JP2016529354A - 発光ダイオード用カプセル封入材料 - Google Patents

発光ダイオード用カプセル封入材料 Download PDF

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Publication number
JP2016529354A
JP2016529354A JP2016526602A JP2016526602A JP2016529354A JP 2016529354 A JP2016529354 A JP 2016529354A JP 2016526602 A JP2016526602 A JP 2016526602A JP 2016526602 A JP2016526602 A JP 2016526602A JP 2016529354 A JP2016529354 A JP 2016529354A
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JP
Japan
Prior art keywords
organopolysilazane
led
alkyl
material according
aryl
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Ceased
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JP2016526602A
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Japanese (ja)
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JP2016529354A5 (enExample
Inventor
グロッテンミュラー，ラルフ
カルナナンダン，ローザリン
文雄 北
文雄 北
レンツ，ヘルムート
ワーグナー，ディーター
Original Assignee
エイ・ゼット・エレクトロニック・マテリアルズ（ルクセンブルク）エス・ア・エール・エル
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Publication of JP2016529354A publication Critical patent/JP2016529354A/ja
Publication of JP2016529354A5 publication Critical patent/JP2016529354A5/ja
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
    • H01L23/29—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the material, e.g. carbon
    • H01L23/293—Organic, e.g. plastic
    • H01L23/296—Organo-silicon compounds
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J3/00—Processes of treating or compounding macromolecular substances
    • C08J3/24—Crosslinking, e.g. vulcanising, of macromolecules
    • C08J3/241—Preventing premature crosslinking by physical separation of components, e.g. encapsulation
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J3/00—Processes of treating or compounding macromolecular substances
    • C08J3/24—Crosslinking, e.g. vulcanising, of macromolecules
    • C08J3/247—Heating methods
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L83/00—Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon only; Compositions of derivatives of such polymers
    • C08L83/16—Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon only; Compositions of derivatives of such polymers in which all the silicon atoms are connected by linkages other than oxygen atoms
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/01—Manufacture or treatment
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/85—Packages
    • H10H20/852—Encapsulations
    • H10H20/854—Encapsulations characterised by their material, e.g. epoxy or silicone resins
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G77/00—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
    • C08G77/60—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule in which all the silicon atoms are connected by linkages other than oxygen atoms
    • C08G77/62—Nitrogen atoms
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J2383/00—Characterised by the use of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon with or without sulfur, nitrogen, oxygen, or carbon only; Derivatives of such polymers
    • C08J2383/16—Characterised by the use of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon with or without sulfur, nitrogen, oxygen, or carbon only; Derivatives of such polymers in which all the silicon atoms are connected by linkages other than oxygen atoms
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/01—Manufacture or treatment
    • H10H20/036—Manufacture or treatment of packages
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/01—Manufacture or treatment
    • H10H20/036—Manufacture or treatment of packages
    • H10H20/0362—Manufacture or treatment of packages of encapsulations

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  • Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Organic Chemistry (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Health & Medical Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • General Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Physics & Mathematics (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Analytical Chemistry (AREA)
  • Silicon Polymers (AREA)
  • Manufacturing & Machinery (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Led Device Packages (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Materials Engineering (AREA)
  • Wood Science & Technology (AREA)
JP2016526602A 2013-07-19 2014-07-16 発光ダイオード用カプセル封入材料 Ceased JP2016529354A (ja)

Applications Claiming Priority (5)

Application Number Priority Date Filing Date Title
EP13177289 2013-07-19
EP13177289.9 2013-07-19
EP14157208.1 2014-02-28
EP14157208 2014-02-28
PCT/EP2014/065248 WO2015007778A1 (en) 2013-07-19 2014-07-16 Encapsulation material for light emitting diodes

Publications (2)

Publication Number Publication Date
JP2016529354A true JP2016529354A (ja) 2016-09-23
JP2016529354A5 JP2016529354A5 (enExample) 2017-08-24

Family

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Family Applications (1)

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JP2016526602A Ceased JP2016529354A (ja) 2013-07-19 2014-07-16 発光ダイオード用カプセル封入材料

Country Status (8)

Country Link
US (1) US9991182B2 (enExample)
EP (1) EP3022249A1 (enExample)
JP (1) JP2016529354A (enExample)
KR (1) KR20160035581A (enExample)
CN (1) CN105392825A (enExample)
SG (2) SG10201800517XA (enExample)
TW (1) TW201510001A (enExample)
WO (1) WO2015007778A1 (enExample)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2019073652A (ja) * 2017-10-18 2019-05-16 信越化学工業株式会社 ポリシラザン化合物およびその製造方法、並びにこれを用いた撥水処理剤およびこれを用いた撥水処理方法

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TWI737610B (zh) * 2015-05-20 2021-09-01 美商納諾光子公司 用於改進發光二極體之效率的程序
JP2019514201A (ja) 2016-04-18 2019-05-30 オスラム オプト セミコンダクターズ ゲゼルシャフト ミット ベシュレンクテル ハフツングＯｓｒａｍ Ｏｐｔｏ Ｓｅｍｉｃｏｎｄｕｃｔｏｒｓ ＧｍｂＨ 光電子部品の製造方法、および光電子部品
EP3485520B1 (en) 2016-07-18 2022-01-26 Merck Patent GmbH Formulation for an led encapsulation material
JP6957594B2 (ja) 2016-07-18 2021-11-02 メルク、パテント、ゲゼルシャフト、ミット、ベシュレンクテル、ハフツングＭｅｒｃｋ Ｐａｔｅｎｔ ＧｍｂＨ Ｌｅｄ封止材料のための配合物
KR101947113B1 (ko) * 2016-08-15 2019-02-12 주식회사 에스제이하이테크 투명 엘이디 디스플레이 패널 및 이를 이용한 디지털 사이니지 시스템
KR20190100279A (ko) 2016-12-20 2019-08-28 메르크 파텐트 게엠베하 광학 매체 및 광학 디바이스
WO2019002328A1 (en) * 2017-06-30 2019-01-03 Merck Patent Gmbh WAVE LENGTH CONVERTING COMPONENT
WO2019025392A1 (en) 2017-08-03 2019-02-07 Merck Patent Gmbh QUANTUM PERFORMANCE RECOVERY
US11193010B2 (en) * 2017-10-31 2021-12-07 Dow Global Technologies Llc Polyolefin compositions for photovoltaic encapsulant films
US11724963B2 (en) 2019-05-01 2023-08-15 Corning Incorporated Pharmaceutical packages with coatings comprising polysilazane
CN112420893B (zh) * 2020-10-28 2021-11-16 吉安市木林森半导体材料有限公司 一种使用硅氮烷进行封装的紫外led灯珠及其制备方法
CN112420892B (zh) * 2020-10-28 2021-11-16 吉安市木林森半导体材料有限公司 一种使用硅氮烷进行粘结的紫外led灯珠及其制备方法

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JPS61225252A (ja) * 1985-03-29 1986-10-07 ローヌ‐プーラン・スペシアリテ・シミーク ヒドロシリル化反応に触媒作用を及ぼす金属若しくは金属化合物の存在で架橋しうるポリシラザン組成物
JPH05117397A (ja) * 1989-11-27 1993-05-14 Hercules Inc 有機アミド変性ポリシラザンセラミツク前駆体
JPH10182835A (ja) * 1996-12-27 1998-07-07 Tonen Corp フェニルシリル基架橋ポリシラザン及びその製造方法
WO2011077547A1 (ja) * 2009-12-25 2011-06-30 コニカミノルタオプト株式会社 発光装置
WO2012067766A2 (en) * 2010-11-18 2012-05-24 3M Innovative Properties Company Light emitting diode component comprising polysilazane bonding layer
JP2012532207A (ja) * 2009-06-30 2012-12-13 スリーエム イノベイティブ プロパティズ カンパニー 硬化性有機フッ素変性ポリシラザンを調製するための組成物及び方法、並びにそれによって調製されるポリシラザン
WO2014133287A1 (ko) * 2013-02-28 2014-09-04 주식회사 동진쎄미켐 광학소자 봉지용 수지 조성물

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Publication number Priority date Publication date Assignee Title
JPS61225252A (ja) * 1985-03-29 1986-10-07 ローヌ‐プーラン・スペシアリテ・シミーク ヒドロシリル化反応に触媒作用を及ぼす金属若しくは金属化合物の存在で架橋しうるポリシラザン組成物
JPH05117397A (ja) * 1989-11-27 1993-05-14 Hercules Inc 有機アミド変性ポリシラザンセラミツク前駆体
JPH10182835A (ja) * 1996-12-27 1998-07-07 Tonen Corp フェニルシリル基架橋ポリシラザン及びその製造方法
JP2012532207A (ja) * 2009-06-30 2012-12-13 スリーエム イノベイティブ プロパティズ カンパニー 硬化性有機フッ素変性ポリシラザンを調製するための組成物及び方法、並びにそれによって調製されるポリシラザン
WO2011077547A1 (ja) * 2009-12-25 2011-06-30 コニカミノルタオプト株式会社 発光装置
WO2012067766A2 (en) * 2010-11-18 2012-05-24 3M Innovative Properties Company Light emitting diode component comprising polysilazane bonding layer
WO2014133287A1 (ko) * 2013-02-28 2014-09-04 주식회사 동진쎄미켐 광학소자 봉지용 수지 조성물

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2019073652A (ja) * 2017-10-18 2019-05-16 信越化学工業株式会社 ポリシラザン化合物およびその製造方法、並びにこれを用いた撥水処理剤およびこれを用いた撥水処理方法
JP7119332B2 (ja) 2017-10-18 2022-08-17 信越化学工業株式会社 ポリシラザン化合物を用いた撥水処理剤および撥水処理方法

Also Published As

Publication number Publication date
SG11201600363XA (en) 2016-02-26
KR20160035581A (ko) 2016-03-31
TW201510001A (zh) 2015-03-16
SG10201800517XA (en) 2018-02-27
WO2015007778A1 (en) 2015-01-22
US20160172552A1 (en) 2016-06-16
EP3022249A1 (en) 2016-05-25
US9991182B2 (en) 2018-06-05
CN105392825A (zh) 2016-03-09

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