SG11201601075PA - Electronic assembly with fiducial marks for precision registration during subsequent processing steps - Google Patents

Electronic assembly with fiducial marks for precision registration during subsequent processing steps

Info

Publication number
SG11201601075PA
SG11201601075PA SG11201601075PA SG11201601075PA SG11201601075PA SG 11201601075P A SG11201601075P A SG 11201601075PA SG 11201601075P A SG11201601075P A SG 11201601075PA SG 11201601075P A SG11201601075P A SG 11201601075PA SG 11201601075P A SG11201601075P A SG 11201601075PA
Authority
SG
Singapore
Prior art keywords
processing steps
subsequent processing
during subsequent
electronic assembly
fiducial marks
Prior art date
Application number
SG11201601075PA
Inventor
Daniel J Theis
Ann M Gilman
Kim B Saulsbury
Matthew S Stay
Shawn C Dodds
Mikhail L Pekurovsky
Original Assignee
3M Innovative Properties Co
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 3M Innovative Properties Co filed Critical 3M Innovative Properties Co
Publication of SG11201601075PA publication Critical patent/SG11201601075PA/en

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0266—Marks, test patterns or identification means
    • H05K1/0269—Marks, test patterns or identification means for visual or optical inspection
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0266—Marks, test patterns or identification means
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0296—Conductive pattern lay-out details not covered by sub groups H05K1/02 - H05K1/0295
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0393—Flexible materials
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/09—Use of materials for the conductive, e.g. metallic pattern
    • H05K1/092—Dispersed materials, e.g. conductive pastes or inks
    • H05K1/097—Inks comprising nanoparticles and specially adapted for being sintered at low temperature
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
    • H05K3/04—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed mechanically, e.g. by punching
    • H05K3/046—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed mechanically, e.g. by punching by selective transfer or selective detachment of a conductive layer
    • H05K3/048—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed mechanically, e.g. by punching by selective transfer or selective detachment of a conductive layer using a lift-off resist pattern or a release layer pattern
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0277—Bendability or stretchability details
    • H05K1/0283—Stretchable printed circuits
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/01—Dielectrics
    • H05K2201/0137—Materials
    • H05K2201/0145—Polyester, e.g. polyethylene terephthalate [PET], polyethylene naphthalate [PEN]
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/01—Dielectrics
    • H05K2201/0137—Materials
    • H05K2201/0154—Polyimide
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/02—Fillers; Particles; Fibers; Reinforcement materials
    • H05K2201/0203—Fillers and particles
    • H05K2201/0242—Shape of an individual particle
    • H05K2201/026—Nanotubes or nanowires
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09818—Shape or layout details not covered by a single group of H05K2201/09009 - H05K2201/09809
    • H05K2201/09918—Optically detected marks used for aligning tool relative to the PCB, e.g. for mounting of components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10007—Types of components
    • H05K2201/10128—Display
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/01—Tools for processing; Objects used during processing
    • H05K2203/0104—Tools for processing; Objects used during processing for patterning or coating
    • H05K2203/0143—Using a roller; Specific shape thereof; Providing locally adhesive portions thereon
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/15—Position of the PCB during processing
    • H05K2203/1545—Continuous processing, i.e. involving rolls moving a band-like or solid carrier along a continuous production path
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/12—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns
    • H05K3/1275—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns by other printing techniques, e.g. letterpress printing, intaglio printing, lithographic printing, offset printing
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H05K3/4644—Manufacturing multilayer circuits by building the multilayer layer by layer, i.e. build-up multilayer circuits
    • H05K3/4679—Aligning added circuit layers or via connections relative to previous circuit layers
SG11201601075PA 2013-08-28 2014-08-11 Electronic assembly with fiducial marks for precision registration during subsequent processing steps SG11201601075PA (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US201361871244P 2013-08-28 2013-08-28
PCT/US2014/050471 WO2015031033A1 (en) 2013-08-28 2014-08-11 Electronic assembly with fiducial marks for precision registration during subsequent processing steps

Publications (1)

Publication Number Publication Date
SG11201601075PA true SG11201601075PA (en) 2016-03-30

Family

ID=52587201

Family Applications (1)

Application Number Title Priority Date Filing Date
SG11201601075PA SG11201601075PA (en) 2013-08-28 2014-08-11 Electronic assembly with fiducial marks for precision registration during subsequent processing steps

Country Status (7)

Country Link
US (1) US9807871B2 (en)
EP (1) EP3039949A4 (en)
JP (1) JP6457528B2 (en)
KR (1) KR102182751B1 (en)
CN (1) CN105474760B (en)
SG (1) SG11201601075PA (en)
WO (1) WO2015031033A1 (en)

Families Citing this family (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5687175B2 (en) * 2011-11-28 2015-03-18 有限会社 ナプラ Method for forming a functional part in a minute space
CN106457858B (en) * 2014-06-20 2018-10-19 3M创新有限公司 The printing of the multiple inks of accuracy registration is realized during subsequent processing
TWI564762B (en) * 2015-04-22 2017-01-01 恆顥科技股份有限公司 Stack film roll and stack film sheet obtained therefrom
US20170148152A1 (en) * 2015-11-25 2017-05-25 General Electric Company Systems and Methods for Monitoring Component Strain
GB2551502A (en) * 2016-06-17 2017-12-27 M-Solv Ltd Apparatus and methods for manufacturing a sensor and a display, and a sensor and a display
CN110072636A (en) 2016-12-07 2019-07-30 3M创新有限公司 The method for being passivated adhesive
CN113226572A (en) * 2018-12-26 2021-08-06 日东电工株式会社 Method for peeling peelable coating film and article
CN113302555A (en) * 2018-12-27 2021-08-24 富士胶片株式会社 Conductive transfer material, method for manufacturing substrate with pattern, laminate, and touch panel
CN113453894A (en) * 2019-02-20 2021-09-28 日东电工株式会社 Laminated body

Family Cites Families (42)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4165688A (en) 1977-04-14 1979-08-28 Magna-Graphics Corporation Ink dam for printing press
FR2421732A1 (en) 1978-04-07 1979-11-02 Sarda Jean Lucien INKING PROCESS AND MECHANISM IN ONE OR MORE COLORS FOR TYPOGRAPHICAL, OFFSET OR OTHER PRINTINGS
JPS5752021A (en) * 1980-09-12 1982-03-27 Citizen Watch Co Ltd Manufacture of liquid crystal display cell
DE3320638C2 (en) 1983-06-08 1986-10-16 Koenig & Bauer AG, 8700 Würzburg Ink dividing device on ink fountain rollers of printing machines
DE3505598C2 (en) 1984-10-30 1986-08-14 Windmöller & Hölscher, 4540 Lengerich Rinse inking unit with divided chamber doctor blade
DE3709177A1 (en) 1987-03-20 1988-09-29 Leybold Ag METHOD AND DEVICE FOR REGULATING THE REACTIVE LAYER DEPOSITION ON SUBSTRATES BY MEANS OF MAGNETIC CATALODES
US4796528A (en) 1987-05-29 1989-01-10 M.A.N. Roland Druckmaschinen Ag Separated ink fountain for a flexographic printing machine
US5012736A (en) 1987-09-21 1991-05-07 Paper Converting Machine Company Sealing assembly for liquid fountain
JPH05327178A (en) * 1991-03-28 1993-12-10 Unitika Ltd Continuous manufacture of transparent conductive board
US5150651A (en) 1991-06-10 1992-09-29 Flores Carlos R Doctor-blade assembly for flexographic press
US5243907A (en) 1992-01-22 1993-09-14 The Langston Corporation Divider seal for split-fountain chambered doctor blade for a flexographic printing press
US5440446A (en) 1993-10-04 1995-08-08 Catalina Coatings, Inc. Acrylate coating material
JP3302296B2 (en) 1997-05-30 2002-07-15 キヤノン株式会社 Manufacturing method of color filter
KR100315911B1 (en) 1997-10-10 2002-09-25 삼성전자 주식회사 Liquid crystal display panel, method for fabricating the same and method for aligning the same
US6029574A (en) 1998-09-30 2000-02-29 Heidelberger Druckmaschinen Ag Dual ink supply system
US7052824B2 (en) 2000-06-30 2006-05-30 E. I. Du Pont De Nemours And Company Process for thick film circuit patterning
US6975067B2 (en) 2002-12-19 2005-12-13 3M Innovative Properties Company Organic electroluminescent device and encapsulation method
US7018713B2 (en) 2003-04-02 2006-03-28 3M Innovative Properties Company Flexible high-temperature ultrabarrier
KR101223098B1 (en) 2004-09-09 2013-01-17 삼성디스플레이 주식회사 Display device and method of manufacturing the same
US20060291481A1 (en) 2005-06-27 2006-12-28 Matsushita Electric Industrial Co., Ltd. Application session resumption in mobile environments
EP1962348B1 (en) 2005-08-12 2013-03-06 Cambrios Technologies Corporation Nanowires-based transparent conductors
JP4068635B2 (en) * 2005-09-30 2008-03-26 松下電器産業株式会社 Wiring board
JP5409369B2 (en) 2006-10-12 2014-02-05 カンブリオス テクノロジーズ コーポレイション Nanowire-based transparent conductor and its application
CN101578560B (en) 2007-01-11 2012-03-21 3M创新有限公司 Web longitudinal position sensor
CN101688794B (en) 2007-06-19 2012-12-12 3M创新有限公司 Systems and methods for fabricating displacement scales
KR20100049540A (en) 2007-06-19 2010-05-12 쓰리엠 이노베이티브 프로퍼티즈 컴파니 Total internal reflection displacement scale
KR101390767B1 (en) 2007-08-31 2014-04-30 엘지디스플레이 주식회사 Method for fabricating display device
US7829168B2 (en) * 2007-11-21 2010-11-09 Promos Technologies Pte. Ltd. Methods for inspecting and optionally reworking summed photolithography patterns resulting from plurally-overlaid patterning steps during mass production of semiconductor devices
SG188158A1 (en) 2008-02-26 2013-03-28 Cambrios Technologies Corp Method and composition for screen printing of conductive features
JP2010021293A (en) * 2008-07-09 2010-01-28 Nec Electronics Corp Semiconductor device and method of manufacturing the same
JP4754613B2 (en) * 2008-11-27 2011-08-24 日東電工株式会社 Opto-electric hybrid board and manufacturing method thereof
BRPI0918689A2 (en) 2008-12-29 2016-07-26 3M Innovative Properties Co phase-locked blanket position signal using fiducial marks on the blanket
US8992104B2 (en) 2008-12-30 2015-03-31 3M Innovative Properties Company Apparatus and method for making fiducials on a substrate
JP4966996B2 (en) 2009-05-19 2012-07-04 東芝機械株式会社 Rail support device and sheet stretching method
CN202931661U (en) 2010-03-12 2013-05-08 夏普株式会社 Circuit substrate, substrate module and display device
JP5664088B2 (en) 2010-09-30 2015-02-04 大日本印刷株式会社 Alignment mark substrate, element, and element manufacturing method
JP2012169060A (en) * 2011-02-10 2012-09-06 Shin Etsu Polymer Co Ltd Method for manufacturing conductive pattern-formed substrate
WO2012147235A1 (en) 2011-04-26 2012-11-01 日本メクトロン株式会社 Method for producing transparent printed wiring board, and method for producing transparent touch panel
JP5866995B2 (en) * 2011-11-16 2016-02-24 三菱電機株式会社 Method for manufacturing touch panel substrate
BR112015013033A2 (en) 2012-12-07 2017-07-11 3M Innovative Properties Co method of manufacturing transparent conductors on substrate
BR112015015027A2 (en) 2012-12-20 2017-07-11 3M Innovative Properties Co multiple ink printing to achieve accurate recording during subsequent processing
CN103034366B (en) 2012-12-21 2016-08-31 北京京东方光电科技有限公司 A kind of display base plate preparation method and black matrix, display base plate, display device

Also Published As

Publication number Publication date
US20160205772A1 (en) 2016-07-14
KR102182751B1 (en) 2020-11-25
CN105474760B (en) 2019-03-08
KR20160048872A (en) 2016-05-04
CN105474760A (en) 2016-04-06
WO2015031033A1 (en) 2015-03-05
EP3039949A4 (en) 2017-04-19
JP2016534465A (en) 2016-11-04
JP6457528B2 (en) 2019-01-23
US9807871B2 (en) 2017-10-31
EP3039949A1 (en) 2016-07-06

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