JP6700787B2 - 基板上に透明導電体を製作する方法 - Google Patents

基板上に透明導電体を製作する方法 Download PDF

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Publication number
JP6700787B2
JP6700787B2 JP2015546533A JP2015546533A JP6700787B2 JP 6700787 B2 JP6700787 B2 JP 6700787B2 JP 2015546533 A JP2015546533 A JP 2015546533A JP 2015546533 A JP2015546533 A JP 2015546533A JP 6700787 B2 JP6700787 B2 JP 6700787B2
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layer
substrate
patterned
conductive
matrix material
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JP2016509332A5 (enExample
JP2016509332A (ja
Inventor
シー．ドッズ ショーン
シー．ドッズ ショーン
エス．ステイ マシュー
エス．ステイ マシュー
エル．ペクロフスキー ミカイル
エル．ペクロフスキー ミカイル
エイチ．フレイ マシュー
エイチ．フレイ マシュー
ジェイ．ペレリテ マーク
ジェイ．ペレリテ マーク
ピー．ベトゾルド ジョン
ピー．ベトゾルド ジョン
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3M Innovative Properties Co
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    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F1/00—Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
    • G06F1/16—Constructional details or arrangements
    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F3/00—Input arrangements for transferring data to be processed into a form capable of being handled by the computer; Output arrangements for transferring data from processing unit to output unit, e.g. interface arrangements
    • G06F3/01—Input arrangements or combined input and output arrangements for interaction between user and computer
    • G06F3/03—Arrangements for converting the position or the displacement of a member into a coded form
    • G06F3/041—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means
    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F3/00—Input arrangements for transferring data to be processed into a form capable of being handled by the computer; Output arrangements for transferring data from processing unit to output unit, e.g. interface arrangements
    • G06F3/01—Input arrangements or combined input and output arrangements for interaction between user and computer
    • G06F3/03—Arrangements for converting the position or the displacement of a member into a coded form
    • G06F3/041—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means
    • G06F3/0412—Digitisers structurally integrated in a display
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B82—NANOTECHNOLOGY
    • B82B—NANOSTRUCTURES FORMED BY MANIPULATION OF INDIVIDUAL ATOMS, MOLECULES, OR LIMITED COLLECTIONS OF ATOMS OR MOLECULES AS DISCRETE UNITS; MANUFACTURE OR TREATMENT THEREOF
    • B82B1/00—Nanostructures formed by manipulation of individual atoms or molecules, or limited collections of atoms or molecules as discrete units
    • B82B1/002—Devices comprising flexible or deformable elements
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B82—NANOTECHNOLOGY
    • B82Y—SPECIFIC USES OR APPLICATIONS OF NANOSTRUCTURES; MEASUREMENT OR ANALYSIS OF NANOSTRUCTURES; MANUFACTURE OR TREATMENT OF NANOSTRUCTURES
    • B82Y15/00—Nanotechnology for interacting, sensing or actuating, e.g. quantum dots as markers in protein assays or molecular motors
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B82—NANOTECHNOLOGY
    • B82Y—SPECIFIC USES OR APPLICATIONS OF NANOSTRUCTURES; MEASUREMENT OR ANALYSIS OF NANOSTRUCTURES; MANUFACTURE OR TREATMENT OF NANOSTRUCTURES
    • B82Y40/00—Manufacture or treatment of nanostructures
    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F2203/00—Indexing scheme relating to G06F3/00 - G06F3/048
    • G06F2203/041—Indexing scheme relating to G06F3/041 - G06F3/045
    • G06F2203/04103—Manufacturing, i.e. details related to manufacturing processes specially suited for touch sensitive devices
    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F2203/00—Indexing scheme relating to G06F3/00 - G06F3/048
    • G06F2203/041—Indexing scheme relating to G06F3/041 - G06F3/045
    • G06F2203/04112—Electrode mesh in capacitive digitiser: electrode for touch sensing is formed of a mesh of very fine, normally metallic, interconnected lines that are almost invisible to see. This provides a quite large but transparent electrode surface, without need for ITO or similar transparent conductive material
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S977/00—Nanotechnology
    • Y10S977/70—Nanostructure
    • Y10S977/762—Nanowire or quantum wire, i.e. axially elongated structure having two dimensions of 100 nm or less
    • Y10S977/766—Bent wire, i.e. having nonliner longitudinal axis
    • Y10S977/767—Mesh structure
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S977/00—Nanotechnology
    • Y10S977/84—Manufacture, treatment, or detection of nanostructure
    • Y10S977/887—Nanoimprint lithography, i.e. nanostamp
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S977/00—Nanotechnology
    • Y10S977/902—Specified use of nanostructure
    • Y10S977/932—Specified use of nanostructure for electronic or optoelectronic application
    • Y10S977/953—Detector using nanostructure
    • Y10S977/956—Of mechanical property

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  • Engineering & Computer Science (AREA)
  • Theoretical Computer Science (AREA)
  • General Engineering & Computer Science (AREA)
  • Human Computer Interaction (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Laminated Bodies (AREA)
  • Non-Insulated Conductors (AREA)
  • Manufacturing Of Electric Cables (AREA)
  • Printing Methods (AREA)
JP2015546533A 2012-12-07 2013-12-02 基板上に透明導電体を製作する方法 Expired - Fee Related JP6700787B2 (ja)

Applications Claiming Priority (7)

Application Number Priority Date Filing Date Title
US201261734793P 2012-12-07 2012-12-07
US61/734,793 2012-12-07
US201361782634P 2013-03-14 2013-03-14
US61/782,634 2013-03-14
US201361840876P 2013-06-28 2013-06-28
US61/840,876 2013-06-28
PCT/US2013/072624 WO2014088950A1 (en) 2012-12-07 2013-12-02 Method of making transparent conductors on a substrate

Publications (3)

Publication Number Publication Date
JP2016509332A JP2016509332A (ja) 2016-03-24
JP2016509332A5 JP2016509332A5 (enExample) 2016-12-22
JP6700787B2 true JP6700787B2 (ja) 2020-05-27

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US (2) US10254786B2 (enExample)
EP (1) EP2929417A4 (enExample)
JP (1) JP6700787B2 (enExample)
KR (1) KR102145157B1 (enExample)
CN (1) CN104838342B (enExample)
BR (1) BR112015013033A2 (enExample)
SG (1) SG11201504125UA (enExample)
WO (1) WO2014088950A1 (enExample)

Families Citing this family (36)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR3000917B1 (fr) * 2013-01-11 2015-02-20 Bobst Lyon Procede de commande, pour commander une machine de transformation, machine de transformation et programme d'ordinateur pour realiser un tel procede de commande
WO2015017143A1 (en) 2013-07-31 2015-02-05 3M Innovative Properties Company Bonding electronic components to patterned nanowire transparent conductors
EP3039949A4 (en) 2013-08-28 2017-04-19 3M Innovative Properties Company Electronic assembly with fiducial marks for precision registration during subsequent processing steps
EP3053012B1 (en) 2013-09-30 2019-10-23 3M Innovative Properties Company Protective coating for printed conductive pattern on patterned nanowire transparent conductors
EP3065951B1 (en) 2013-11-06 2019-07-31 3M Innovative Properties Company Microcontact printing stamps with functional features
US10166571B2 (en) * 2013-12-10 2019-01-01 Lg Display Co., Ltd. Refining method for microstructure
TWI564762B (zh) * 2015-04-22 2017-01-01 恆顥科技股份有限公司 觸控薄膜疊層卷的製作方法與所製得之觸控薄膜疊層片
CN107850958B (zh) 2015-06-30 2021-08-31 3M创新有限公司 图案化外覆层
CN107835974B (zh) 2015-06-30 2021-07-16 3M创新有限公司 包括通孔的电子设备以及形成此类电子设备的方法
US20180246592A1 (en) 2015-07-21 2018-08-30 3M Innovative Properties Company Electrically conductive films, assemblies, and methods of removing static electric charge from electrically conductive patterns
KR102555869B1 (ko) * 2015-08-06 2023-07-13 삼성전자주식회사 도전체 및 그 제조 방법
CN208488734U (zh) 2015-08-21 2019-02-12 3M创新有限公司 包括金属迹线的透明导体
KR102674872B1 (ko) * 2015-12-04 2024-06-14 레오나르트 쿠르츠 스티프퉁 운트 코. 카게 필름 및 필름을 제조하기 위한 방법
WO2017159698A1 (ja) * 2016-03-18 2017-09-21 国立大学法人大阪大学 金属ナノワイヤ層が形成された基材及びその製造方法
EP3463875A1 (en) 2016-05-25 2019-04-10 3M Innovative Properties Company Substrate for touch sensor
US20190235670A1 (en) * 2016-07-08 2019-08-01 Asahi Kasei Kabushiki Kaisha Electrically conductive film, electronic paper, touch panel, and flat panel display
US20190357360A1 (en) * 2016-12-29 2019-11-21 3M Innovative Properties Company Methods for Preparing Electrically Conductive Patterns and Articles Containing Electrically Conductive Patterns
KR101841946B1 (ko) * 2017-02-24 2018-03-26 동우 화인켐 주식회사 장력 제어를 이용한 터치 센서 필름 제조방법
DE102017106055B4 (de) * 2017-03-21 2021-04-08 Tdk Corporation Trägersubstrat für stressempflindliches Bauelement und Verfahren zur Herstellung
EP3646069A1 (en) 2017-06-29 2020-05-06 3M Innovative Properties Company Article and methods of making the same
US11683977B2 (en) 2017-11-30 2023-06-20 3M Innovative Properties Company Substrate including a self-supporting tri-layer stack
US10058014B1 (en) 2017-12-13 2018-08-21 International Business Machines Corporation Conductive adhesive layer for gasket assembly
JP2021003806A (ja) * 2018-01-29 2021-01-14 スリーエム イノベイティブ プロパティズ カンパニー 糸状部材への印刷方法、及び糸状のこぎり
CN109871141B (zh) * 2018-12-29 2023-02-03 赣州市德普特科技有限公司 一种触摸屏制作工艺中的布线区保护方法
KR102755456B1 (ko) * 2019-01-04 2025-01-20 삼성디스플레이 주식회사 표시 장치 및 이의 제조 방법
US11261529B2 (en) * 2020-03-31 2022-03-01 Futuretech Capital, Inc. Reduced visibility conductive micro mesh touch sensor
KR102461794B1 (ko) * 2020-08-13 2022-11-02 한국과학기술연구원 은 나노와이어 메쉬 전극 및 이의 제조방법
CN114496352A (zh) * 2020-11-12 2022-05-13 天材创新材料科技(厦门)有限公司 纳米银线保护层结构及其制备方法
KR102722102B1 (ko) 2020-12-04 2024-10-28 한국과학기술원 희생층을 이용한 투명 전도성 네트워크 제조방법
US11961632B2 (en) 2020-12-04 2024-04-16 Korea Advanced Institute Of Science And Technology Fabrication method of conductive nanonetworks using mastermold
US12412678B2 (en) 2020-12-04 2025-09-09 Korea Advanced Institute Of Science And Technology Fabrication method of conductive nanonetworks through adaptation of sacrificial layer
KR102722103B1 (ko) 2020-12-04 2024-10-28 한국과학기술원 나노마스크를 이용한 투명 전도성 네트워크 제조방법
KR102628299B1 (ko) 2020-12-04 2024-01-24 한국과학기술원 마스터몰드를 이용한 투명 전도성 네트워크 제조방법
US11513638B2 (en) 2020-12-18 2022-11-29 Cambrios Film Solutions Corporation Silver nanowire protection layer structure and manufacturing method thereof
CN113764564B (zh) * 2021-08-31 2024-01-23 Tcl华星光电技术有限公司 基板制备方法及膜片结构
KR102691766B1 (ko) * 2022-10-25 2024-08-05 서울대학교산학협력단 나노와이어 함유 패턴의 제조방법 및 이를 이용하여 제조된 투명 전극

Family Cites Families (50)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3654384A (en) 1970-05-25 1972-04-04 Magnavox Co Apparatus for modifying electrical signals
US4895630A (en) 1985-08-28 1990-01-23 W. H. Brady Co. Rapidly removable undercoating for vacuum deposition of patterned layers onto substrates
JPH05224818A (ja) 1992-02-10 1993-09-03 Matsushita Electric Ind Co Ltd タッチパネル装置
TWI231293B (en) * 1997-11-12 2005-04-21 Jsr Corp Transfer film
US6037005A (en) * 1998-05-12 2000-03-14 3M Innovative Properties Company Display substrate electrodes with auxiliary metal layers for enhanced conductivity
US20030148024A1 (en) 2001-10-05 2003-08-07 Kodas Toivo T. Low viscosity precursor compositons and methods for the depositon of conductive electronic features
TWI268813B (en) * 2002-04-24 2006-12-21 Sipix Imaging Inc Process for forming a patterned thin film conductive structure on a substrate
KR100486915B1 (ko) 2002-09-12 2005-05-03 엘지전자 주식회사 포토필링법을 이용한 플라즈마 디스플레이 패널의 전극제조방법
US6975067B2 (en) 2002-12-19 2005-12-13 3M Innovative Properties Company Organic electroluminescent device and encapsulation method
US7175876B2 (en) 2003-06-27 2007-02-13 3M Innovative Properties Company Patterned coating method employing polymeric coatings
US7416993B2 (en) * 2003-09-08 2008-08-26 Nantero, Inc. Patterned nanowire articles on a substrate and methods of making the same
US20050196707A1 (en) 2004-03-02 2005-09-08 Eastman Kodak Company Patterned conductive coatings
US8420693B2 (en) 2004-12-28 2013-04-16 Gemin X Pharmaceuticals Canada Inc. Dipyrrole compounds, compositions, and methods for treating cancer or viral diseases
DK1912677T3 (da) * 2005-06-20 2014-01-13 Psma Dev Company L L C PSMA-antistof-lægemiddel-konjugater
WO2007022226A2 (en) 2005-08-12 2007-02-22 Cambrios Technologies Corporation Nanowires-based transparent conductors
WO2007034994A1 (en) 2005-09-22 2007-03-29 Fujifilm Corporation Light-transmittable electromagnetic wave shielding film, process for producing light-transmittable electromagnetic wave shielding film, film for display panel, optical filter for display panel and plasma display panel
US8264137B2 (en) 2006-01-03 2012-09-11 Samsung Electronics Co., Ltd. Curing binder material for carbon nanotube electron emission cathodes
US8461992B2 (en) 2006-05-12 2013-06-11 Solstice Medical, Llc RFID coupler for metallic implements
US20080048996A1 (en) 2006-08-11 2008-02-28 Unidym, Inc. Touch screen devices employing nanostructure networks
US8018568B2 (en) 2006-10-12 2011-09-13 Cambrios Technologies Corporation Nanowire-based transparent conductors and applications thereof
SG151667A1 (en) 2006-10-12 2009-05-29 Cambrios Technologies Corp Nanowire-based transparent conductors and applications thereof
US7867907B2 (en) * 2006-10-17 2011-01-11 Semiconductor Energy Laboratory Co., Ltd. Method for manufacturing semiconductor device
WO2008127313A2 (en) * 2006-11-17 2008-10-23 The Regents Of The University Of California Electrically conducting and optically transparent nanowire networks
JP4902344B2 (ja) 2006-12-27 2012-03-21 富士フイルム株式会社 金属パターン材料の製造方法
KR100875168B1 (ko) * 2007-07-26 2008-12-22 주식회사 동부하이텍 반도체 소자의 금속배선 잔류 폴리머 제거방법
US8378046B2 (en) 2007-10-19 2013-02-19 3M Innovative Properties Company High refractive index pressure-sensitive adhesives
TWI500713B (zh) 2008-02-26 2015-09-21 Cambrios Technologies Corp 用於導電部件之噴墨沉積的方法及組合物
EP2257969B1 (en) 2008-02-28 2017-12-20 3M Innovative Properties Company Methods of patterning a conductor on a substrate
JP5086886B2 (ja) * 2008-05-15 2012-11-28 富士通コンポーネント株式会社 座標検出装置の製造方法
EP2327006A4 (en) * 2008-08-01 2012-12-26 3M Innovative Properties Co METHODS OF MANUFACTURING COMPOSITE ELECTRODES
CN102308366B (zh) 2009-02-06 2015-08-12 Lg化学株式会社 触摸屏及其制备方法
US20100238133A1 (en) 2009-03-17 2010-09-23 Wintek Corporation Capacitive touch panel
JP2010271796A (ja) * 2009-05-19 2010-12-02 Optrex Corp 電極間接続構造およびタッチパネル
CN102576582A (zh) * 2009-06-30 2012-07-11 Dic株式会社 透明导电层图案的形成方法
US20110042126A1 (en) 2009-08-24 2011-02-24 Cambrios Technologies Corporation Contact resistance measurement for resistance linearity in nanostructure thin films
CN101699376B (zh) 2009-09-04 2011-09-14 深超光电（深圳）有限公司 触控面板及触控面板的检测方法
US20110057905A1 (en) * 2009-09-04 2011-03-10 Hong-Chih Yu Touch Panel and Inspection Method Thereof
KR101073280B1 (ko) 2010-04-01 2011-10-12 삼성모바일디스플레이주식회사 터치 스크린 패널 및 이를 구비한 영상표시장치
US8236626B2 (en) * 2010-04-15 2012-08-07 The Board Of Trustees Of The Leland Stanford Junior University Narrow graphene nanoribbons from carbon nanotubes
US8865394B2 (en) 2010-08-23 2014-10-21 Koninklijke Philips N.V. Self-aligned coverage of opaque conductive areas
KR101367569B1 (ko) * 2010-12-29 2014-02-28 주식회사 엘지화학 터치 스크린 및 이의 제조방법
WO2012105690A1 (ja) * 2011-02-04 2012-08-09 信越ポリマー株式会社 静電容量式センサーシートおよびその製造方法
US8558807B2 (en) 2011-02-15 2013-10-15 Teh-Zheng Lin Transparent touch panel
JP2012182005A (ja) 2011-03-01 2012-09-20 Nitto Denko Corp 有機エレクトロルミネッセンス素子の製法
US8854326B2 (en) 2011-03-10 2014-10-07 Wintek Corporation Touch panel and touch-sensitive display device
JP5774686B2 (ja) * 2011-04-26 2015-09-09 日本メクトロン株式会社 透明プリント配線板の製造方法、および透明タッチパネルの製造方法
KR20120127556A (ko) * 2011-05-14 2012-11-22 정병현 투명 도전막 에칭 방법
JP5806066B2 (ja) 2011-09-30 2015-11-10 富士フイルム株式会社 電極パターン、タッチパネル、液晶表示装置及び、有機ｅｌディスプレイ
KR101373044B1 (ko) * 2012-04-19 2014-03-11 삼성디스플레이 주식회사 터치 스크린 패널
JP6581080B2 (ja) 2013-10-23 2019-09-25 スリーエム イノベイティブ プロパティズ カンパニー テクスチャー化フィルムを製造するためのシステム及び方法

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Publication number Publication date
CN104838342B (zh) 2018-03-13
CN104838342A (zh) 2015-08-12
KR20150093208A (ko) 2015-08-17
US20190187746A1 (en) 2019-06-20
US20150316955A1 (en) 2015-11-05
US10831233B2 (en) 2020-11-10
EP2929417A4 (en) 2016-07-20
WO2014088950A1 (en) 2014-06-12
EP2929417A1 (en) 2015-10-14
JP2016509332A (ja) 2016-03-24
KR102145157B1 (ko) 2020-08-18
SG11201504125UA (en) 2015-06-29
BR112015013033A2 (pt) 2017-07-11
US10254786B2 (en) 2019-04-09

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