JP6457528B2 - 以降の処理工程中における、正確な位置合わせのための、基準マークを備える電子アセンブリ - Google Patents
以降の処理工程中における、正確な位置合わせのための、基準マークを備える電子アセンブリ Download PDFInfo
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- 238000010345 tape casting Methods 0.000 description 1
- 230000008685 targeting Effects 0.000 description 1
- KKEYFWRCBNTPAC-UHFFFAOYSA-L terephthalate(2-) Chemical compound [O-]C(=O)C1=CC=C(C([O-])=O)C=C1 KKEYFWRCBNTPAC-UHFFFAOYSA-L 0.000 description 1
- 238000012360 testing method Methods 0.000 description 1
- YLQBMQCUIZJEEH-UHFFFAOYSA-N tetrahydrofuran Natural products C=1C=COC=1 YLQBMQCUIZJEEH-UHFFFAOYSA-N 0.000 description 1
- 229920001187 thermosetting polymer Polymers 0.000 description 1
- 239000012780 transparent material Substances 0.000 description 1
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- 238000007738 vacuum evaporation Methods 0.000 description 1
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- 230000000007 visual effect Effects 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0266—Marks, test patterns or identification means
- H05K1/0269—Marks, test patterns or identification means for visual or optical inspection
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0266—Marks, test patterns or identification means
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0296—Conductive pattern lay-out details not covered by sub groups H05K1/02 - H05K1/0295
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/03—Use of materials for the substrate
- H05K1/0393—Flexible materials
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/09—Use of materials for the conductive, e.g. metallic pattern
- H05K1/092—Dispersed materials, e.g. conductive pastes or inks
- H05K1/097—Inks comprising nanoparticles and specially adapted for being sintered at low temperature
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
- H05K3/04—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed mechanically, e.g. by punching
- H05K3/046—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed mechanically, e.g. by punching by selective transfer or selective detachment of a conductive layer
- H05K3/048—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed mechanically, e.g. by punching by selective transfer or selective detachment of a conductive layer using a lift-off resist pattern or a release layer pattern
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0277—Bendability or stretchability details
- H05K1/0283—Stretchable printed circuits
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/01—Dielectrics
- H05K2201/0137—Materials
- H05K2201/0145—Polyester, e.g. polyethylene terephthalate [PET], polyethylene naphthalate [PEN]
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/01—Dielectrics
- H05K2201/0137—Materials
- H05K2201/0154—Polyimide
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/02—Fillers; Particles; Fibers; Reinforcement materials
- H05K2201/0203—Fillers and particles
- H05K2201/0242—Shape of an individual particle
- H05K2201/026—Nanotubes or nanowires
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09818—Shape or layout details not covered by a single group of H05K2201/09009 - H05K2201/09809
- H05K2201/09918—Optically detected marks used for aligning tool relative to the PCB, e.g. for mounting of components
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10007—Types of components
- H05K2201/10128—Display
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/01—Tools for processing; Objects used during processing
- H05K2203/0104—Tools for processing; Objects used during processing for patterning or coating
- H05K2203/0143—Using a roller; Specific shape thereof; Providing locally adhesive portions thereon
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/15—Position of the PCB during processing
- H05K2203/1545—Continuous processing, i.e. involving rolls moving a band-like or solid carrier along a continuous production path
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
- H05K3/12—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns
- H05K3/1275—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns by other printing techniques, e.g. letterpress printing, intaglio printing, lithographic printing, offset printing
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/46—Manufacturing multilayer circuits
- H05K3/4644—Manufacturing multilayer circuits by building the multilayer layer by layer, i.e. build-up multilayer circuits
- H05K3/4679—Aligning added circuit layers or via connections relative to previous circuit layers
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Chemical & Material Sciences (AREA)
- Manufacturing & Machinery (AREA)
- Nanotechnology (AREA)
- Dispersion Chemistry (AREA)
- Manufacturing Of Printed Wiring (AREA)
- Parts Printed On Printed Circuit Boards (AREA)
- Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)
- Structure Of Printed Boards (AREA)
- Manufacturing Of Printed Circuit Boards (AREA)
- Non-Insulated Conductors (AREA)
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US201361871244P | 2013-08-28 | 2013-08-28 | |
| US61/871,244 | 2013-08-28 | ||
| PCT/US2014/050471 WO2015031033A1 (en) | 2013-08-28 | 2014-08-11 | Electronic assembly with fiducial marks for precision registration during subsequent processing steps |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JP2016534465A JP2016534465A (ja) | 2016-11-04 |
| JP2016534465A5 JP2016534465A5 (enExample) | 2017-08-17 |
| JP6457528B2 true JP6457528B2 (ja) | 2019-01-23 |
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| JP2016538947A Active JP6457528B2 (ja) | 2013-08-28 | 2014-08-11 | 以降の処理工程中における、正確な位置合わせのための、基準マークを備える電子アセンブリ |
Country Status (7)
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| EP (1) | EP3039949A4 (enExample) |
| JP (1) | JP6457528B2 (enExample) |
| KR (1) | KR102182751B1 (enExample) |
| CN (1) | CN105474760B (enExample) |
| SG (1) | SG11201601075PA (enExample) |
| WO (1) | WO2015031033A1 (enExample) |
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP5687175B2 (ja) * | 2011-11-28 | 2015-03-18 | 有限会社 ナプラ | 微細空間内に機能部分を形成する方法 |
| US9766732B2 (en) * | 2014-06-20 | 2017-09-19 | 3M Innovative Properties Company | Printing of multiple inks to achieve precision registration during subsequent processing |
| TWI564762B (zh) * | 2015-04-22 | 2017-01-01 | 恆顥科技股份有限公司 | 觸控薄膜疊層卷的製作方法與所製得之觸控薄膜疊層片 |
| US20170148152A1 (en) * | 2015-11-25 | 2017-05-25 | General Electric Company | Systems and Methods for Monitoring Component Strain |
| GB2551502A (en) * | 2016-06-17 | 2017-12-27 | M-Solv Ltd | Apparatus and methods for manufacturing a sensor and a display, and a sensor and a display |
| US11279859B2 (en) | 2016-12-07 | 2022-03-22 | 3M Innovative Properties Company | Methods of passivating adhesives |
| CN113226572A (zh) * | 2018-12-26 | 2021-08-06 | 日东电工株式会社 | 可剥离涂膜的剥离方法及物品 |
| CN113302555A (zh) * | 2018-12-27 | 2021-08-24 | 富士胶片株式会社 | 导电性转印材料、附有图案的基板的制造方法、层叠体及触控面板 |
| WO2020170817A1 (ja) * | 2019-02-20 | 2020-08-27 | 日東電工株式会社 | 積層体 |
| US12365174B2 (en) | 2023-09-12 | 2025-07-22 | Eastman Kodak Company | Ink tray insert |
| US12311652B2 (en) | 2023-09-12 | 2025-05-27 | Eastman Kodak Company | Inking system with plurality of fountain roller elements |
| WO2025058912A1 (en) | 2023-09-12 | 2025-03-20 | Eastman Kodak Company | Inking system with segmented fountain roller |
| US12220904B1 (en) | 2023-09-12 | 2025-02-11 | Eastman Kodak Company | Inking system with segmented fountain roller |
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| US4165688A (en) | 1977-04-14 | 1979-08-28 | Magna-Graphics Corporation | Ink dam for printing press |
| FR2421732A1 (fr) | 1978-04-07 | 1979-11-02 | Sarda Jean Lucien | Procede et mecanisme d'encrage en une ou plusieurs couleurs pour impressions typographiques, offset ou autres |
| JPS5752021A (en) * | 1980-09-12 | 1982-03-27 | Citizen Watch Co Ltd | Manufacture of liquid crystal display cell |
| DE3320638C2 (de) | 1983-06-08 | 1986-10-16 | Koenig & Bauer AG, 8700 Würzburg | Farbabteileinrichtung an Farbkastenwalzen von Druckmaschinen |
| DE3505598C2 (de) | 1984-10-30 | 1986-08-14 | Windmöller & Hölscher, 4540 Lengerich | Spülfarbwerk mit geteilter Farbkammerrakel |
| DE3709177A1 (de) | 1987-03-20 | 1988-09-29 | Leybold Ag | Verfahren und vorrichtung zur regelung der reaktiven schichtabscheidung auf substraten mittels magnetronkatoden |
| US4796528A (en) | 1987-05-29 | 1989-01-10 | M.A.N. Roland Druckmaschinen Ag | Separated ink fountain for a flexographic printing machine |
| US5012736A (en) | 1987-09-21 | 1991-05-07 | Paper Converting Machine Company | Sealing assembly for liquid fountain |
| JPH05327178A (ja) * | 1991-03-28 | 1993-12-10 | Unitika Ltd | 透明導電性基体の連続製造方法 |
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| JP4068635B2 (ja) * | 2005-09-30 | 2008-03-26 | 松下電器産業株式会社 | 配線基板 |
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| BRPI0811664A2 (pt) | 2007-06-19 | 2015-02-10 | 3M Innovative Properties Co | "escala de deslocamento por reflexão interna total" |
| KR101390767B1 (ko) * | 2007-08-31 | 2014-04-30 | 엘지디스플레이 주식회사 | 표시소자 제조방법 |
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| JP2011515510A (ja) | 2008-02-26 | 2011-05-19 | カンブリオス テクノロジーズ コーポレイション | 導電性特徴をスクリーン印刷するための方法および組成物 |
| JP2010021293A (ja) * | 2008-07-09 | 2010-01-28 | Nec Electronics Corp | 半導体装置および半導体装置の製造方法 |
| JP4754613B2 (ja) * | 2008-11-27 | 2011-08-24 | 日東電工株式会社 | 光電気混載基板およびその製造方法 |
| WO2010077592A2 (en) | 2008-12-29 | 2010-07-08 | 3M Innovative Properties Company | Phase-locked web position signal using web fiducials |
| KR101578259B1 (ko) | 2008-12-30 | 2015-12-16 | 쓰리엠 이노베이티브 프로퍼티즈 컴파니 | 기점을 기재 상에 형성하기 위한 장치 및 방법 |
| JP4966996B2 (ja) | 2009-05-19 | 2012-07-04 | 東芝機械株式会社 | レール支持装置およびシートの延伸方法 |
| WO2011111264A1 (ja) * | 2010-03-12 | 2011-09-15 | シャープ株式会社 | 回路基板、基板モジュール、および表示装置 |
| JP5664088B2 (ja) | 2010-09-30 | 2015-02-04 | 大日本印刷株式会社 | アライメントマーク基板、素子、および素子の製造方法 |
| JP2012169060A (ja) * | 2011-02-10 | 2012-09-06 | Shin Etsu Polymer Co Ltd | 導電パターン形成基板の製造方法 |
| EP2712284A4 (en) | 2011-04-26 | 2014-11-05 | Nippon Mektron Kk | METHOD FOR PRODUCING A TRANSPARENT PRINTED PCB AND METHOD FOR PRODUCING A TRANSPARENT TOUCH SCREEN |
| JP5866995B2 (ja) * | 2011-11-16 | 2016-02-24 | 三菱電機株式会社 | タッチパネル基板の製造方法 |
| WO2014088950A1 (en) | 2012-12-07 | 2014-06-12 | 3M Innovative Properties Company | Method of making transparent conductors on a substrate |
| WO2014099507A1 (en) | 2012-12-20 | 2014-06-26 | 3M Innovative Properties Company | Printing of multiple inks to achieve precision registration during subsequent processing |
| CN103034366B (zh) | 2012-12-21 | 2016-08-31 | 北京京东方光电科技有限公司 | 一种显示基板制作方法及黑矩阵、显示基板、显示装置 |
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2014
- 2014-08-11 US US14/912,176 patent/US9807871B2/en active Active
- 2014-08-11 EP EP14839958.7A patent/EP3039949A4/en not_active Withdrawn
- 2014-08-11 WO PCT/US2014/050471 patent/WO2015031033A1/en not_active Ceased
- 2014-08-11 SG SG11201601075PA patent/SG11201601075PA/en unknown
- 2014-08-11 KR KR1020167007801A patent/KR102182751B1/ko active Active
- 2014-08-11 JP JP2016538947A patent/JP6457528B2/ja active Active
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Also Published As
| Publication number | Publication date |
|---|---|
| US9807871B2 (en) | 2017-10-31 |
| CN105474760B (zh) | 2019-03-08 |
| EP3039949A1 (en) | 2016-07-06 |
| JP2016534465A (ja) | 2016-11-04 |
| WO2015031033A1 (en) | 2015-03-05 |
| EP3039949A4 (en) | 2017-04-19 |
| US20160205772A1 (en) | 2016-07-14 |
| SG11201601075PA (en) | 2016-03-30 |
| KR20160048872A (ko) | 2016-05-04 |
| CN105474760A (zh) | 2016-04-06 |
| KR102182751B1 (ko) | 2020-11-25 |
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