JP6087810B2 - フレキシブル回路カバーフィルム接着強化 - Google Patents
フレキシブル回路カバーフィルム接着強化 Download PDFInfo
- Publication number
- JP6087810B2 JP6087810B2 JP2013511210A JP2013511210A JP6087810B2 JP 6087810 B2 JP6087810 B2 JP 6087810B2 JP 2013511210 A JP2013511210 A JP 2013511210A JP 2013511210 A JP2013511210 A JP 2013511210A JP 6087810 B2 JP6087810 B2 JP 6087810B2
- Authority
- JP
- Japan
- Prior art keywords
- layer
- cover film
- cover
- encapsulant
- film
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
- 239000013039 cover film Substances 0.000 title claims description 53
- 239000010410 layer Substances 0.000 claims description 81
- 239000008393 encapsulating agent Substances 0.000 claims description 29
- 239000000463 material Substances 0.000 claims description 23
- 239000012790 adhesive layer Substances 0.000 claims description 14
- 239000000758 substrate Substances 0.000 claims description 12
- 238000005538 encapsulation Methods 0.000 claims description 3
- 229920001646 UPILEX Polymers 0.000 description 28
- 229920006259 thermoplastic polyimide Polymers 0.000 description 23
- 239000000853 adhesive Substances 0.000 description 20
- 230000001070 adhesive effect Effects 0.000 description 20
- 239000010408 film Substances 0.000 description 20
- 229920001721 polyimide Polymers 0.000 description 16
- 239000004642 Polyimide Substances 0.000 description 15
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 14
- 229920001187 thermosetting polymer Polymers 0.000 description 13
- 239000000126 substance Substances 0.000 description 11
- KWYUFKZDYYNOTN-UHFFFAOYSA-M Potassium hydroxide Chemical compound [OH-].[K+] KWYUFKZDYYNOTN-UHFFFAOYSA-M 0.000 description 10
- LYCAIKOWRPUZTN-UHFFFAOYSA-N Ethylene glycol Chemical compound OCCO LYCAIKOWRPUZTN-UHFFFAOYSA-N 0.000 description 8
- 239000011889 copper foil Substances 0.000 description 8
- 238000000034 method Methods 0.000 description 8
- HZAXFHJVJLSVMW-UHFFFAOYSA-N 2-Aminoethan-1-ol Chemical compound NCCO HZAXFHJVJLSVMW-UHFFFAOYSA-N 0.000 description 6
- HEMHJVSKTPXQMS-UHFFFAOYSA-M Sodium hydroxide Chemical compound [OH-].[Na+] HEMHJVSKTPXQMS-UHFFFAOYSA-M 0.000 description 6
- 229910052802 copper Inorganic materials 0.000 description 6
- 239000010949 copper Substances 0.000 description 6
- 238000004049 embossing Methods 0.000 description 6
- 238000005530 etching Methods 0.000 description 6
- 239000011248 coating agent Substances 0.000 description 5
- 238000000576 coating method Methods 0.000 description 5
- -1 polyethylene naphthalate Polymers 0.000 description 5
- 238000007639 printing Methods 0.000 description 5
- 238000007788 roughening Methods 0.000 description 5
- 239000002904 solvent Substances 0.000 description 5
- 239000004593 Epoxy Substances 0.000 description 4
- 239000000203 mixture Substances 0.000 description 4
- 239000000243 solution Substances 0.000 description 4
- ZWEHNKRNPOVVGH-UHFFFAOYSA-N 2-Butanone Chemical compound CCC(C)=O ZWEHNKRNPOVVGH-UHFFFAOYSA-N 0.000 description 3
- KFZMGEQAYNKOFK-UHFFFAOYSA-N Isopropanol Chemical compound CC(C)O KFZMGEQAYNKOFK-UHFFFAOYSA-N 0.000 description 3
- YXFVVABEGXRONW-UHFFFAOYSA-N Toluene Chemical compound CC1=CC=CC=C1 YXFVVABEGXRONW-UHFFFAOYSA-N 0.000 description 3
- 239000002313 adhesive film Substances 0.000 description 3
- 239000002585 base Substances 0.000 description 3
- 230000000052 comparative effect Effects 0.000 description 3
- 230000032798 delamination Effects 0.000 description 3
- 229910052751 metal Inorganic materials 0.000 description 3
- 239000002184 metal Substances 0.000 description 3
- 229920000647 polyepoxide Polymers 0.000 description 3
- 230000008569 process Effects 0.000 description 3
- VHUUQVKOLVNVRT-UHFFFAOYSA-N Ammonium hydroxide Chemical class [NH4+].[OH-] VHUUQVKOLVNVRT-UHFFFAOYSA-N 0.000 description 2
- QUSNBJAOOMFDIB-UHFFFAOYSA-N Ethylamine Chemical compound CCN QUSNBJAOOMFDIB-UHFFFAOYSA-N 0.000 description 2
- 229910052783 alkali metal Inorganic materials 0.000 description 2
- 150000001412 amines Chemical class 0.000 description 2
- 235000011114 ammonium hydroxide Nutrition 0.000 description 2
- 230000008901 benefit Effects 0.000 description 2
- IISBACLAFKSPIT-UHFFFAOYSA-N bisphenol A Chemical compound C=1C=C(O)C=CC=1C(C)(C)C1=CC=C(O)C=C1 IISBACLAFKSPIT-UHFFFAOYSA-N 0.000 description 2
- 239000003822 epoxy resin Substances 0.000 description 2
- LIWAQLJGPBVORC-UHFFFAOYSA-N ethylmethylamine Chemical compound CCNC LIWAQLJGPBVORC-UHFFFAOYSA-N 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- 229920001568 phenolic resin Polymers 0.000 description 2
- 239000005011 phenolic resin Substances 0.000 description 2
- 229920002647 polyamide Polymers 0.000 description 2
- 238000002791 soaking Methods 0.000 description 2
- WGTYBPLFGIVFAS-UHFFFAOYSA-M tetramethylammonium hydroxide Chemical compound [OH-].C[N+](C)(C)C WGTYBPLFGIVFAS-UHFFFAOYSA-M 0.000 description 2
- 230000007704 transition Effects 0.000 description 2
- KUBDPQJOLOUJRM-UHFFFAOYSA-N 2-(chloromethyl)oxirane;4-[2-(4-hydroxyphenyl)propan-2-yl]phenol Chemical compound ClCC1CO1.C=1C=C(O)C=CC=1C(C)(C)C1=CC=C(O)C=C1 KUBDPQJOLOUJRM-UHFFFAOYSA-N 0.000 description 1
- KXGFMDJXCMQABM-UHFFFAOYSA-N 2-methoxy-6-methylphenol Chemical compound [CH]OC1=CC=CC([CH])=C1O KXGFMDJXCMQABM-UHFFFAOYSA-N 0.000 description 1
- LXBGSDVWAMZHDD-UHFFFAOYSA-N 2-methyl-1h-imidazole Chemical compound CC1=NC=CN1 LXBGSDVWAMZHDD-UHFFFAOYSA-N 0.000 description 1
- 229910021591 Copper(I) chloride Inorganic materials 0.000 description 1
- PIICEJLVQHRZGT-UHFFFAOYSA-N Ethylenediamine Chemical compound NCCN PIICEJLVQHRZGT-UHFFFAOYSA-N 0.000 description 1
- WUGQZFFCHPXWKQ-UHFFFAOYSA-N Propanolamine Chemical compound NCCCO WUGQZFFCHPXWKQ-UHFFFAOYSA-N 0.000 description 1
- 239000002174 Styrene-butadiene Substances 0.000 description 1
- 150000001252 acrylic acid derivatives Chemical class 0.000 description 1
- 230000004913 activation Effects 0.000 description 1
- 230000006978 adaptation Effects 0.000 description 1
- 230000032683 aging Effects 0.000 description 1
- 239000000908 ammonium hydroxide Substances 0.000 description 1
- 239000007864 aqueous solution Substances 0.000 description 1
- 229920003235 aromatic polyamide Polymers 0.000 description 1
- MTAZNLWOLGHBHU-UHFFFAOYSA-N butadiene-styrene rubber Chemical compound C=CC=C.C=CC1=CC=CC=C1 MTAZNLWOLGHBHU-UHFFFAOYSA-N 0.000 description 1
- 238000003486 chemical etching Methods 0.000 description 1
- OXBLHERUFWYNTN-UHFFFAOYSA-M copper(I) chloride Chemical compound [Cu]Cl OXBLHERUFWYNTN-UHFFFAOYSA-M 0.000 description 1
- 239000012792 core layer Substances 0.000 description 1
- 238000005260 corrosion Methods 0.000 description 1
- 230000007797 corrosion Effects 0.000 description 1
- 230000002950 deficient Effects 0.000 description 1
- 230000001419 dependent effect Effects 0.000 description 1
- ZBCBWPMODOFKDW-UHFFFAOYSA-N diethanolamine Chemical compound OCCNCCO ZBCBWPMODOFKDW-UHFFFAOYSA-N 0.000 description 1
- 238000007598 dipping method Methods 0.000 description 1
- 125000003700 epoxy group Chemical group 0.000 description 1
- 238000007306 functionalization reaction Methods 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- 238000009499 grossing Methods 0.000 description 1
- 230000002209 hydrophobic effect Effects 0.000 description 1
- 238000007654 immersion Methods 0.000 description 1
- 238000002347 injection Methods 0.000 description 1
- 239000007924 injection Substances 0.000 description 1
- 238000007641 inkjet printing Methods 0.000 description 1
- 230000003993 interaction Effects 0.000 description 1
- 238000003475 lamination Methods 0.000 description 1
- 239000012046 mixed solvent Substances 0.000 description 1
- 238000002156 mixing Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 229920003986 novolac Polymers 0.000 description 1
- 230000035515 penetration Effects 0.000 description 1
- 230000010399 physical interaction Effects 0.000 description 1
- 229920005575 poly(amic acid) Polymers 0.000 description 1
- 229920003207 poly(ethylene-2,6-naphthalate) Polymers 0.000 description 1
- 229920003223 poly(pyromellitimide-1,4-diphenyl ether) Polymers 0.000 description 1
- 229920006122 polyamide resin Polymers 0.000 description 1
- 239000011112 polyethylene naphthalate Substances 0.000 description 1
- 229920000642 polymer Polymers 0.000 description 1
- AOHJOMMDDJHIJH-UHFFFAOYSA-N propylenediamine Chemical compound CC(N)CN AOHJOMMDDJHIJH-UHFFFAOYSA-N 0.000 description 1
- 239000011241 protective layer Substances 0.000 description 1
- 150000003839 salts Chemical class 0.000 description 1
- 239000000565 sealant Substances 0.000 description 1
- 239000011734 sodium Substances 0.000 description 1
- 239000011115 styrene butadiene Substances 0.000 description 1
- 229920003048 styrene butadiene rubber Polymers 0.000 description 1
- 239000002344 surface layer Substances 0.000 description 1
- 238000004381 surface treatment Methods 0.000 description 1
- 229920001169 thermoplastic Polymers 0.000 description 1
- 239000004416 thermosoftening plastic Substances 0.000 description 1
- 238000012876 topography Methods 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/22—Secondary treatment of printed circuits
- H05K3/28—Applying non-metallic protective coatings
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/38—Improvement of the adhesion between the insulating substrate and the metal
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C59/00—Surface shaping of articles, e.g. embossing; Apparatus therefor
- B29C59/02—Surface shaping of articles, e.g. embossing; Apparatus therefor by mechanical means, e.g. pressing
- B29C59/04—Surface shaping of articles, e.g. embossing; Apparatus therefor by mechanical means, e.g. pressing using rollers or endless belts
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/18—Printed circuits structurally associated with non-printed electric components
- H05K1/189—Printed circuits structurally associated with non-printed electric components characterised by the use of a flexible or folded printed circuit
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/03—Conductive materials
- H05K2201/0332—Structure of the conductor
- H05K2201/0388—Other aspects of conductors
- H05K2201/0397—Tab
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
- H05K2201/10621—Components characterised by their electrical contacts
- H05K2201/10674—Flip chip
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
- H05K2201/10954—Other details of electrical connections
- H05K2201/10977—Encapsulated connections
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/01—Tools for processing; Objects used during processing
- H05K2203/0104—Tools for processing; Objects used during processing for patterning or coating
- H05K2203/0108—Male die used for patterning, punching or transferring
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/01—Tools for processing; Objects used during processing
- H05K2203/0104—Tools for processing; Objects used during processing for patterning or coating
- H05K2203/0143—Using a roller; Specific shape thereof; Providing locally adhesive portions thereon
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/11—Treatments characterised by their effect, e.g. heating, cooling, roughening
- H05K2203/1152—Replicating the surface structure of a sacrificial layer, e.g. for roughening
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T156/00—Adhesive bonding and miscellaneous chemical manufacture
- Y10T156/10—Methods of surface bonding and/or assembly therefor
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Non-Metallic Protective Coatings For Printed Circuits (AREA)
- Laminated Bodies (AREA)
- Particle Formation And Scattering Control In Inkjet Printers (AREA)
Description
本出願は、2010年5月20日に出願された米国特許仮出願第61/346538号、2010年10月5日に出願された同第61/389771号、及び2011年1月20日に出願された同第61/434689号の利益を主張する。
本発明は、インクジェットプリンタ用途におけるフレキシブル回路カバーフィルムと封入材料との間の接着を改善することに関する。
Claims (2)
- 物品であって、
基材層を有するフレキシブル回路と、
前記基材層上のパターン化導電回路と、
前記導電回路に接着層で接着されるカバーフィルムを備える、前記導電回路上のカバー層であって、前記カバーフィルムの両側の表面が非平滑化される、カバー層と、を備え、
前記接着層と反対側の前記カバーフィルムの前記非平滑化された表面が、インクジェットプリンタ封入材料に接着されており、
前記インクジェットプリンタ封入材料でインクジェットダイの一部を覆うことにより、インクジェットダイと共に封入されるための、物品。 - 基材層と、前記基材層上のパターン化導電回路とを有するフレキシブル回路を提供する工程と、
前記導電回路上にカバー層を適用する工程であって、前記カバー層が前記導電回路に接着層で接着されるカバーフィルムを備え、前記カバーフィルムの両側の表面が非平滑化される、工程と、
インクジェットプリンタ封入材料を、前記接着層と反対側の前記カバーフィルムの前記非平滑化された表面上及びインクジェットダイの一部に適用する工程と、を含む、方法。
Applications Claiming Priority (7)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US34653810P | 2010-05-20 | 2010-05-20 | |
US61/346,538 | 2010-05-20 | ||
US38977110P | 2010-10-05 | 2010-10-05 | |
US61/389,771 | 2010-10-05 | ||
US201161434689P | 2011-01-20 | 2011-01-20 | |
US61/434,689 | 2011-01-20 | ||
PCT/US2011/035486 WO2011146258A2 (en) | 2010-05-20 | 2011-05-06 | Flexible circuit coverfilm adhesion enhancement |
Publications (3)
Publication Number | Publication Date |
---|---|
JP2013533605A JP2013533605A (ja) | 2013-08-22 |
JP2013533605A5 JP2013533605A5 (ja) | 2014-06-26 |
JP6087810B2 true JP6087810B2 (ja) | 2017-03-01 |
Family
ID=44971514
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2013511210A Expired - Fee Related JP6087810B2 (ja) | 2010-05-20 | 2011-05-06 | フレキシブル回路カバーフィルム接着強化 |
Country Status (6)
Country | Link |
---|---|
US (1) | US20110284268A1 (ja) |
JP (1) | JP6087810B2 (ja) |
KR (1) | KR101834023B1 (ja) |
CN (1) | CN102907184B (ja) |
SG (1) | SG185566A1 (ja) |
WO (1) | WO2011146258A2 (ja) |
Families Citing this family (31)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US8097926B2 (en) | 2008-10-07 | 2012-01-17 | Mc10, Inc. | Systems, methods, and devices having stretchable integrated circuitry for sensing and delivering therapy |
US9123614B2 (en) | 2008-10-07 | 2015-09-01 | Mc10, Inc. | Methods and applications of non-planar imaging arrays |
US9289132B2 (en) | 2008-10-07 | 2016-03-22 | Mc10, Inc. | Catheter balloon having stretchable integrated circuitry and sensor array |
US8389862B2 (en) | 2008-10-07 | 2013-03-05 | Mc10, Inc. | Extremely stretchable electronics |
US9226402B2 (en) | 2012-06-11 | 2015-12-29 | Mc10, Inc. | Strain isolation structures for stretchable electronics |
US9295842B2 (en) | 2012-07-05 | 2016-03-29 | Mc10, Inc. | Catheter or guidewire device including flow sensing and use thereof |
WO2014058473A1 (en) | 2012-10-09 | 2014-04-17 | Mc10, Inc. | Conformal electronics integrated with apparel |
US9171794B2 (en) | 2012-10-09 | 2015-10-27 | Mc10, Inc. | Embedding thin chips in polymer |
US9335355B2 (en) * | 2013-03-06 | 2016-05-10 | Apple Inc. | Electronic device with liquid contact sensors |
US9706647B2 (en) | 2013-05-14 | 2017-07-11 | Mc10, Inc. | Conformal electronics including nested serpentine interconnects |
JP2016527649A (ja) | 2013-08-05 | 2016-09-08 | エムシー10 インコーポレイテッドMc10,Inc. | 適合する電子機器を含む可撓性温度センサ |
US10467926B2 (en) | 2013-10-07 | 2019-11-05 | Mc10, Inc. | Conformal sensor systems for sensing and analysis |
US9949691B2 (en) | 2013-11-22 | 2018-04-24 | Mc10, Inc. | Conformal sensor systems for sensing and analysis of cardiac activity |
CA2935372C (en) | 2014-01-06 | 2023-08-08 | Mc10, Inc. | Encapsulated conformal electronic systems and devices, and methods of making and using the same |
JP6637896B2 (ja) | 2014-03-04 | 2020-01-29 | エムシー10 インコーポレイテッドMc10,Inc. | 電子デバイス用の可撓性を有するマルチパート封止ハウジングを備えるコンフォーマルなicデバイス |
TW201602680A (zh) * | 2014-07-01 | 2016-01-16 | 友達光電股份有限公司 | 顯示裝置 |
US9899330B2 (en) * | 2014-10-03 | 2018-02-20 | Mc10, Inc. | Flexible electronic circuits with embedded integrated circuit die |
USD781270S1 (en) | 2014-10-15 | 2017-03-14 | Mc10, Inc. | Electronic device having antenna |
CN104441884A (zh) * | 2014-12-25 | 2015-03-25 | 广东生益科技股份有限公司 | 聚酰亚胺覆盖膜及制作方法 |
EP3258837A4 (en) | 2015-02-20 | 2018-10-10 | Mc10, Inc. | Automated detection and configuration of wearable devices based on on-body status, location, and/or orientation |
WO2016140961A1 (en) | 2015-03-02 | 2016-09-09 | Mc10, Inc. | Perspiration sensor |
WO2017015000A1 (en) | 2015-07-17 | 2017-01-26 | Mc10, Inc. | Conductive stiffener, method of making a conductive stiffener, and conductive adhesive and encapsulation layers |
JP6613682B2 (ja) * | 2015-07-28 | 2019-12-04 | セイコーエプソン株式会社 | 電子デバイス、液体吐出ヘッド。 |
WO2017031129A1 (en) | 2015-08-19 | 2017-02-23 | Mc10, Inc. | Wearable heat flux devices and methods of use |
US10300371B2 (en) | 2015-10-01 | 2019-05-28 | Mc10, Inc. | Method and system for interacting with a virtual environment |
CN108289630A (zh) | 2015-10-05 | 2018-07-17 | Mc10股份有限公司 | 用于神经调节和刺激的方法和系统 |
EP3420733A4 (en) | 2016-02-22 | 2019-06-26 | Mc10, Inc. | SYSTEM, DEVICE AND METHOD FOR ACQUIRING ON THE BODY OF SENSOR AND CONCENTRATOR NODE COUPLED WITH SENSOR INFORMATION |
US10277386B2 (en) | 2016-02-22 | 2019-04-30 | Mc10, Inc. | System, devices, and method for on-body data and power transmission |
WO2017184705A1 (en) | 2016-04-19 | 2017-10-26 | Mc10, Inc. | Method and system for measuring perspiration |
US10447347B2 (en) | 2016-08-12 | 2019-10-15 | Mc10, Inc. | Wireless charger and high speed data off-loader |
TWI678596B (zh) * | 2018-09-13 | 2019-12-01 | 新應材股份有限公司 | 正型光阻組成物及圖案化聚醯亞胺層之形成方法 |
Family Cites Families (30)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US3556899A (en) * | 1967-10-09 | 1971-01-19 | Schjeldahl Co G T | Tack bonding of coverlay |
JPH054294Y2 (ja) * | 1990-03-05 | 1993-02-02 | ||
JPH04267597A (ja) * | 1991-02-22 | 1992-09-24 | Sumitomo Electric Ind Ltd | フレキシブルプリント配線板の製造方法 |
US5374469A (en) * | 1991-09-19 | 1994-12-20 | Nitto Denko Corporation | Flexible printed substrate |
US5442386A (en) * | 1992-10-13 | 1995-08-15 | Hewlett-Packard Company | Structure and method for preventing ink shorting of conductors connected to printhead |
US5637166A (en) * | 1994-10-04 | 1997-06-10 | Hewlett-Packard Company | Similar material thermal tab attachment process for ink-jet pen |
JPH08148836A (ja) * | 1994-11-15 | 1996-06-07 | Toshiba Chem Corp | 多層フレックスリジット配線板 |
JPH08153940A (ja) * | 1994-11-25 | 1996-06-11 | Kanegafuchi Chem Ind Co Ltd | フレキシブル回路基板 |
US6318843B1 (en) * | 1997-10-23 | 2001-11-20 | Hewlett-Packard Company | Control of adhesive flow in an inkjet printer printhead |
US6204454B1 (en) * | 1997-12-27 | 2001-03-20 | Tdk Corporation | Wiring board and process for the production thereof |
KR100328807B1 (ko) * | 1998-05-08 | 2002-03-14 | 가네코 히사시 | 제조비용이 저렴하고 충분한 접착 강도가 수득될 수 있는 수지구조물 및 이의 제조 방법 |
JP3197540B2 (ja) * | 1999-02-05 | 2001-08-13 | ソニーケミカル株式会社 | 基板素片、及びフレキシブル基板 |
JP2000294921A (ja) * | 1999-04-01 | 2000-10-20 | Victor Co Of Japan Ltd | プリンス基板及びその製造方法 |
JP3205548B2 (ja) * | 1999-10-01 | 2001-09-04 | ソニーケミカル株式会社 | 多層フレキシブル配線板 |
JP3994262B2 (ja) * | 1999-10-04 | 2007-10-17 | セイコーエプソン株式会社 | 半導体装置及びその製造方法、回路基板並びに電子機器 |
US6570259B2 (en) * | 2001-03-22 | 2003-05-27 | International Business Machines Corporation | Apparatus to reduce thermal fatigue stress on flip chip solder connections |
JP3563730B2 (ja) * | 2002-06-07 | 2004-09-08 | 松下電器産業株式会社 | フレキシブルプリント回路基板 |
JP4196108B2 (ja) * | 2004-01-27 | 2008-12-17 | パナソニック株式会社 | フレキシブルプリント基板及びフレキシブルプリント基板の製造方法 |
JP2007046003A (ja) * | 2005-08-12 | 2007-02-22 | Three M Innovative Properties Co | 被着体の貼付方法 |
US7691675B2 (en) * | 2005-10-24 | 2010-04-06 | Hewlett-Packard Development Company, L.P. | Encapsulating electrical connections |
JP2007194341A (ja) * | 2006-01-18 | 2007-08-02 | Kyocera Chemical Corp | フレキシブルプリント配線板及びその製造方法 |
US20070165075A1 (en) * | 2006-01-19 | 2007-07-19 | 3M Innovative Properties Company | Flexible circuits having ink-resistant covercoats |
JP4845705B2 (ja) | 2006-12-19 | 2011-12-28 | 日東電工株式会社 | プリント配線基板、その製造方法および電子機器 |
JP2008299150A (ja) * | 2007-06-01 | 2008-12-11 | Funai Electric Co Ltd | 液晶モジュール |
JP4974803B2 (ja) * | 2007-08-03 | 2012-07-11 | タツタ電線株式会社 | プリント配線板用シールドフィルム及びプリント配線板 |
JP2009099597A (ja) * | 2007-10-12 | 2009-05-07 | Nec Electronics Corp | 半導体装置およびその製造方法 |
JP2009096915A (ja) * | 2007-10-18 | 2009-05-07 | Hitachi Chem Co Ltd | 熱硬化性樹脂組成物、これを用いたフレキシブル基板及び電子部品 |
JP2009119688A (ja) * | 2007-11-14 | 2009-06-04 | Konica Minolta Holdings Inc | 圧電素子の検査方法及びインクジェットヘッドの製造方法 |
CN101684181B (zh) * | 2008-09-26 | 2011-12-14 | 比亚迪股份有限公司 | 一种光敏聚酰亚胺及其柔性线路板 |
JP5376653B2 (ja) * | 2009-06-09 | 2013-12-25 | 株式会社フジクラ | フレキシブルプリント基板およびその製造方法 |
-
2011
- 2011-05-06 CN CN201180025008.8A patent/CN102907184B/zh active Active
- 2011-05-06 WO PCT/US2011/035486 patent/WO2011146258A2/en active Application Filing
- 2011-05-06 SG SG2012083721A patent/SG185566A1/en unknown
- 2011-05-06 US US13/102,214 patent/US20110284268A1/en not_active Abandoned
- 2011-05-06 KR KR1020127032708A patent/KR101834023B1/ko active IP Right Grant
- 2011-05-06 JP JP2013511210A patent/JP6087810B2/ja not_active Expired - Fee Related
Also Published As
Publication number | Publication date |
---|---|
US20110284268A1 (en) | 2011-11-24 |
KR20130113330A (ko) | 2013-10-15 |
CN102907184B (zh) | 2016-08-24 |
SG185566A1 (en) | 2012-12-28 |
KR101834023B1 (ko) | 2018-03-02 |
WO2011146258A2 (en) | 2011-11-24 |
JP2013533605A (ja) | 2013-08-22 |
CN102907184A (zh) | 2013-01-30 |
WO2011146258A3 (en) | 2012-05-10 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
JP6087810B2 (ja) | フレキシブル回路カバーフィルム接着強化 | |
CN110023435B (zh) | 粘合片和其剥离方法 | |
TWI530880B (zh) | Ic卡/標籤用天線電路構成體及其製造方法 | |
TW201019439A (en) | Package substrate for mounting semiconductor element and method for manufacturing the package substrate | |
JP2009523633A (ja) | 耐インク性カバーコートを有するフレキシブル回路 | |
TW201526031A (zh) | 使用具有嵌段共聚物塗層的導電粒子之固定陣列異向性導電膜 | |
US8303076B2 (en) | Solid ink jet printhead having a polymer layer and processes therefor | |
US20220367325A1 (en) | Methods and devices using microchannels for interconnections | |
JP2007076288A (ja) | 導電性パターン形成用金属箔シート | |
JP2021015276A (ja) | 改善されたドライフィルム配合物 | |
WO2020095919A1 (ja) | 電磁波シールドフィルム、電磁波シールドフィルムの製造方法及びシールドプリント配線板の製造方法 | |
TW201025535A (en) | Semiconductor element-mounting package substrate, and method for manufacturing package substrate | |
WO2018147163A1 (ja) | 接続構造体、異方性接着材料、および接続構造体の製造方法 | |
TW201019443A (en) | Semiconductor element-mounting package substrate, method for manufacturing package substrate, and semiconductor package | |
JP5589406B2 (ja) | 半導体ウェハ加工用接着フィルム及びその製造方法 | |
JP6446964B2 (ja) | 電池用金属端子 | |
JP5592924B2 (ja) | Fpc用保護フィルム | |
JP2014211789A (ja) | 非接触型情報媒体及び非接触型情報媒体付属冊子 | |
KR100938013B1 (ko) | 알 에프 아이디 태그용 인레이 제조 방법 및 이에 이용되는레지스트 잉크용 조성물 | |
JP2009164596A (ja) | 回路接続用接着フィルム、及び回路部材の位置識別用のマークを認識する方法 | |
JP2011178106A (ja) | 金属箔積層体 | |
JP5024190B2 (ja) | Icモジュール製造方法 | |
JP5251803B2 (ja) | 立体的回路基板の製造方法 | |
JP2002334315A (ja) | Ic実装体 | |
JP2007005442A (ja) | 導電性転写箔およびそれを使用したicカード |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
A521 | Request for written amendment filed |
Free format text: JAPANESE INTERMEDIATE CODE: A523 Effective date: 20140502 |
|
A621 | Written request for application examination |
Free format text: JAPANESE INTERMEDIATE CODE: A621 Effective date: 20140502 |
|
A977 | Report on retrieval |
Free format text: JAPANESE INTERMEDIATE CODE: A971007 Effective date: 20140912 |
|
A131 | Notification of reasons for refusal |
Free format text: JAPANESE INTERMEDIATE CODE: A131 Effective date: 20140924 |
|
A521 | Request for written amendment filed |
Free format text: JAPANESE INTERMEDIATE CODE: A523 Effective date: 20141215 |
|
A131 | Notification of reasons for refusal |
Free format text: JAPANESE INTERMEDIATE CODE: A131 Effective date: 20150707 |
|
A521 | Request for written amendment filed |
Free format text: JAPANESE INTERMEDIATE CODE: A523 Effective date: 20151006 |
|
A131 | Notification of reasons for refusal |
Free format text: JAPANESE INTERMEDIATE CODE: A131 Effective date: 20160405 |
|
A521 | Request for written amendment filed |
Free format text: JAPANESE INTERMEDIATE CODE: A523 Effective date: 20160704 |
|
TRDD | Decision of grant or rejection written | ||
A01 | Written decision to grant a patent or to grant a registration (utility model) |
Free format text: JAPANESE INTERMEDIATE CODE: A01 Effective date: 20170104 |
|
A61 | First payment of annual fees (during grant procedure) |
Free format text: JAPANESE INTERMEDIATE CODE: A61 Effective date: 20170202 |
|
R150 | Certificate of patent or registration of utility model |
Ref document number: 6087810 Country of ref document: JP Free format text: JAPANESE INTERMEDIATE CODE: R150 |
|
R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
LAPS | Cancellation because of no payment of annual fees |