-09-12 1982-03-27 Citizen Watch Co Ltd Manufacture of liquid crystal display cell
DE3320638C2 (de) 1983-06-08 1986-10-16 Koenig & Bauer AG, 8700 Würzburg Farbabteileinrichtung an Farbkastenwalzen von Druckmaschinen
DE3505598C2 (de) 1984-10-30 1986-08-14 Windmöller & Hölscher, 4540 Lengerich Spülfarbwerk mit geteilter Farbkammerrakel
DE3709177A1 (de) 1987-03-20 1988-09-29 Leybold Ag Verfahren und vorrichtung zur regelung der reaktiven schichtabscheidung auf substraten mittels magnetronkatoden
US4796528A (en) 1987-05-29 1989-01-10 M.A.N. Roland Druckmaschinen Ag Separated ink fountain for a flexographic printing machine
US5012736A (en) 1987-09-21 1991-05-07 Paper Converting Machine Company Sealing assembly for liquid fountain
JPH05327178A (ja) * 1991-03-28 1993-12-10 Unitika Ltd 透明導電性基体の連続製造方法
US5150651A (en) 1991-06-10 1992-09-29 Flores Carlos R Doctor-blade assembly for flexographic press
US5243907A (en) 1992-01-22 1993-09-14 The Langston Corporation Divider seal for split-fountain chambered doctor blade for a flexographic printing press
US5440446A (en) 1993-10-04 1995-08-08 Catalina Coatings, Inc. Acrylate coating material
JP3302296B2 (ja) 1997-05-30 2002-07-15 キヤノン株式会社 カラーフィルタの製造方法
KR100315911B1 (ko) 1997-10-10 2002-09-25 삼성전자 주식회사 액정 표시 장치 패널, 그 제조 방법 및 정렬 방법
US6029574A (en) 1998-09-30 2000-02-29 Heidelberger Druckmaschinen Ag Dual ink supply system
US7052824B2 (en) 2000-06-30 2006-05-30 E. I. Du Pont De Nemours And Company Process for thick film circuit patterning
US6975067B2 (en) 2002-12-19 2005-12-13 3M Innovative Properties Company Organic electroluminescent device and encapsulation method
US7018713B2 (en) 2003-04-02 2006-03-28 3M Innovative Properties Company Flexible high-temperature ultrabarrier
KR101223098B1 (ko) 2004-09-09 2013-01-17 삼성디스플레이 주식회사 표시장치 및 이의 제조방법
US20060291481A1 (en) 2005-06-27 2006-12-28 Matsushita Electric Industrial Co., Ltd. Application session resumption in mobile environments
EP3473681B1 (en) 2005-08-12 2020-10-07 Cambrios Film Solutions Corporation Nanowires-based transparent conductors
JP4068635B2 (ja) * 2005-09-30 2008-03-26 松下電器産業株式会社 配線基板
JP5409369B2 (ja) 2006-10-12 2014-02-05 カンブリオス テクノロジーズ コーポレイション ナノワイヤベースの透明導電体およびその適用
KR101442290B1 (ko) * 2007-01-11 2014-09-19 쓰리엠 이노베이티브 프로퍼티즈 컴파니 웨브 종방향 위치 센서
KR101647265B1 (ko) 2007-06-19 2016-08-09 쓰리엠 이노베이티브 프로퍼티즈 컴파니 변위 스케일을 제조하는 시스템 및 방법
EP2165162A2 (en) 2007-06-19 2010-03-24 3M Innovative Properties Company Total internal reflection displacement scale
KR101390767B1 (ko) * 2007-08-31 2014-04-30 엘지디스플레이 주식회사 표시소자 제조방법
US7829168B2 (en) * 2007-11-21 2010-11-09 Promos Technologies Pte. Ltd. Methods for inspecting and optionally reworking summed photolithography patterns resulting from plurally-overlaid patterning steps during mass production of semiconductor devices
JP2011515510A (ja) 2008-02-26 2011-05-19 カンブリオス テクノロジーズ コーポレイション 導電性特徴をスクリーン印刷するための方法および組成物
JP2010021293A (ja) 2008-07-09 2010-01-28 Nec Electronics Corp 半導体装置および半導体装置の製造方法
JP4754613B2 (ja) * 2008-11-27 2011-08-24 日東電工株式会社 光電気混載基板およびその製造方法
KR101667071B1 (ko) 2008-12-29 2016-10-17 쓰리엠 이노베이티브 프로퍼티즈 컴파니 웨브 기점을 사용한 위상-고정된 웨브 위치 신호
US8992104B2 (en) 2008-12-30 2015-03-31 3M Innovative Properties Company Apparatus and method for making fiducials on a substrate
JP4966996B2 (ja) 2009-05-19 2012-07-04 東芝機械株式会社 レール支持装置およびシートの延伸方法
SG183319A1 (en) 2010-03-12 2012-09-27 Sharp Kk Circuit board, substrate module, and display device
JP5664088B2 (ja) 2010-09-30 2015-02-04 大日本印刷株式会社 アライメントマーク基板、素子、および素子の製造方法
JP2012169060A (ja) * 2011-02-10 2012-09-06 Shin Etsu Polymer Co Ltd 導電パターン形成基板の製造方法
JP5774686B2 (ja) * 2011-04-26 2015-09-09 日本メクトロン株式会社 透明プリント配線板の製造方法、および透明タッチパネルの製造方法
JP5866995B2 (ja) * 2011-11-16 2016-02-24 三菱電機株式会社 タッチパネル基板の製造方法
BR112015013033A2 (pt) 2012-12-07 2017-07-11 3M Innovative Properties Co método de fabricação de condutores transparentes sobre substrato
EP2934768B1 (en) 2012-12-20 2017-08-23 3M Innovative Properties Company Printing of multiple inks to achieve precision registration during subsequent processing
CN103034366B (zh) 2012-12-21 2016-08-31 北京京东方光电科技有限公司 一种显示基板制作方法及黑矩阵、显示基板、显示装置

Similar Documents

Publication Publication Date Title
CN105474760B (zh) 具有用于精确配准的基准标记的电子组件
JP5486019B2 (ja) 導電性パターンおよびその製造方法
CN104798022B (zh) 用于触摸传感器电极的网格图案
JP2016509332A5 (enExample)
CN105453001B (zh) 将电子部件粘结到图案化纳米线透明导体
CN108885515A (zh) 对金属互连结构具有增强粘附性的纳米线接触垫
TWI449479B (zh) 線路之製造方法
CN103839923B (zh) 一种对位标记的制作方法及基板
US9766732B2 (en) Printing of multiple inks to achieve precision registration during subsequent processing
TW201545215A (zh) 金屬線路微結構之製法
US20150029411A1 (en) Touch panel, conductive film and method for manufacturing the same
JP2016535433A5 (enExample)
KR20160063368A (ko) 패턴화된 나노와이어 투명 전도체 상의 인쇄된 전도성 패턴을 위한 보호 코팅
US20140373742A1 (en) Method of manufacturing a high-resolution flexographic printing plate
US9542054B2 (en) Touch module and manufacturing method thereof
US10152183B2 (en) Thick-film pattern structure and method of forming the same
US9952697B2 (en) Touch module and manufacturing method thereof
US11284521B2 (en) Electronic devices comprising a via and methods of forming such electronic devices
US20120111619A1 (en) Circuit substrate and manufacturing method of circuit substrate
KR20130126008A (ko) 터치 패널의 투명전극 필름 및 그 제조 방법
CN105278709A (zh) 金属线路微结构的制法
JP2013070005A (ja) 印刷物の製造方法
TWI661439B (zh) 功能性膜之圖案化方法、電子裝置之製造方法及透明導電性薄膜
CN103928756B (zh) 一种电子器件加工方法
Darling Sequential infiltration synthesis lithography enables high-aspect ratio patterning of substrates