JP2016530622A5 - - Google Patents
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- Publication number
- JP2016530622A5 JP2016530622A5 JP2016531742A JP2016531742A JP2016530622A5 JP 2016530622 A5 JP2016530622 A5 JP 2016530622A5 JP 2016531742 A JP2016531742 A JP 2016531742A JP 2016531742 A JP2016531742 A JP 2016531742A JP 2016530622 A5 JP2016530622 A5 JP 2016530622A5
- Authority
- JP
- Japan
- Prior art keywords
- layer
- conductive
- substrate
- adhesive
- resist
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000010410 layer Substances 0.000 claims description 70
- 239000000853 adhesive Substances 0.000 claims description 33
- 230000001070 adhesive effect Effects 0.000 claims description 33
- 239000000758 substrate Substances 0.000 claims description 31
- 239000002070 nanowire Substances 0.000 claims description 28
- 239000011159 matrix material Substances 0.000 claims description 27
- 238000000034 method Methods 0.000 claims description 20
- 229920000642 polymer Polymers 0.000 claims description 16
- 239000002923 metal particle Substances 0.000 claims description 14
- 239000012790 adhesive layer Substances 0.000 claims description 10
- 239000004820 Pressure-sensitive adhesive Substances 0.000 claims description 5
- 239000011248 coating agent Substances 0.000 claims description 4
- 238000000576 coating method Methods 0.000 claims description 4
- 239000007788 liquid Substances 0.000 claims description 4
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 3
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 claims description 3
- 229910052782 aluminium Inorganic materials 0.000 claims description 3
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 claims description 3
- 229910052802 copper Inorganic materials 0.000 claims description 3
- 239000010949 copper Substances 0.000 claims description 3
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 claims description 3
- 229910052737 gold Inorganic materials 0.000 claims description 3
- 239000010931 gold Substances 0.000 claims description 3
- 229910052709 silver Inorganic materials 0.000 claims description 3
- 239000004332 silver Substances 0.000 claims description 3
- 238000004519 manufacturing process Methods 0.000 claims description 2
- 229910052751 metal Inorganic materials 0.000 claims description 2
- 239000002184 metal Substances 0.000 claims description 2
- 239000004973 liquid crystal related substance Substances 0.000 description 2
- NIXOWILDQLNWCW-UHFFFAOYSA-N acrylic acid group Chemical group C(C=C)(=O)O NIXOWILDQLNWCW-UHFFFAOYSA-N 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US201361860841P | 2013-07-31 | 2013-07-31 | |
| US61/860,841 | 2013-07-31 | ||
| PCT/US2014/047212 WO2015017143A1 (en) | 2013-07-31 | 2014-07-18 | Bonding electronic components to patterned nanowire transparent conductors |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JP2016530622A JP2016530622A (ja) | 2016-09-29 |
| JP2016530622A5 true JP2016530622A5 (enExample) | 2017-08-17 |
| JP6426737B2 JP6426737B2 (ja) | 2018-11-21 |
Family
ID=52432333
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2016531742A Expired - Fee Related JP6426737B2 (ja) | 2013-07-31 | 2014-07-18 | 電子的構成要素とパターン化ナノワイヤ透明伝導体との接合 |
Country Status (8)
| Country | Link |
|---|---|
| US (1) | US9980394B2 (enExample) |
| EP (1) | EP3028126B1 (enExample) |
| JP (1) | JP6426737B2 (enExample) |
| KR (1) | KR102254683B1 (enExample) |
| CN (1) | CN105453001B (enExample) |
| BR (1) | BR112016002093A2 (enExample) |
| SG (2) | SG11201600591VA (enExample) |
| WO (1) | WO2015017143A1 (enExample) |
Families Citing this family (18)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP3053012B1 (en) | 2013-09-30 | 2019-10-23 | 3M Innovative Properties Company | Protective coating for printed conductive pattern on patterned nanowire transparent conductors |
| US20150108632A1 (en) * | 2013-10-23 | 2015-04-23 | Nano And Advanced Materials Institute Limited | Thin film with negative temperature coefficient behavior and method of making thereof |
| JP6592246B2 (ja) * | 2015-01-27 | 2019-10-16 | 株式会社コムラテック | 電子回路基板およびその製造方法 |
| US10298152B2 (en) * | 2015-04-20 | 2019-05-21 | Lawrence Livermore National Security, Llc | Harvesting mechanical and thermal energy by combining nanowires and phase change materials |
| WO2017006952A1 (ja) * | 2015-07-08 | 2017-01-12 | シャープ株式会社 | タッチパネル装置 |
| JP6654954B2 (ja) * | 2016-03-31 | 2020-02-26 | デクセリアルズ株式会社 | 異方性導電接続構造体 |
| CN108885515A (zh) * | 2016-04-05 | 2018-11-23 | 3M创新有限公司 | 对金属互连结构具有增强粘附性的纳米线接触垫 |
| TWI732892B (zh) * | 2016-07-26 | 2021-07-11 | 日商松下知識產權經營股份有限公司 | 透視型電極用積層板、透視型電極素材、組件及透視型電極用積層板之製造方法 |
| WO2019032846A1 (en) * | 2017-08-10 | 2019-02-14 | Molex, Llc | METHOD AND APPARATUS FOR FORMING AN ELECTRICAL CIRCUIT COMPRISING ALUMINUM AND ONE OR MORE DISSOLVABLE METALS |
| CA2985254A1 (en) | 2017-11-14 | 2019-05-14 | Vuereal Inc | Integration and bonding of micro-devices into system substrate |
| DE102018106959A1 (de) | 2018-03-23 | 2019-09-26 | Osram Opto Semiconductors Gmbh | Optoelektronisches bauelement und verfahren zur herstellung eines optoelektronischen bauelements |
| WO2020150902A1 (zh) * | 2019-01-22 | 2020-07-30 | 深圳市柔宇科技有限公司 | 柔性显示面板及其制作方法 |
| US11387202B2 (en) * | 2019-03-01 | 2022-07-12 | Invensas Llc | Nanowire bonding interconnect for fine-pitch microelectronics |
| DE112020001930A5 (de) | 2019-04-15 | 2022-01-05 | Wika Alexander Wiegand Se & Co. Kg | Sensor zur Erfassung von Druck, Füllstand, Dichte, Temperatur, Masse und/oder Durchfluss |
| DE112020001959A5 (de) | 2019-04-17 | 2021-12-30 | Wika Alexander Wiegand Se & Co. Kg | Sensor zur Erfassung von Druck und/oder Füllstand und/oder Durchfluss und/oder Dichte und/oder Masse und/oder Temperatur |
| CN112860130A (zh) * | 2019-11-26 | 2021-05-28 | 英属维尔京群岛商天材创新材料科技股份有限公司 | 触控面板及其制作方法 |
| US11261529B2 (en) * | 2020-03-31 | 2022-03-01 | Futuretech Capital, Inc. | Reduced visibility conductive micro mesh touch sensor |
| US20250106995A1 (en) * | 2023-09-27 | 2025-03-27 | Apple Inc. | Compact interface through hinge connector |
Family Cites Families (20)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6037005A (en) * | 1998-05-12 | 2000-03-14 | 3M Innovative Properties Company | Display substrate electrodes with auxiliary metal layers for enhanced conductivity |
| US6975067B2 (en) | 2002-12-19 | 2005-12-13 | 3M Innovative Properties Company | Organic electroluminescent device and encapsulation method |
| EP1875787A2 (en) | 2005-04-11 | 2008-01-09 | 3M Innovative Properties Company | Connection method of a flexible printed circuit board with two printed circuit boards, and electric or electronic component with parts connected by the connection |
| EP3473681B1 (en) | 2005-08-12 | 2020-10-07 | Cambrios Film Solutions Corporation | Nanowires-based transparent conductors |
| JP5409369B2 (ja) | 2006-10-12 | 2014-02-05 | カンブリオス テクノロジーズ コーポレイション | ナノワイヤベースの透明導電体およびその適用 |
| JP2011515510A (ja) * | 2008-02-26 | 2011-05-19 | カンブリオス テクノロジーズ コーポレイション | 導電性特徴をスクリーン印刷するための方法および組成物 |
| JP5397376B2 (ja) * | 2008-08-11 | 2014-01-22 | コニカミノルタ株式会社 | 透明電極、有機エレクトロルミネッセンス素子及び透明電極の製造方法 |
| CN102597148B (zh) * | 2009-11-20 | 2015-11-25 | 3M创新有限公司 | 表面改性的粘合剂 |
| KR101219139B1 (ko) | 2009-12-24 | 2013-01-07 | 제일모직주식회사 | 이방 도전성 페이스트, 필름 및 이를 포함하는 회로접속구조체 |
| CN103069502A (zh) * | 2010-03-23 | 2013-04-24 | 凯博瑞奥斯技术公司 | 使用金属纳米线的透明导体的蚀刻构图 |
| JP4870836B1 (ja) * | 2010-11-19 | 2012-02-08 | 日本写真印刷株式会社 | 狭額縁タッチ入力シートの製造方法 |
| JP4968414B2 (ja) | 2010-07-05 | 2012-07-04 | Ｄｉｃ株式会社 | 透明導電層付き基体及びその製造方法、並びにタッチパネル用透明導電膜積層体、タッチパネル |
| US20120247527A1 (en) | 2010-12-21 | 2012-10-04 | Alphabet Energy, Inc. | Electrode structures for arrays of nanostructures and methods thereof |
| CN103238130B (zh) * | 2011-02-04 | 2016-06-29 | 信越聚合物株式会社 | 静电电容式传感器片及其制造方法 |
| CN103460123B (zh) * | 2011-04-15 | 2016-02-10 | 3M创新有限公司 | 用于电子显示器的透明电极 |
| JP2013077435A (ja) * | 2011-09-30 | 2013-04-25 | Oji Holdings Corp | 導電性転写シートおよび導電性積層体 |
| KR20130071863A (ko) | 2011-12-21 | 2013-07-01 | 삼성전기주식회사 | 터치패널 |
| JP5993028B2 (ja) * | 2012-11-08 | 2016-09-14 | アルプス電気株式会社 | 導電体及びその製造方法 |
| BR112015013033A2 (pt) | 2012-12-07 | 2017-07-11 | 3M Innovative Properties Co | método de fabricação de condutores transparentes sobre substrato |
| WO2014156489A1 (ja) * | 2013-03-26 | 2014-10-02 | 株式会社カネカ | 導電性フィルム基板、透明導電性フィルムおよびその製造方法、ならびにタッチパネル |
-
2014
- 2014-07-18 US US14/897,521 patent/US9980394B2/en active Active
- 2014-07-18 BR BR112016002093A patent/BR112016002093A2/pt not_active IP Right Cessation
- 2014-07-18 SG SG11201600591VA patent/SG11201600591VA/en unknown
- 2014-07-18 SG SG10201808518RA patent/SG10201808518RA/en unknown
- 2014-07-18 KR KR1020167003895A patent/KR102254683B1/ko not_active Expired - Fee Related
- 2014-07-18 EP EP14832317.3A patent/EP3028126B1/en not_active Not-in-force
- 2014-07-18 CN CN201480042647.9A patent/CN105453001B/zh not_active Expired - Fee Related
- 2014-07-18 WO PCT/US2014/047212 patent/WO2015017143A1/en not_active Ceased
- 2014-07-18 JP JP2016531742A patent/JP6426737B2/ja not_active Expired - Fee Related
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