JP2016530622A5 - - Google Patents
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- Publication number
- JP2016530622A5 JP2016530622A5 JP2016531742A JP2016531742A JP2016530622A5 JP 2016530622 A5 JP2016530622 A5 JP 2016530622A5 JP 2016531742 A JP2016531742 A JP 2016531742A JP 2016531742 A JP2016531742 A JP 2016531742A JP 2016530622 A5 JP2016530622 A5 JP 2016530622A5
- Authority
- JP
- Japan
- Prior art keywords
- layer
- conductive
- substrate
- adhesive
- resist
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000010410 layer Substances 0.000 claims description 70
- 239000000853 adhesive Substances 0.000 claims description 33
- 230000001070 adhesive effect Effects 0.000 claims description 33
- 239000000758 substrate Substances 0.000 claims description 31
- 239000002070 nanowire Substances 0.000 claims description 28
- 239000011159 matrix material Substances 0.000 claims description 27
- 238000000034 method Methods 0.000 claims description 20
- 229920000642 polymer Polymers 0.000 claims description 16
- 239000002923 metal particle Substances 0.000 claims description 14
- 239000012790 adhesive layer Substances 0.000 claims description 10
- 239000004820 Pressure-sensitive adhesive Substances 0.000 claims description 5
- 239000011248 coating agent Substances 0.000 claims description 4
- 238000000576 coating method Methods 0.000 claims description 4
- 239000007788 liquid Substances 0.000 claims description 4
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 3
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 claims description 3
- 229910052782 aluminium Inorganic materials 0.000 claims description 3
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 claims description 3
- 229910052802 copper Inorganic materials 0.000 claims description 3
- 239000010949 copper Substances 0.000 claims description 3
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 claims description 3
- 229910052737 gold Inorganic materials 0.000 claims description 3
- 239000010931 gold Substances 0.000 claims description 3
- 229910052709 silver Inorganic materials 0.000 claims description 3
- 239000004332 silver Substances 0.000 claims description 3
- 238000004519 manufacturing process Methods 0.000 claims description 2
- 229910052751 metal Inorganic materials 0.000 claims description 2
- 239000002184 metal Substances 0.000 claims description 2
- 239000004973 liquid crystal related substance Substances 0.000 description 2
- NIXOWILDQLNWCW-UHFFFAOYSA-N acrylic acid group Chemical group C(C=C)(=O)O NIXOWILDQLNWCW-UHFFFAOYSA-N 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US201361860841P | 2013-07-31 | 2013-07-31 | |
| US61/860,841 | 2013-07-31 | ||
| PCT/US2014/047212 WO2015017143A1 (en) | 2013-07-31 | 2014-07-18 | Bonding electronic components to patterned nanowire transparent conductors |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JP2016530622A JP2016530622A (ja) | 2016-09-29 |
| JP2016530622A5 true JP2016530622A5 (enExample) | 2017-08-17 |
| JP6426737B2 JP6426737B2 (ja) | 2018-11-21 |
Family
ID=52432333
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2016531742A Expired - Fee Related JP6426737B2 (ja) | 2013-07-31 | 2014-07-18 | 電子的構成要素とパターン化ナノワイヤ透明伝導体との接合 |
Country Status (8)
| Country | Link |
|---|---|
| US (1) | US9980394B2 (enExample) |
| EP (1) | EP3028126B1 (enExample) |
| JP (1) | JP6426737B2 (enExample) |
| KR (1) | KR102254683B1 (enExample) |
| CN (1) | CN105453001B (enExample) |
| BR (1) | BR112016002093A2 (enExample) |
| SG (2) | SG10201808518RA (enExample) |
| WO (1) | WO2015017143A1 (enExample) |
Families Citing this family (18)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP3053012B1 (en) * | 2013-09-30 | 2019-10-23 | 3M Innovative Properties Company | Protective coating for printed conductive pattern on patterned nanowire transparent conductors |
| US20150108632A1 (en) * | 2013-10-23 | 2015-04-23 | Nano And Advanced Materials Institute Limited | Thin film with negative temperature coefficient behavior and method of making thereof |
| JP6592246B2 (ja) * | 2015-01-27 | 2019-10-16 | 株式会社コムラテック | 電子回路基板およびその製造方法 |
| US10298152B2 (en) * | 2015-04-20 | 2019-05-21 | Lawrence Livermore National Security, Llc | Harvesting mechanical and thermal energy by combining nanowires and phase change materials |
| CN107735755B (zh) * | 2015-07-08 | 2020-08-25 | 夏普株式会社 | 触摸面板装置 |
| JP6654954B2 (ja) * | 2016-03-31 | 2020-02-26 | デクセリアルズ株式会社 | 異方性導電接続構造体 |
| WO2017176498A1 (en) * | 2016-04-05 | 2017-10-12 | 3M Innovative Properties Company | Nanowire contact pads with enhanced adhesion to metal interconnects |
| TWI732892B (zh) * | 2016-07-26 | 2021-07-11 | 日商松下知識產權經營股份有限公司 | 透視型電極用積層板、透視型電極素材、組件及透視型電極用積層板之製造方法 |
| WO2019032846A1 (en) * | 2017-08-10 | 2019-02-14 | Molex, Llc | METHOD AND APPARATUS FOR FORMING AN ELECTRICAL CIRCUIT COMPRISING ALUMINUM AND ONE OR MORE DISSOLVABLE METALS |
| CA2985254A1 (en) | 2017-11-14 | 2019-05-14 | Vuereal Inc | Integration and bonding of micro-devices into system substrate |
| DE102018106959A1 (de) | 2018-03-23 | 2019-09-26 | Osram Opto Semiconductors Gmbh | Optoelektronisches bauelement und verfahren zur herstellung eines optoelektronischen bauelements |
| WO2020150902A1 (zh) * | 2019-01-22 | 2020-07-30 | 深圳市柔宇科技有限公司 | 柔性显示面板及其制作方法 |
| US11387202B2 (en) | 2019-03-01 | 2022-07-12 | Invensas Llc | Nanowire bonding interconnect for fine-pitch microelectronics |
| CN113677970B (zh) | 2019-04-15 | 2024-03-26 | 威卡亚力山大维甘德欧洲两合公司 | 用于检测压力、料位、密度、温度、质量和流量的传感器 |
| CN113710999A (zh) | 2019-04-17 | 2021-11-26 | 威卡亚力山大维甘德欧洲两合公司 | 用于检测压力和/或料位和/或流量和/或密度和/或质量和/或温度的传感器 |
| CN112860130A (zh) * | 2019-11-26 | 2021-05-28 | 英属维尔京群岛商天材创新材料科技股份有限公司 | 触控面板及其制作方法 |
| US11261529B2 (en) * | 2020-03-31 | 2022-03-01 | Futuretech Capital, Inc. | Reduced visibility conductive micro mesh touch sensor |
| US20250106995A1 (en) * | 2023-09-27 | 2025-03-27 | Apple Inc. | Compact interface through hinge connector |
Family Cites Families (20)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6037005A (en) * | 1998-05-12 | 2000-03-14 | 3M Innovative Properties Company | Display substrate electrodes with auxiliary metal layers for enhanced conductivity |
| US6975067B2 (en) | 2002-12-19 | 2005-12-13 | 3M Innovative Properties Company | Organic electroluminescent device and encapsulation method |
| CN101194540B (zh) | 2005-04-11 | 2010-06-16 | 3M创新有限公司 | 导电产品的连接方法和具有由该连接方法连接的部分的电气或电子元件 |
| WO2007022226A2 (en) | 2005-08-12 | 2007-02-22 | Cambrios Technologies Corporation | Nanowires-based transparent conductors |
| SG151667A1 (en) | 2006-10-12 | 2009-05-29 | Cambrios Technologies Corp | Nanowire-based transparent conductors and applications thereof |
| TWI500713B (zh) * | 2008-02-26 | 2015-09-21 | Cambrios Technologies Corp | 用於導電部件之噴墨沉積的方法及組合物 |
| JP5397376B2 (ja) * | 2008-08-11 | 2014-01-22 | コニカミノルタ株式会社 | 透明電極、有機エレクトロルミネッセンス素子及び透明電極の製造方法 |
| EP2501770A4 (en) * | 2009-11-20 | 2015-12-09 | 3M Innovative Properties Co | SURFACE MODIFIED LUBRICANTS |
| KR101219139B1 (ko) * | 2009-12-24 | 2013-01-07 | 제일모직주식회사 | 이방 도전성 페이스트, 필름 및 이를 포함하는 회로접속구조체 |
| CN103069502A (zh) * | 2010-03-23 | 2013-04-24 | 凯博瑞奥斯技术公司 | 使用金属纳米线的透明导体的蚀刻构图 |
| JP4870836B1 (ja) * | 2010-11-19 | 2012-02-08 | 日本写真印刷株式会社 | 狭額縁タッチ入力シートの製造方法 |
| US8664533B2 (en) | 2010-07-05 | 2014-03-04 | Dic Corporation | Substrate having transparent conductive layer, method for producing same, transparent conductive film laminate for touch panel, and touch panel |
| US20120247527A1 (en) | 2010-12-21 | 2012-10-04 | Alphabet Energy, Inc. | Electrode structures for arrays of nanostructures and methods thereof |
| WO2012105690A1 (ja) * | 2011-02-04 | 2012-08-09 | 信越ポリマー株式会社 | 静電容量式センサーシートおよびその製造方法 |
| KR101927562B1 (ko) | 2011-04-15 | 2018-12-10 | 쓰리엠 이노베이티브 프로퍼티즈 컴파니 | 전자 디스플레이를 위한 투명 전극 |
| JP2013077435A (ja) | 2011-09-30 | 2013-04-25 | Oji Holdings Corp | 導電性転写シートおよび導電性積層体 |
| KR20130071863A (ko) | 2011-12-21 | 2013-07-01 | 삼성전기주식회사 | 터치패널 |
| CN104919540B (zh) * | 2012-11-08 | 2017-05-10 | 阿尔卑斯电气株式会社 | 导电体及其制造方法 |
| BR112015013033A2 (pt) | 2012-12-07 | 2017-07-11 | 3M Innovative Properties Co | método de fabricação de condutores transparentes sobre substrato |
| WO2014156489A1 (ja) * | 2013-03-26 | 2014-10-02 | 株式会社カネカ | 導電性フィルム基板、透明導電性フィルムおよびその製造方法、ならびにタッチパネル |
-
2014
- 2014-07-18 WO PCT/US2014/047212 patent/WO2015017143A1/en not_active Ceased
- 2014-07-18 CN CN201480042647.9A patent/CN105453001B/zh not_active Expired - Fee Related
- 2014-07-18 SG SG10201808518RA patent/SG10201808518RA/en unknown
- 2014-07-18 EP EP14832317.3A patent/EP3028126B1/en active Active
- 2014-07-18 BR BR112016002093A patent/BR112016002093A2/pt not_active IP Right Cessation
- 2014-07-18 US US14/897,521 patent/US9980394B2/en active Active
- 2014-07-18 JP JP2016531742A patent/JP6426737B2/ja not_active Expired - Fee Related
- 2014-07-18 KR KR1020167003895A patent/KR102254683B1/ko not_active Expired - Fee Related
- 2014-07-18 SG SG11201600591VA patent/SG11201600591VA/en unknown
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