BR112016002093A2 - ligação de componentes eletrônicos para condutores transparentes de nanofios dotados de um padrão - Google Patents

ligação de componentes eletrônicos para condutores transparentes de nanofios dotados de um padrão

Info

Publication number
BR112016002093A2
BR112016002093A2 BR112016002093A BR112016002093A BR112016002093A2 BR 112016002093 A2 BR112016002093 A2 BR 112016002093A2 BR 112016002093 A BR112016002093 A BR 112016002093A BR 112016002093 A BR112016002093 A BR 112016002093A BR 112016002093 A2 BR112016002093 A2 BR 112016002093A2
Authority
BR
Brazil
Prior art keywords
wire conductors
transparent wire
electronics connection
standard transparent
conductive
Prior art date
Application number
BR112016002093A
Other languages
English (en)
Portuguese (pt)
Inventor
M Gilman Ann
J Theis Daniel
S Stay Matthew
L Pekurovsky Mikhail
C Dodds Shawn
Original Assignee
3M Innovative Properties Co
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 3M Innovative Properties Co filed Critical 3M Innovative Properties Co
Publication of BR112016002093A2 publication Critical patent/BR112016002093A2/pt

Links

Classifications

    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F3/00—Input arrangements for transferring data to be processed into a form capable of being handled by the computer; Output arrangements for transferring data from processing unit to output unit, e.g. interface arrangements
    • G06F3/01—Input arrangements or combined input and output arrangements for interaction between user and computer
    • G06F3/03—Arrangements for converting the position or the displacement of a member into a coded form
    • G06F3/041—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/28—Applying non-metallic protective coatings
    • H05K3/284—Applying non-metallic protective coatings for encapsulating mounted components
    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F3/00—Input arrangements for transferring data to be processed into a form capable of being handled by the computer; Output arrangements for transferring data from processing unit to output unit, e.g. interface arrangements
    • G06F3/01—Input arrangements or combined input and output arrangements for interaction between user and computer
    • G06F3/03—Arrangements for converting the position or the displacement of a member into a coded form
    • G06F3/041—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means
    • G06F3/0412—Digitisers structurally integrated in a display
    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F3/00—Input arrangements for transferring data to be processed into a form capable of being handled by the computer; Output arrangements for transferring data from processing unit to output unit, e.g. interface arrangements
    • G06F3/01—Input arrangements or combined input and output arrangements for interaction between user and computer
    • G06F3/03—Arrangements for converting the position or the displacement of a member into a coded form
    • G06F3/041—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means
    • G06F3/047—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means using sets of wires, e.g. crossed wires
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0277—Bendability or stretchability details
    • H05K1/028—Bending or folding regions of flexible printed circuits
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0296—Conductive pattern lay-out details not covered by sub groups H05K1/02 - H05K1/0295
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/09—Use of materials for the conductive, e.g. metallic pattern
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/09—Use of materials for the conductive, e.g. metallic pattern
    • H05K1/092—Dispersed materials, e.g. conductive pastes or inks
    • H05K1/097—Inks comprising nanoparticles and specially adapted for being sintered at low temperature
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
    • H05K3/04—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed mechanically, e.g. by punching
    • H05K3/046—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed mechanically, e.g. by punching by selective transfer or selective detachment of a conductive layer
    • H05K3/048—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed mechanically, e.g. by punching by selective transfer or selective detachment of a conductive layer using a lift-off resist pattern or a release layer pattern
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/103—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern by bonding or embedding conductive wires or strips
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/321—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by conductive adhesives
    • H05K3/323—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by conductive adhesives by applying an anisotropic conductive adhesive layer over an array of pads
    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F2203/00—Indexing scheme relating to G06F3/00 - G06F3/048
    • G06F2203/041—Indexing scheme relating to G06F3/041 - G06F3/045
    • G06F2203/04103—Manufacturing, i.e. details related to manufacturing processes specially suited for touch sensitive devices
    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F2203/00—Indexing scheme relating to G06F3/00 - G06F3/048
    • G06F2203/041—Indexing scheme relating to G06F3/041 - G06F3/045
    • G06F2203/04112—Electrode mesh in capacitive digitiser: electrode for touch sensing is formed of a mesh of very fine, normally metallic, interconnected lines that are almost invisible to see. This provides a quite large but transparent electrode surface, without need for ITO or similar transparent conductive material
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0393—Flexible materials
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/02—Fillers; Particles; Fibers; Reinforcement materials
    • H05K2201/0203—Fillers and particles
    • H05K2201/0242—Shape of an individual particle
    • H05K2201/026—Nanotubes or nanowires
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10007—Types of components
    • H05K2201/10128—Display
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/01—Tools for processing; Objects used during processing
    • H05K2203/0104—Tools for processing; Objects used during processing for patterning or coating
    • H05K2203/0143—Using a roller; Specific shape thereof; Providing locally adhesive portions thereon
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/14—Related to the order of processing steps
    • H05K2203/1461—Applying or finishing the circuit pattern after another process, e.g. after filling of vias with conductive paste, after making printed resistors
    • H05K2203/1469—Circuit made after mounting or encapsulation of the components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/15—Position of the PCB during processing
    • H05K2203/1545—Continuous processing, i.e. involving rolls moving a band-like or solid carrier along a continuous production path

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Theoretical Computer Science (AREA)
  • General Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Human Computer Interaction (AREA)
  • Chemical & Material Sciences (AREA)
  • Nanotechnology (AREA)
  • Dispersion Chemistry (AREA)
  • Laminated Bodies (AREA)
  • Non-Insulated Conductors (AREA)
  • Manufacturing Of Electric Cables (AREA)
  • Parts Printed On Printed Circuit Boards (AREA)
BR112016002093A 2013-07-31 2014-07-18 ligação de componentes eletrônicos para condutores transparentes de nanofios dotados de um padrão BR112016002093A2 (pt)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US201361860841P 2013-07-31 2013-07-31
PCT/US2014/047212 WO2015017143A1 (en) 2013-07-31 2014-07-18 Bonding electronic components to patterned nanowire transparent conductors

Publications (1)

Publication Number Publication Date
BR112016002093A2 true BR112016002093A2 (pt) 2017-08-01

Family

ID=52432333

Family Applications (1)

Application Number Title Priority Date Filing Date
BR112016002093A BR112016002093A2 (pt) 2013-07-31 2014-07-18 ligação de componentes eletrônicos para condutores transparentes de nanofios dotados de um padrão

Country Status (8)

Country Link
US (1) US9980394B2 (enExample)
EP (1) EP3028126B1 (enExample)
JP (1) JP6426737B2 (enExample)
KR (1) KR102254683B1 (enExample)
CN (1) CN105453001B (enExample)
BR (1) BR112016002093A2 (enExample)
SG (2) SG11201600591VA (enExample)
WO (1) WO2015017143A1 (enExample)

Families Citing this family (18)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US10362685B2 (en) 2013-09-30 2019-07-23 3M Innovative Properties Company Protective coating for printed conductive pattern on patterned nanowire transparent conductors
US20150108632A1 (en) * 2013-10-23 2015-04-23 Nano And Advanced Materials Institute Limited Thin film with negative temperature coefficient behavior and method of making thereof
JP6592246B2 (ja) * 2015-01-27 2019-10-16 株式会社コムラテック 電子回路基板およびその製造方法
US10298152B2 (en) * 2015-04-20 2019-05-21 Lawrence Livermore National Security, Llc Harvesting mechanical and thermal energy by combining nanowires and phase change materials
WO2017006952A1 (ja) * 2015-07-08 2017-01-12 シャープ株式会社 タッチパネル装置
JP6654954B2 (ja) * 2016-03-31 2020-02-26 デクセリアルズ株式会社 異方性導電接続構造体
WO2017176498A1 (en) * 2016-04-05 2017-10-12 3M Innovative Properties Company Nanowire contact pads with enhanced adhesion to metal interconnects
TWI732892B (zh) * 2016-07-26 2021-07-11 日商松下知識產權經營股份有限公司 透視型電極用積層板、透視型電極素材、組件及透視型電極用積層板之製造方法
WO2019032846A1 (en) * 2017-08-10 2019-02-14 Molex, Llc METHOD AND APPARATUS FOR FORMING AN ELECTRICAL CIRCUIT COMPRISING ALUMINUM AND ONE OR MORE DISSOLVABLE METALS
CA2985254A1 (en) 2017-11-14 2019-05-14 Vuereal Inc Integration and bonding of micro-devices into system substrate
DE102018106959A1 (de) * 2018-03-23 2019-09-26 Osram Opto Semiconductors Gmbh Optoelektronisches bauelement und verfahren zur herstellung eines optoelektronischen bauelements
CN113243045B (zh) * 2019-01-22 2022-11-29 深圳市柔宇科技股份有限公司 柔性显示面板及其制作方法
US11387202B2 (en) * 2019-03-01 2022-07-12 Invensas Llc Nanowire bonding interconnect for fine-pitch microelectronics
DE112020001930A5 (de) 2019-04-15 2022-01-05 Wika Alexander Wiegand Se & Co. Kg Sensor zur Erfassung von Druck, Füllstand, Dichte, Temperatur, Masse und/oder Durchfluss
CN113710999A (zh) 2019-04-17 2021-11-26 威卡亚力山大维甘德欧洲两合公司 用于检测压力和/或料位和/或流量和/或密度和/或质量和/或温度的传感器
CN112860130A (zh) * 2019-11-26 2021-05-28 英属维尔京群岛商天材创新材料科技股份有限公司 触控面板及其制作方法
US11261529B2 (en) * 2020-03-31 2022-03-01 Futuretech Capital, Inc. Reduced visibility conductive micro mesh touch sensor
US20250106995A1 (en) * 2023-09-27 2025-03-27 Apple Inc. Compact interface through hinge connector

Family Cites Families (20)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6037005A (en) * 1998-05-12 2000-03-14 3M Innovative Properties Company Display substrate electrodes with auxiliary metal layers for enhanced conductivity
US6975067B2 (en) 2002-12-19 2005-12-13 3M Innovative Properties Company Organic electroluminescent device and encapsulation method
US7888604B2 (en) 2005-04-11 2011-02-15 3M Innovative Properties Company Connection method of a flexible printed circuit board with two printed circuit boards, and electric or electronic component with parts connected by the connection method
KR20120128155A (ko) 2005-08-12 2012-11-26 캄브리오스 테크놀로지즈 코포레이션 나노와이어 기반의 투명 도전체
EP3595016A1 (en) 2006-10-12 2020-01-15 Cambrios Film Solutions Corporation Nanowire-based transparent conductors and method of making them
EP2252662A1 (en) * 2008-02-26 2010-11-24 Cambrios Technologies Corporation Methods and compositions for ink jet deposition of conductive features
JP5397376B2 (ja) * 2008-08-11 2014-01-22 コニカミノルタ株式会社 透明電極、有機エレクトロルミネッセンス素子及び透明電極の製造方法
US10773490B2 (en) 2009-11-20 2020-09-15 3M Innovative Properties Company Surface-modified adhesives
KR101219139B1 (ko) * 2009-12-24 2013-01-07 제일모직주식회사 이방 도전성 페이스트, 필름 및 이를 포함하는 회로접속구조체
WO2011119707A2 (en) * 2010-03-23 2011-09-29 Cambrios Technologies Corporation Etch patterning of nanostructure transparent conductors
JP4870836B1 (ja) * 2010-11-19 2012-02-08 日本写真印刷株式会社 狭額縁タッチ入力シートの製造方法
JP4968414B2 (ja) 2010-07-05 2012-07-04 Ｄｉｃ株式会社 透明導電層付き基体及びその製造方法、並びにタッチパネル用透明導電膜積層体、タッチパネル
US20120247527A1 (en) 2010-12-21 2012-10-04 Alphabet Energy, Inc. Electrode structures for arrays of nanostructures and methods thereof
EP2672369A4 (en) * 2011-02-04 2014-11-12 Shinetsu Polymer Co CAPACITIVE SENSING SHEET AND METHOD FOR MANUFACTURING THE SAME
EP2697684B1 (en) * 2011-04-15 2015-05-20 3M Innovative Properties Company Transparent electrode for electronic displays
JP2013077435A (ja) * 2011-09-30 2013-04-25 Oji Holdings Corp 導電性転写シートおよび導電性積層体
KR20130071863A (ko) 2011-12-21 2013-07-01 삼성전기주식회사 터치패널
KR101714286B1 (ko) * 2012-11-08 2017-03-08 알프스 덴키 가부시키가이샤 도전체 및 그 제조 방법
SG11201504125UA (en) 2012-12-07 2015-06-29 3M Innovative Properties Co Method of making transparent conductors on a substrate
US9549462B2 (en) * 2013-03-26 2017-01-17 Kaneka Corporation Conductive film substrate, transparent conductive film, and method for producing transparent conductive film

Also Published As

Publication number Publication date
SG11201600591VA (en) 2016-02-26
CN105453001B (zh) 2018-10-16
EP3028126B1 (en) 2020-10-07
JP2016530622A (ja) 2016-09-29
CN105453001A (zh) 2016-03-30
WO2015017143A1 (en) 2015-02-05
SG10201808518RA (en) 2018-10-30
US9980394B2 (en) 2018-05-22
KR102254683B1 (ko) 2021-05-21
JP6426737B2 (ja) 2018-11-21
US20160143153A1 (en) 2016-05-19
EP3028126A1 (en) 2016-06-08
KR20160036571A (ko) 2016-04-04
EP3028126A4 (en) 2017-01-25

Similar Documents

Publication Publication Date Title
BR112016002093A2 (pt) ligação de componentes eletrônicos para condutores transparentes de nanofios dotados de um padrão
BR112016006975A2 (pt) revestimento protetor para padrão condutivo impresso em condutores transparentes de nanofio dotados de um padrão
ATE530443T1 (de) Grossflächiger schaltkreis mit applikationen
BR112016025167A2 (pt) elemento de conexão elétrica para o contato de uma estrutura eletricamente condutora sobre um substrato
BR112014029731A2 (pt) vidro com um elemento de conexão elétrica
BR112015005357A2 (pt) vidraça tendo um elemento de conexão elétrica
BR112015005078A2 (pt) chapa com elemento de conexão elétrica
JP2015233164A5 (enExample)
GB201213442D0 (en) Security wrap with breakable conductors
BR112019001967A2 (pt) pacote de montagem de elemento elétrico, pacote de matriz e dispositivo elétrico
BR112018010834A2 (pt) filme e método para produção de um filme
BR112013028049A2 (pt) painel com um elemento de conexão elétrico
JP2010040522A5 (enExample)
WO2014158856A3 (en) Low-profile lighting systems
EP4351284A3 (en) Flexible wiring for low temperature applications
MX379589B (es) Estructura de capas multiples y metodo de fabricacion relacionado para componentes electronicos.
EP2760046A3 (en) Lamp unit
EP3566264A4 (en) ELECTRICAL WIRING DEVICES WITH SCREWLESS CONNECTION TERMINALS
AR098964A1 (es) Cable de alta visibilidad
BR112016013982A2 (pt) Máquina eletromagnética e turbina compreendendo uma máquina eletromagnética
EP3040381A4 (en) Thiol group-containing colored compound, metal nanowire, dispersion, transparent conductive film, information input device, and electronic device
MY189234A (en) Epoxy resin composition, resin layer-attached carrier material metal base circuit substrate, and electronic device
SG10201401166YA (en) Integrated circuit packaging system with embedded pad on layered substrate and method of manufacture thereof
MX2016014361A (es) Montaje de conector de placa de circuito impreso que tiene protector de contacto con miembros de fijacion integrales.
EP2752880A3 (en) Graphene electronic devices and methods of manufacturing the same

Legal Events

Date Code Title Description
B08F Application dismissed because of non-payment of annual fees [chapter 8.6 patent gazette]
B08K Patent lapsed as no evidence of payment of the annual fee has been furnished to inpi [chapter 8.11 patent gazette]

Free format text: EM VIRTUDE DO ARQUIVAMENTO PUBLICADO NA RPI 2471 DE 15-05-2018 E CONSIDERANDO AUSENCIA DE MANIFESTACAO DENTRO DOS PRAZOS LEGAIS, INFORMO QUE CABE SER MANTIDO O ARQUIVAMENTO DO PEDIDO DE PATENTE, CONFORME O DISPOSTO NO ARTIGO 12, DA RESOLUCAO 113/2013.