CN104838342B - 在基板上制作透明导体的方法 - Google Patents
在基板上制作透明导体的方法 Download PDFInfo
- Publication number
- CN104838342B CN104838342B CN201380063496.0A CN201380063496A CN104838342B CN 104838342 B CN104838342 B CN 104838342B CN 201380063496 A CN201380063496 A CN 201380063496A CN 104838342 B CN104838342 B CN 104838342B
- Authority
- CN
- China
- Prior art keywords
- layer
- substrate
- patterned
- conductive layer
- matrix material
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Classifications
-
- G—PHYSICS
- G06—COMPUTING OR CALCULATING; COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F1/00—Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
- G06F1/16—Constructional details or arrangements
-
- G—PHYSICS
- G06—COMPUTING OR CALCULATING; COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F3/00—Input arrangements for transferring data to be processed into a form capable of being handled by the computer; Output arrangements for transferring data from processing unit to output unit, e.g. interface arrangements
- G06F3/01—Input arrangements or combined input and output arrangements for interaction between user and computer
- G06F3/03—Arrangements for converting the position or the displacement of a member into a coded form
- G06F3/041—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means
-
- G—PHYSICS
- G06—COMPUTING OR CALCULATING; COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F3/00—Input arrangements for transferring data to be processed into a form capable of being handled by the computer; Output arrangements for transferring data from processing unit to output unit, e.g. interface arrangements
- G06F3/01—Input arrangements or combined input and output arrangements for interaction between user and computer
- G06F3/03—Arrangements for converting the position or the displacement of a member into a coded form
- G06F3/041—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means
- G06F3/0412—Digitisers structurally integrated in a display
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B82—NANOTECHNOLOGY
- B82B—NANOSTRUCTURES FORMED BY MANIPULATION OF INDIVIDUAL ATOMS, MOLECULES, OR LIMITED COLLECTIONS OF ATOMS OR MOLECULES AS DISCRETE UNITS; MANUFACTURE OR TREATMENT THEREOF
- B82B1/00—Nanostructures formed by manipulation of individual atoms or molecules, or limited collections of atoms or molecules as discrete units
- B82B1/002—Devices comprising flexible or deformable elements
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B82—NANOTECHNOLOGY
- B82Y—SPECIFIC USES OR APPLICATIONS OF NANOSTRUCTURES; MEASUREMENT OR ANALYSIS OF NANOSTRUCTURES; MANUFACTURE OR TREATMENT OF NANOSTRUCTURES
- B82Y15/00—Nanotechnology for interacting, sensing or actuating, e.g. quantum dots as markers in protein assays or molecular motors
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B82—NANOTECHNOLOGY
- B82Y—SPECIFIC USES OR APPLICATIONS OF NANOSTRUCTURES; MEASUREMENT OR ANALYSIS OF NANOSTRUCTURES; MANUFACTURE OR TREATMENT OF NANOSTRUCTURES
- B82Y40/00—Manufacture or treatment of nanostructures
-
- G—PHYSICS
- G06—COMPUTING OR CALCULATING; COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F2203/00—Indexing scheme relating to G06F3/00 - G06F3/048
- G06F2203/041—Indexing scheme relating to G06F3/041 - G06F3/045
- G06F2203/04103—Manufacturing, i.e. details related to manufacturing processes specially suited for touch sensitive devices
-
- G—PHYSICS
- G06—COMPUTING OR CALCULATING; COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F2203/00—Indexing scheme relating to G06F3/00 - G06F3/048
- G06F2203/041—Indexing scheme relating to G06F3/041 - G06F3/045
- G06F2203/04112—Electrode mesh in capacitive digitiser: electrode for touch sensing is formed of a mesh of very fine, normally metallic, interconnected lines that are almost invisible to see. This provides a quite large but transparent electrode surface, without need for ITO or similar transparent conductive material
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10S977/00—Nanotechnology
- Y10S977/70—Nanostructure
- Y10S977/762—Nanowire or quantum wire, i.e. axially elongated structure having two dimensions of 100 nm or less
- Y10S977/766—Bent wire, i.e. having nonliner longitudinal axis
- Y10S977/767—Mesh structure
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10S977/00—Nanotechnology
- Y10S977/84—Manufacture, treatment, or detection of nanostructure
- Y10S977/887—Nanoimprint lithography, i.e. nanostamp
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10S977/00—Nanotechnology
- Y10S977/902—Specified use of nanostructure
- Y10S977/932—Specified use of nanostructure for electronic or optoelectronic application
- Y10S977/953—Detector using nanostructure
- Y10S977/956—Of mechanical property
Landscapes
- Engineering & Computer Science (AREA)
- Theoretical Computer Science (AREA)
- General Engineering & Computer Science (AREA)
- Human Computer Interaction (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Laminated Bodies (AREA)
- Non-Insulated Conductors (AREA)
- Manufacturing Of Electric Cables (AREA)
- Printing Methods (AREA)
Applications Claiming Priority (7)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US201261734793P | 2012-12-07 | 2012-12-07 | |
| US61/734,793 | 2012-12-07 | ||
| US201361782634P | 2013-03-14 | 2013-03-14 | |
| US61/782,634 | 2013-03-14 | ||
| US201361840876P | 2013-06-28 | 2013-06-28 | |
| US61/840,876 | 2013-06-28 | ||
| PCT/US2013/072624 WO2014088950A1 (en) | 2012-12-07 | 2013-12-02 | Method of making transparent conductors on a substrate |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN104838342A CN104838342A (zh) | 2015-08-12 |
| CN104838342B true CN104838342B (zh) | 2018-03-13 |
Family
ID=50883903
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201380063496.0A Expired - Fee Related CN104838342B (zh) | 2012-12-07 | 2013-12-02 | 在基板上制作透明导体的方法 |
Country Status (8)
| Country | Link |
|---|---|
| US (2) | US10254786B2 (enExample) |
| EP (1) | EP2929417A4 (enExample) |
| JP (1) | JP6700787B2 (enExample) |
| KR (1) | KR102145157B1 (enExample) |
| CN (1) | CN104838342B (enExample) |
| BR (1) | BR112015013033A2 (enExample) |
| SG (1) | SG11201504125UA (enExample) |
| WO (1) | WO2014088950A1 (enExample) |
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| FR3000917B1 (fr) * | 2013-01-11 | 2015-02-20 | Bobst Lyon | Procede de commande, pour commander une machine de transformation, machine de transformation et programme d'ordinateur pour realiser un tel procede de commande |
| WO2015017143A1 (en) | 2013-07-31 | 2015-02-05 | 3M Innovative Properties Company | Bonding electronic components to patterned nanowire transparent conductors |
| EP3039949A4 (en) | 2013-08-28 | 2017-04-19 | 3M Innovative Properties Company | Electronic assembly with fiducial marks for precision registration during subsequent processing steps |
| EP3053012B1 (en) | 2013-09-30 | 2019-10-23 | 3M Innovative Properties Company | Protective coating for printed conductive pattern on patterned nanowire transparent conductors |
| EP3065951B1 (en) | 2013-11-06 | 2019-07-31 | 3M Innovative Properties Company | Microcontact printing stamps with functional features |
| US10166571B2 (en) * | 2013-12-10 | 2019-01-01 | Lg Display Co., Ltd. | Refining method for microstructure |
| TWI564762B (zh) * | 2015-04-22 | 2017-01-01 | 恆顥科技股份有限公司 | 觸控薄膜疊層卷的製作方法與所製得之觸控薄膜疊層片 |
| CN107850958B (zh) | 2015-06-30 | 2021-08-31 | 3M创新有限公司 | 图案化外覆层 |
| CN107835974B (zh) | 2015-06-30 | 2021-07-16 | 3M创新有限公司 | 包括通孔的电子设备以及形成此类电子设备的方法 |
| US20180246592A1 (en) | 2015-07-21 | 2018-08-30 | 3M Innovative Properties Company | Electrically conductive films, assemblies, and methods of removing static electric charge from electrically conductive patterns |
| KR102555869B1 (ko) * | 2015-08-06 | 2023-07-13 | 삼성전자주식회사 | 도전체 및 그 제조 방법 |
| CN208488734U (zh) | 2015-08-21 | 2019-02-12 | 3M创新有限公司 | 包括金属迹线的透明导体 |
| KR102674872B1 (ko) * | 2015-12-04 | 2024-06-14 | 레오나르트 쿠르츠 스티프퉁 운트 코. 카게 | 필름 및 필름을 제조하기 위한 방법 |
| WO2017159698A1 (ja) * | 2016-03-18 | 2017-09-21 | 国立大学法人大阪大学 | 金属ナノワイヤ層が形成された基材及びその製造方法 |
| EP3463875A1 (en) | 2016-05-25 | 2019-04-10 | 3M Innovative Properties Company | Substrate for touch sensor |
| US20190235670A1 (en) * | 2016-07-08 | 2019-08-01 | Asahi Kasei Kabushiki Kaisha | Electrically conductive film, electronic paper, touch panel, and flat panel display |
| US20190357360A1 (en) * | 2016-12-29 | 2019-11-21 | 3M Innovative Properties Company | Methods for Preparing Electrically Conductive Patterns and Articles Containing Electrically Conductive Patterns |
| KR101841946B1 (ko) * | 2017-02-24 | 2018-03-26 | 동우 화인켐 주식회사 | 장력 제어를 이용한 터치 센서 필름 제조방법 |
| DE102017106055B4 (de) * | 2017-03-21 | 2021-04-08 | Tdk Corporation | Trägersubstrat für stressempflindliches Bauelement und Verfahren zur Herstellung |
| EP3646069A1 (en) | 2017-06-29 | 2020-05-06 | 3M Innovative Properties Company | Article and methods of making the same |
| US11683977B2 (en) | 2017-11-30 | 2023-06-20 | 3M Innovative Properties Company | Substrate including a self-supporting tri-layer stack |
| US10058014B1 (en) | 2017-12-13 | 2018-08-21 | International Business Machines Corporation | Conductive adhesive layer for gasket assembly |
| JP2021003806A (ja) * | 2018-01-29 | 2021-01-14 | スリーエム イノベイティブ プロパティズ カンパニー | 糸状部材への印刷方法、及び糸状のこぎり |
| CN109871141B (zh) * | 2018-12-29 | 2023-02-03 | 赣州市德普特科技有限公司 | 一种触摸屏制作工艺中的布线区保护方法 |
| KR102755456B1 (ko) * | 2019-01-04 | 2025-01-20 | 삼성디스플레이 주식회사 | 표시 장치 및 이의 제조 방법 |
| US11261529B2 (en) * | 2020-03-31 | 2022-03-01 | Futuretech Capital, Inc. | Reduced visibility conductive micro mesh touch sensor |
| KR102461794B1 (ko) * | 2020-08-13 | 2022-11-02 | 한국과학기술연구원 | 은 나노와이어 메쉬 전극 및 이의 제조방법 |
| CN114496352A (zh) * | 2020-11-12 | 2022-05-13 | 天材创新材料科技(厦门)有限公司 | 纳米银线保护层结构及其制备方法 |
| KR102722102B1 (ko) | 2020-12-04 | 2024-10-28 | 한국과학기술원 | 희생층을 이용한 투명 전도성 네트워크 제조방법 |
| US11961632B2 (en) | 2020-12-04 | 2024-04-16 | Korea Advanced Institute Of Science And Technology | Fabrication method of conductive nanonetworks using mastermold |
| US12412678B2 (en) | 2020-12-04 | 2025-09-09 | Korea Advanced Institute Of Science And Technology | Fabrication method of conductive nanonetworks through adaptation of sacrificial layer |
| KR102722103B1 (ko) | 2020-12-04 | 2024-10-28 | 한국과학기술원 | 나노마스크를 이용한 투명 전도성 네트워크 제조방법 |
| KR102628299B1 (ko) | 2020-12-04 | 2024-01-24 | 한국과학기술원 | 마스터몰드를 이용한 투명 전도성 네트워크 제조방법 |
| US11513638B2 (en) | 2020-12-18 | 2022-11-29 | Cambrios Film Solutions Corporation | Silver nanowire protection layer structure and manufacturing method thereof |
| CN113764564B (zh) * | 2021-08-31 | 2024-01-23 | Tcl华星光电技术有限公司 | 基板制备方法及膜片结构 |
| KR102691766B1 (ko) * | 2022-10-25 | 2024-08-05 | 서울대학교산학협력단 | 나노와이어 함유 패턴의 제조방법 및 이를 이용하여 제조된 투명 전극 |
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-
2013
- 2013-12-02 BR BR112015013033A patent/BR112015013033A2/pt not_active IP Right Cessation
- 2013-12-02 EP EP13859618.4A patent/EP2929417A4/en not_active Ceased
- 2013-12-02 KR KR1020157017885A patent/KR102145157B1/ko not_active Expired - Fee Related
- 2013-12-02 US US14/649,979 patent/US10254786B2/en active Active
- 2013-12-02 JP JP2015546533A patent/JP6700787B2/ja not_active Expired - Fee Related
- 2013-12-02 WO PCT/US2013/072624 patent/WO2014088950A1/en not_active Ceased
- 2013-12-02 CN CN201380063496.0A patent/CN104838342B/zh not_active Expired - Fee Related
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Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1453624A (zh) * | 2002-04-24 | 2003-11-05 | 希毕克斯影像有限公司 | 在基板上形成图案化薄膜导电结构的方法 |
| CN101365735A (zh) * | 2006-01-03 | 2009-02-11 | 应用纳米技术控股股份有限公司 | 用于碳纳米管电子发射阴极的固化粘合材料 |
| US20090129004A1 (en) * | 2006-11-17 | 2009-05-21 | Regents Of The University Of California | Electrically conducting and optically transparent nanowire networks |
| CN102576582A (zh) * | 2009-06-30 | 2012-07-11 | Dic株式会社 | 透明导电层图案的形成方法 |
Also Published As
| Publication number | Publication date |
|---|---|
| CN104838342A (zh) | 2015-08-12 |
| KR20150093208A (ko) | 2015-08-17 |
| US20190187746A1 (en) | 2019-06-20 |
| US20150316955A1 (en) | 2015-11-05 |
| US10831233B2 (en) | 2020-11-10 |
| EP2929417A4 (en) | 2016-07-20 |
| JP6700787B2 (ja) | 2020-05-27 |
| WO2014088950A1 (en) | 2014-06-12 |
| EP2929417A1 (en) | 2015-10-14 |
| JP2016509332A (ja) | 2016-03-24 |
| KR102145157B1 (ko) | 2020-08-18 |
| SG11201504125UA (en) | 2015-06-29 |
| BR112015013033A2 (pt) | 2017-07-11 |
| US10254786B2 (en) | 2019-04-09 |
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