JP2013533605A5 - - Google Patents

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Publication number
JP2013533605A5
JP2013533605A5 JP2013511210A JP2013511210A JP2013533605A5 JP 2013533605 A5 JP2013533605 A5 JP 2013533605A5 JP 2013511210 A JP2013511210 A JP 2013511210A JP 2013511210 A JP2013511210 A JP 2013511210A JP 2013533605 A5 JP2013533605 A5 JP 2013533605A5
Authority
JP
Japan
Prior art keywords
layer
conductive circuit
cover
cover film
adhesive layer
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP2013511210A
Other languages
English (en)
Japanese (ja)
Other versions
JP2013533605A (ja
JP6087810B2 (ja
Filing date
Publication date
Application filed filed Critical
Priority claimed from PCT/US2011/035486 external-priority patent/WO2011146258A2/en
Publication of JP2013533605A publication Critical patent/JP2013533605A/ja
Publication of JP2013533605A5 publication Critical patent/JP2013533605A5/ja
Application granted granted Critical
Publication of JP6087810B2 publication Critical patent/JP6087810B2/ja
Expired - Fee Related legal-status Critical Current
Anticipated expiration legal-status Critical

Links

JP2013511210A 2010-05-20 2011-05-06 フレキシブル回路カバーフィルム接着強化 Expired - Fee Related JP6087810B2 (ja)

Applications Claiming Priority (7)

Application Number Priority Date Filing Date Title
US34653810P 2010-05-20 2010-05-20
US61/346,538 2010-05-20
US38977110P 2010-10-05 2010-10-05
US61/389,771 2010-10-05
US201161434689P 2011-01-20 2011-01-20
US61/434,689 2011-01-20
PCT/US2011/035486 WO2011146258A2 (en) 2010-05-20 2011-05-06 Flexible circuit coverfilm adhesion enhancement

Publications (3)

Publication Number Publication Date
JP2013533605A JP2013533605A (ja) 2013-08-22
JP2013533605A5 true JP2013533605A5 (enExample) 2014-06-26
JP6087810B2 JP6087810B2 (ja) 2017-03-01

Family

ID=44971514

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2013511210A Expired - Fee Related JP6087810B2 (ja) 2010-05-20 2011-05-06 フレキシブル回路カバーフィルム接着強化

Country Status (6)

Country Link
US (1) US20110284268A1 (enExample)
JP (1) JP6087810B2 (enExample)
KR (1) KR101834023B1 (enExample)
CN (1) CN102907184B (enExample)
SG (1) SG185566A1 (enExample)
WO (1) WO2011146258A2 (enExample)

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KR102365120B1 (ko) 2013-11-22 2022-02-18 메디데이타 솔루션즈, 인코포레이티드 심장 활동 감지 및 분석용 등각 센서 시스템
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US10485118B2 (en) 2014-03-04 2019-11-19 Mc10, Inc. Multi-part flexible encapsulation housing for electronic devices and methods of making the same
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US9899330B2 (en) * 2014-10-03 2018-02-20 Mc10, Inc. Flexible electronic circuits with embedded integrated circuit die
USD781270S1 (en) 2014-10-15 2017-03-14 Mc10, Inc. Electronic device having antenna
CN104441884A (zh) * 2014-12-25 2015-03-25 广东生益科技股份有限公司 聚酰亚胺覆盖膜及制作方法
US10477354B2 (en) 2015-02-20 2019-11-12 Mc10, Inc. Automated detection and configuration of wearable devices based on on-body status, location, and/or orientation
US10398343B2 (en) 2015-03-02 2019-09-03 Mc10, Inc. Perspiration sensor
WO2017015000A1 (en) 2015-07-17 2017-01-26 Mc10, Inc. Conductive stiffener, method of making a conductive stiffener, and conductive adhesive and encapsulation layers
JP6613682B2 (ja) * 2015-07-28 2019-12-04 セイコーエプソン株式会社 電子デバイス、液体吐出ヘッド。
WO2017031129A1 (en) 2015-08-19 2017-02-23 Mc10, Inc. Wearable heat flux devices and methods of use
CN108290070A (zh) 2015-10-01 2018-07-17 Mc10股份有限公司 用于与虚拟环境相互作用的方法和系统
US10532211B2 (en) 2015-10-05 2020-01-14 Mc10, Inc. Method and system for neuromodulation and stimulation
CN115175014A (zh) 2016-02-22 2022-10-11 美谛达解决方案公司 贴身传感器系统
EP3420733A4 (en) 2016-02-22 2019-06-26 Mc10, Inc. SYSTEM, DEVICE AND METHOD FOR AM-BODY DETECTION OF SENSOR INFORMATION WITH COUPLED HUB AND SENSOR NODES
EP3445230B1 (en) 2016-04-19 2024-03-13 Medidata Solutions, Inc. Method and system for measuring perspiration
US10447347B2 (en) 2016-08-12 2019-10-15 Mc10, Inc. Wireless charger and high speed data off-loader
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