JP2016509332A5 - - Google Patents
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- JP2016509332A5 JP2016509332A5 JP2015546533A JP2015546533A JP2016509332A5 JP 2016509332 A5 JP2016509332 A5 JP 2016509332A5 JP 2015546533 A JP2015546533 A JP 2015546533A JP 2015546533 A JP2015546533 A JP 2015546533A JP 2016509332 A5 JP2016509332 A5 JP 2016509332A5
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- JP
- Japan
- Prior art keywords
- layer
- substrate
- conductive layer
- item
- regions
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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- 239000010410 layer Substances 0.000 claims description 94
- 229920000642 polymer Polymers 0.000 claims description 49
- 238000000034 method Methods 0.000 claims description 39
- 239000000758 substrate Substances 0.000 claims description 34
- 239000011159 matrix material Substances 0.000 claims description 26
- 239000007788 liquid Substances 0.000 claims description 25
- 239000011248 coating agent Substances 0.000 claims description 10
- 238000000576 coating method Methods 0.000 claims description 10
- 238000000059 patterning Methods 0.000 claims description 6
- 239000002070 nanowire Substances 0.000 claims description 5
- 239000000178 monomer Substances 0.000 claims description 4
- 239000012790 adhesive layer Substances 0.000 claims description 3
- 239000004020 conductor Substances 0.000 claims description 3
- 239000011247 coating layer Substances 0.000 claims description 2
- 238000003475 lamination Methods 0.000 claims description 2
- 229910052751 metal Inorganic materials 0.000 claims description 2
- 239000002184 metal Substances 0.000 claims description 2
- 239000002966 varnish Substances 0.000 claims description 2
- 239000013047 polymeric layer Substances 0.000 claims 1
- 239000000853 adhesive Substances 0.000 description 2
- 230000001070 adhesive effect Effects 0.000 description 2
- 239000004820 Pressure-sensitive adhesive Substances 0.000 description 1
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 1
- 230000006835 compression Effects 0.000 description 1
- 238000007906 compression Methods 0.000 description 1
- 238000007646 gravure printing Methods 0.000 description 1
- 238000007641 inkjet printing Methods 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 239000002245 particle Substances 0.000 description 1
- 238000007639 printing Methods 0.000 description 1
- 238000007650 screen-printing Methods 0.000 description 1
- 229910052709 silver Inorganic materials 0.000 description 1
- 239000004332 silver Substances 0.000 description 1
- 238000005507 spraying Methods 0.000 description 1
- 239000011800 void material Substances 0.000 description 1
Applications Claiming Priority (7)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US201261734793P | 2012-12-07 | 2012-12-07 | |
| US61/734,793 | 2012-12-07 | ||
| US201361782634P | 2013-03-14 | 2013-03-14 | |
| US61/782,634 | 2013-03-14 | ||
| US201361840876P | 2013-06-28 | 2013-06-28 | |
| US61/840,876 | 2013-06-28 | ||
| PCT/US2013/072624 WO2014088950A1 (en) | 2012-12-07 | 2013-12-02 | Method of making transparent conductors on a substrate |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JP2016509332A JP2016509332A (ja) | 2016-03-24 |
| JP2016509332A5 true JP2016509332A5 (enExample) | 2016-12-22 |
| JP6700787B2 JP6700787B2 (ja) | 2020-05-27 |
Family
ID=50883903
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2015546533A Expired - Fee Related JP6700787B2 (ja) | 2012-12-07 | 2013-12-02 | 基板上に透明導電体を製作する方法 |
Country Status (8)
| Country | Link |
|---|---|
| US (2) | US10254786B2 (enExample) |
| EP (1) | EP2929417A4 (enExample) |
| JP (1) | JP6700787B2 (enExample) |
| KR (1) | KR102145157B1 (enExample) |
| CN (1) | CN104838342B (enExample) |
| BR (1) | BR112015013033A2 (enExample) |
| SG (1) | SG11201504125UA (enExample) |
| WO (1) | WO2014088950A1 (enExample) |
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| FR3000917B1 (fr) * | 2013-01-11 | 2015-02-20 | Bobst Lyon | Procede de commande, pour commander une machine de transformation, machine de transformation et programme d'ordinateur pour realiser un tel procede de commande |
| CN105453001B (zh) | 2013-07-31 | 2018-10-16 | 3M创新有限公司 | 将电子部件粘结到图案化纳米线透明导体 |
| CN105474760B (zh) | 2013-08-28 | 2019-03-08 | 3M创新有限公司 | 具有用于精确配准的基准标记的电子组件 |
| EP3053012B1 (en) | 2013-09-30 | 2019-10-23 | 3M Innovative Properties Company | Protective coating for printed conductive pattern on patterned nanowire transparent conductors |
| WO2015069538A1 (en) | 2013-11-06 | 2015-05-14 | 3M Innovative Properties Company | Microcontact printing stamps with functional features |
| US10166571B2 (en) * | 2013-12-10 | 2019-01-01 | Lg Display Co., Ltd. | Refining method for microstructure |
| TWI564762B (zh) * | 2015-04-22 | 2017-01-01 | 恆顥科技股份有限公司 | 觸控薄膜疊層卷的製作方法與所製得之觸控薄膜疊層片 |
| US11284521B2 (en) | 2015-06-30 | 2022-03-22 | 3M Innovative Properties, Company | Electronic devices comprising a via and methods of forming such electronic devices |
| WO2017003820A1 (en) | 2015-06-30 | 2017-01-05 | 3M Innovative Properties Company | Patterned overcoat layer |
| KR20180033218A (ko) | 2015-07-21 | 2018-04-02 | 쓰리엠 이노베이티브 프로퍼티즈 컴파니 | 전기전도성 필름, 조립체, 및 전기전도성 패턴에서 정전하를 제거하는 방법 |
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| CN208488734U (zh) | 2015-08-21 | 2019-02-12 | 3M创新有限公司 | 包括金属迹线的透明导体 |
| SI3384368T1 (sl) * | 2015-12-04 | 2025-05-30 | Leonhard Kurz Stiftung & Co. Kg | Folija in postopek za izdelavo folije |
| CN108604482A (zh) * | 2016-03-18 | 2018-09-28 | 国立大学法人大阪大学 | 形成有金属纳米线层的基材及其制造方法 |
| KR102368257B1 (ko) | 2016-05-25 | 2022-02-28 | 쓰리엠 이노베이티브 프로퍼티즈 컴파니 | 터치 센서용 기판 |
| WO2018008530A1 (ja) * | 2016-07-08 | 2018-01-11 | 旭化成株式会社 | 導電性フィルム、電子ペーパー、タッチパネル、及びフラットパネルディスプレイ |
| CN110121921A (zh) * | 2016-12-29 | 2019-08-13 | 3M创新有限公司 | 用于制备导电图案的方法以及包含导电图案的制品 |
| KR101841946B1 (ko) * | 2017-02-24 | 2018-03-26 | 동우 화인켐 주식회사 | 장력 제어를 이용한 터치 센서 필름 제조방법 |
| DE102017106055B4 (de) * | 2017-03-21 | 2021-04-08 | Tdk Corporation | Trägersubstrat für stressempflindliches Bauelement und Verfahren zur Herstellung |
| JP7326167B2 (ja) | 2017-06-29 | 2023-08-15 | スリーエム イノベイティブ プロパティズ カンパニー | 物品及びその製造方法 |
| JP7253550B2 (ja) | 2017-11-30 | 2023-04-06 | スリーエム イノベイティブ プロパティズ カンパニー | 自己支持型３層積層体を含む基板 |
| US10058014B1 (en) | 2017-12-13 | 2018-08-21 | International Business Machines Corporation | Conductive adhesive layer for gasket assembly |
| JP2021003806A (ja) * | 2018-01-29 | 2021-01-14 | スリーエム イノベイティブ プロパティズ カンパニー | 糸状部材への印刷方法、及び糸状のこぎり |
| CN109871141B (zh) * | 2018-12-29 | 2023-02-03 | 赣州市德普特科技有限公司 | 一种触摸屏制作工艺中的布线区保护方法 |
| KR102755456B1 (ko) * | 2019-01-04 | 2025-01-20 | 삼성디스플레이 주식회사 | 표시 장치 및 이의 제조 방법 |
| US11261529B2 (en) * | 2020-03-31 | 2022-03-01 | Futuretech Capital, Inc. | Reduced visibility conductive micro mesh touch sensor |
| KR102461794B1 (ko) * | 2020-08-13 | 2022-11-02 | 한국과학기술연구원 | 은 나노와이어 메쉬 전극 및 이의 제조방법 |
| CN114496352A (zh) * | 2020-11-12 | 2022-05-13 | 天材创新材料科技(厦门)有限公司 | 纳米银线保护层结构及其制备方法 |
| US11961632B2 (en) | 2020-12-04 | 2024-04-16 | Korea Advanced Institute Of Science And Technology | Fabrication method of conductive nanonetworks using mastermold |
| KR102722102B1 (ko) | 2020-12-04 | 2024-10-28 | 한국과학기술원 | 희생층을 이용한 투명 전도성 네트워크 제조방법 |
| KR102628299B1 (ko) | 2020-12-04 | 2024-01-24 | 한국과학기술원 | 마스터몰드를 이용한 투명 전도성 네트워크 제조방법 |
| US12412678B2 (en) | 2020-12-04 | 2025-09-09 | Korea Advanced Institute Of Science And Technology | Fabrication method of conductive nanonetworks through adaptation of sacrificial layer |
| KR102722103B1 (ko) | 2020-12-04 | 2024-10-28 | 한국과학기술원 | 나노마스크를 이용한 투명 전도성 네트워크 제조방법 |
| US11513638B2 (en) | 2020-12-18 | 2022-11-29 | Cambrios Film Solutions Corporation | Silver nanowire protection layer structure and manufacturing method thereof |
| CN113764564B (zh) * | 2021-08-31 | 2024-01-23 | Tcl华星光电技术有限公司 | 基板制备方法及膜片结构 |
| KR102691766B1 (ko) * | 2022-10-25 | 2024-08-05 | 서울대학교산학협력단 | 나노와이어 함유 패턴의 제조방법 및 이를 이용하여 제조된 투명 전극 |
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-
2013
- 2013-12-02 CN CN201380063496.0A patent/CN104838342B/zh not_active Expired - Fee Related
- 2013-12-02 WO PCT/US2013/072624 patent/WO2014088950A1/en not_active Ceased
- 2013-12-02 US US14/649,979 patent/US10254786B2/en active Active
- 2013-12-02 SG SG11201504125UA patent/SG11201504125UA/en unknown
- 2013-12-02 EP EP13859618.4A patent/EP2929417A4/en not_active Ceased
- 2013-12-02 JP JP2015546533A patent/JP6700787B2/ja not_active Expired - Fee Related
- 2013-12-02 BR BR112015013033A patent/BR112015013033A2/pt not_active IP Right Cessation
- 2013-12-02 KR KR1020157017885A patent/KR102145157B1/ko not_active Expired - Fee Related
-
2019
- 2019-02-21 US US16/281,274 patent/US10831233B2/en active Active
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