CN105392825A - 用于发光二极管的封装材料 - Google Patents
用于发光二极管的封装材料 Download PDFInfo
- Publication number
- CN105392825A CN105392825A CN201480040899.8A CN201480040899A CN105392825A CN 105392825 A CN105392825 A CN 105392825A CN 201480040899 A CN201480040899 A CN 201480040899A CN 105392825 A CN105392825 A CN 105392825A
- Authority
- CN
- China
- Prior art keywords
- organopolysilazane
- alkyl
- led
- use according
- aryl
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000005022 packaging material Substances 0.000 title claims description 6
- 239000000463 material Substances 0.000 claims abstract description 146
- 238000005538 encapsulation Methods 0.000 claims description 33
- 239000003054 catalyst Substances 0.000 claims description 16
- 125000000962 organic group Chemical group 0.000 claims description 16
- 125000001997 phenyl group Chemical group [H]C1=C([H])C([H])=C(*)C([H])=C1[H] 0.000 claims description 15
- 125000004209 (C1-C8) alkyl group Chemical group 0.000 claims description 14
- 125000005913 (C3-C6) cycloalkyl group Chemical group 0.000 claims description 14
- 125000000882 C2-C6 alkenyl group Chemical group 0.000 claims description 14
- 125000000041 C6-C10 aryl group Chemical group 0.000 claims description 14
- 238000000034 method Methods 0.000 claims description 13
- 125000002496 methyl group Chemical group [H]C([H])([H])* 0.000 claims description 13
- 125000000391 vinyl group Chemical group [H]C([*])=C([H])[H] 0.000 claims description 12
- 229920002554 vinyl polymer Polymers 0.000 claims description 11
- 239000012298 atmosphere Substances 0.000 claims description 10
- 125000001495 ethyl group Chemical group [H]C([H])([H])C([H])([H])* 0.000 claims description 10
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 claims description 9
- 150000001875 compounds Chemical class 0.000 claims description 9
- 125000004178 (C1-C4) alkyl group Chemical group 0.000 claims description 8
- 125000001436 propyl group Chemical group [H]C([*])([H])C([H])([H])C([H])([H])[H] 0.000 claims description 8
- 125000003903 2-propenyl group Chemical group [H]C([*])([H])C([H])=C([H])[H] 0.000 claims description 5
- QGZKDVFQNNGYKY-UHFFFAOYSA-N Ammonia Chemical compound N QGZKDVFQNNGYKY-UHFFFAOYSA-N 0.000 claims description 4
- 238000004519 manufacturing process Methods 0.000 claims description 3
- 229910000062 azane Inorganic materials 0.000 claims description 2
- 239000008393 encapsulating agent Substances 0.000 abstract description 20
- 230000005855 radiation Effects 0.000 abstract description 17
- 229920001709 polysilazane Polymers 0.000 abstract description 11
- 229920000642 polymer Polymers 0.000 abstract description 7
- 230000032683 aging Effects 0.000 abstract description 6
- 238000002845 discoloration Methods 0.000 abstract description 2
- 238000006243 chemical reaction Methods 0.000 description 21
- IJGRMHOSHXDMSA-UHFFFAOYSA-N nitrogen Substances N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 description 21
- 238000001723 curing Methods 0.000 description 18
- 238000004132 cross linking Methods 0.000 description 17
- 239000002904 solvent Substances 0.000 description 17
- 239000000203 mixture Substances 0.000 description 15
- WYURNTSHIVDZCO-UHFFFAOYSA-N Tetrahydrofuran Chemical compound C1CCOC1 WYURNTSHIVDZCO-UHFFFAOYSA-N 0.000 description 12
- 239000002585 base Substances 0.000 description 11
- 229910052757 nitrogen Inorganic materials 0.000 description 11
- 239000003795 chemical substances by application Substances 0.000 description 10
- 230000003287 optical effect Effects 0.000 description 10
- -1 siloxanes Chemical class 0.000 description 10
- IMNFDUFMRHMDMM-UHFFFAOYSA-N N-Heptane Chemical compound CCCCCCC IMNFDUFMRHMDMM-UHFFFAOYSA-N 0.000 description 9
- YXFVVABEGXRONW-UHFFFAOYSA-N Toluene Chemical compound CC1=CC=CC=C1 YXFVVABEGXRONW-UHFFFAOYSA-N 0.000 description 9
- 229920001296 polysiloxane Polymers 0.000 description 9
- IJOOHPMOJXWVHK-UHFFFAOYSA-N chlorotrimethylsilane Chemical compound C[Si](C)(C)Cl IJOOHPMOJXWVHK-UHFFFAOYSA-N 0.000 description 8
- 229910052739 hydrogen Inorganic materials 0.000 description 8
- 239000000126 substance Substances 0.000 description 8
- 125000000217 alkyl group Chemical group 0.000 description 7
- 125000003118 aryl group Chemical group 0.000 description 7
- 230000008569 process Effects 0.000 description 7
- 238000005033 Fourier transform infrared spectroscopy Methods 0.000 description 6
- 238000001704 evaporation Methods 0.000 description 6
- 230000008020 evaporation Effects 0.000 description 6
- 239000001257 hydrogen Substances 0.000 description 6
- 229910007991 Si-N Inorganic materials 0.000 description 5
- 229910006294 Si—N Inorganic materials 0.000 description 5
- 230000015572 biosynthetic process Effects 0.000 description 5
- 238000001816 cooling Methods 0.000 description 5
- 238000010438 heat treatment Methods 0.000 description 5
- 239000003921 oil Substances 0.000 description 5
- UFHFLCQGNIYNRP-UHFFFAOYSA-N Hydrogen Chemical compound [H][H] UFHFLCQGNIYNRP-UHFFFAOYSA-N 0.000 description 4
- MZRVEZGGRBJDDB-UHFFFAOYSA-N N-Butyllithium Chemical compound [Li]CCCC MZRVEZGGRBJDDB-UHFFFAOYSA-N 0.000 description 4
- 229910018557 Si O Inorganic materials 0.000 description 4
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical group [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 4
- 229910052784 alkaline earth metal Inorganic materials 0.000 description 4
- 239000012776 electronic material Substances 0.000 description 4
- 230000007613 environmental effect Effects 0.000 description 4
- 238000001914 filtration Methods 0.000 description 4
- 239000007789 gas Substances 0.000 description 4
- 239000002244 precipitate Substances 0.000 description 4
- LIVNPJMFVYWSIS-UHFFFAOYSA-N silicon monoxide Inorganic materials [Si-]#[O+] LIVNPJMFVYWSIS-UHFFFAOYSA-N 0.000 description 4
- 238000001228 spectrum Methods 0.000 description 4
- 238000003786 synthesis reaction Methods 0.000 description 4
- 239000005051 trimethylchlorosilane Substances 0.000 description 4
- RYHBNJHYFVUHQT-UHFFFAOYSA-N 1,4-Dioxane Chemical compound C1COCCO1 RYHBNJHYFVUHQT-UHFFFAOYSA-N 0.000 description 3
- XEKOWRVHYACXOJ-UHFFFAOYSA-N Ethyl acetate Chemical compound CCOC(C)=O XEKOWRVHYACXOJ-UHFFFAOYSA-N 0.000 description 3
- 239000004793 Polystyrene Substances 0.000 description 3
- FYJKEHKQUPSJDH-UHFFFAOYSA-N [dimethyl-(trimethylsilylamino)silyl]methane;potassium Chemical compound [K].C[Si](C)(C)N[Si](C)(C)C FYJKEHKQUPSJDH-UHFFFAOYSA-N 0.000 description 3
- 150000001335 aliphatic alkanes Chemical class 0.000 description 3
- 125000003342 alkenyl group Chemical group 0.000 description 3
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 description 3
- 230000005540 biological transmission Effects 0.000 description 3
- 230000015556 catabolic process Effects 0.000 description 3
- 238000006731 degradation reaction Methods 0.000 description 3
- 239000003822 epoxy resin Substances 0.000 description 3
- 150000002170 ethers Chemical class 0.000 description 3
- 238000011049 filling Methods 0.000 description 3
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 3
- LNEPOXFFQSENCJ-UHFFFAOYSA-N haloperidol Chemical compound C1CC(O)(C=2C=CC(Cl)=CC=2)CCN1CCCC(=O)C1=CC=C(F)C=C1 LNEPOXFFQSENCJ-UHFFFAOYSA-N 0.000 description 3
- 239000007788 liquid Substances 0.000 description 3
- 239000001301 oxygen Substances 0.000 description 3
- 229910052760 oxygen Inorganic materials 0.000 description 3
- 229920000647 polyepoxide Polymers 0.000 description 3
- 229920002223 polystyrene Polymers 0.000 description 3
- 239000000047 product Substances 0.000 description 3
- 239000010703 silicon Substances 0.000 description 3
- 229910052710 silicon Inorganic materials 0.000 description 3
- 229910000679 solder Inorganic materials 0.000 description 3
- 125000001424 substituent group Chemical group 0.000 description 3
- 238000002834 transmittance Methods 0.000 description 3
- 239000012855 volatile organic compound Substances 0.000 description 3
- GQHTUMJGOHRCHB-UHFFFAOYSA-N 2,3,4,6,7,8,9,10-octahydropyrimido[1,2-a]azepine Chemical compound C1CCCCN2CCCN=C21 GQHTUMJGOHRCHB-UHFFFAOYSA-N 0.000 description 2
- XDTMQSROBMDMFD-UHFFFAOYSA-N Cyclohexane Chemical compound C1CCCCC1 XDTMQSROBMDMFD-UHFFFAOYSA-N 0.000 description 2
- 238000001157 Fourier transform infrared spectrum Methods 0.000 description 2
- CTQNGGLPUBDAKN-UHFFFAOYSA-N O-Xylene Chemical compound CC1=CC=CC=C1C CTQNGGLPUBDAKN-UHFFFAOYSA-N 0.000 description 2
- 239000004809 Teflon Substances 0.000 description 2
- 229920006362 Teflon® Polymers 0.000 description 2
- 239000000654 additive Substances 0.000 description 2
- 239000012790 adhesive layer Substances 0.000 description 2
- 125000001931 aliphatic group Chemical group 0.000 description 2
- 239000003513 alkali Substances 0.000 description 2
- 150000001342 alkaline earth metals Chemical class 0.000 description 2
- 150000001412 amines Chemical class 0.000 description 2
- 150000007514 bases Chemical class 0.000 description 2
- 229910052799 carbon Inorganic materials 0.000 description 2
- 230000003197 catalytic effect Effects 0.000 description 2
- 125000002091 cationic group Chemical group 0.000 description 2
- 239000011248 coating agent Substances 0.000 description 2
- 238000000576 coating method Methods 0.000 description 2
- 125000000753 cycloalkyl group Chemical group 0.000 description 2
- 238000001035 drying Methods 0.000 description 2
- 238000000295 emission spectrum Methods 0.000 description 2
- 230000004907 flux Effects 0.000 description 2
- 239000011521 glass Substances 0.000 description 2
- FFUAGWLWBBFQJT-UHFFFAOYSA-N hexamethyldisilazane Chemical compound C[Si](C)(C)N[Si](C)(C)C FFUAGWLWBBFQJT-UHFFFAOYSA-N 0.000 description 2
- 239000011256 inorganic filler Substances 0.000 description 2
- 229910003475 inorganic filler Inorganic materials 0.000 description 2
- 125000001449 isopropyl group Chemical group [H]C([H])([H])C([H])(*)C([H])([H])[H] 0.000 description 2
- 239000010410 layer Substances 0.000 description 2
- 230000007774 longterm Effects 0.000 description 2
- 238000002156 mixing Methods 0.000 description 2
- UHOVQNZJYSORNB-UHFFFAOYSA-N monobenzene Natural products C1=CC=CC=C1 UHOVQNZJYSORNB-UHFFFAOYSA-N 0.000 description 2
- 239000000178 monomer Substances 0.000 description 2
- 125000004433 nitrogen atom Chemical group N* 0.000 description 2
- 125000002524 organometallic group Chemical group 0.000 description 2
- 230000003647 oxidation Effects 0.000 description 2
- 238000007254 oxidation reaction Methods 0.000 description 2
- 239000002243 precursor Substances 0.000 description 2
- 230000004224 protection Effects 0.000 description 2
- 150000003254 radicals Chemical class 0.000 description 2
- 239000002994 raw material Substances 0.000 description 2
- 239000011343 solid material Substances 0.000 description 2
- 239000000758 substrate Substances 0.000 description 2
- 150000003512 tertiary amines Chemical class 0.000 description 2
- 239000008096 xylene Substances 0.000 description 2
- 238000004383 yellowing Methods 0.000 description 2
- SGUVLZREKBPKCE-UHFFFAOYSA-N 1,5-diazabicyclo[4.3.0]-non-5-ene Chemical compound C1CCN=C2CCCN21 SGUVLZREKBPKCE-UHFFFAOYSA-N 0.000 description 1
- HQOVXPHOJANJBR-UHFFFAOYSA-N 2,2-bis(tert-butylperoxy)butane Chemical compound CC(C)(C)OOC(C)(CC)OOC(C)(C)C HQOVXPHOJANJBR-UHFFFAOYSA-N 0.000 description 1
- NIXOWILDQLNWCW-UHFFFAOYSA-M Acrylate Chemical compound [O-]C(=O)C=C NIXOWILDQLNWCW-UHFFFAOYSA-M 0.000 description 1
- 229910018072 Al 2 O 3 Inorganic materials 0.000 description 1
- DKPFZGUDAPQIHT-UHFFFAOYSA-N Butyl acetate Natural products CCCCOC(C)=O DKPFZGUDAPQIHT-UHFFFAOYSA-N 0.000 description 1
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 1
- 229910010082 LiAlH Inorganic materials 0.000 description 1
- 229910004298 SiO 2 Inorganic materials 0.000 description 1
- 229910006404 SnO 2 Inorganic materials 0.000 description 1
- 229910010413 TiO 2 Inorganic materials 0.000 description 1
- 230000006750 UV protection Effects 0.000 description 1
- GEIAQOFPUVMAGM-UHFFFAOYSA-N ZrO Inorganic materials [Zr]=O GEIAQOFPUVMAGM-UHFFFAOYSA-N 0.000 description 1
- 238000010521 absorption reaction Methods 0.000 description 1
- 239000002253 acid Substances 0.000 description 1
- 150000007513 acids Chemical class 0.000 description 1
- 238000007259 addition reaction Methods 0.000 description 1
- 239000000853 adhesive Substances 0.000 description 1
- 230000001070 adhesive effect Effects 0.000 description 1
- 230000003679 aging effect Effects 0.000 description 1
- 229910021529 ammonia Inorganic materials 0.000 description 1
- 150000001491 aromatic compounds Chemical class 0.000 description 1
- 239000003849 aromatic solvent Substances 0.000 description 1
- 230000004888 barrier function Effects 0.000 description 1
- 239000011230 binding agent Substances 0.000 description 1
- 229910052796 boron Inorganic materials 0.000 description 1
- 125000000484 butyl group Chemical group [H]C([*])([H])C([H])([H])C([H])([H])C([H])([H])[H] 0.000 description 1
- 239000011203 carbon fibre reinforced carbon Substances 0.000 description 1
- 238000006555 catalytic reaction Methods 0.000 description 1
- 239000000470 constituent Substances 0.000 description 1
- 229920001577 copolymer Polymers 0.000 description 1
- 150000004292 cyclic ethers Chemical class 0.000 description 1
- 125000004122 cyclic group Chemical group 0.000 description 1
- 125000000113 cyclohexyl group Chemical group [H]C1([H])C([H])([H])C([H])([H])C([H])(*)C([H])([H])C1([H])[H] 0.000 description 1
- 125000001559 cyclopropyl group Chemical group [H]C1([H])C([H])([H])C1([H])* 0.000 description 1
- 238000007872 degassing Methods 0.000 description 1
- 230000018109 developmental process Effects 0.000 description 1
- MROCJMGDEKINLD-UHFFFAOYSA-N dichlorosilane Chemical compound Cl[SiH2]Cl MROCJMGDEKINLD-UHFFFAOYSA-N 0.000 description 1
- 238000010790 dilution Methods 0.000 description 1
- 239000012895 dilution Substances 0.000 description 1
- POLCUAVZOMRGSN-UHFFFAOYSA-N dipropyl ether Chemical compound CCCOCCC POLCUAVZOMRGSN-UHFFFAOYSA-N 0.000 description 1
- 238000004821 distillation Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000004100 electronic packaging Methods 0.000 description 1
- 239000003480 eluent Substances 0.000 description 1
- 239000003344 environmental pollutant Substances 0.000 description 1
- 150000002148 esters Chemical class 0.000 description 1
- RTZKZFJDLAIYFH-UHFFFAOYSA-N ether Substances CCOCC RTZKZFJDLAIYFH-UHFFFAOYSA-N 0.000 description 1
- 230000005284 excitation Effects 0.000 description 1
- 238000002474 experimental method Methods 0.000 description 1
- 230000002349 favourable effect Effects 0.000 description 1
- 239000000945 filler Substances 0.000 description 1
- 238000009472 formulation Methods 0.000 description 1
- FUZZWVXGSFPDMH-UHFFFAOYSA-M hexanoate Chemical compound CCCCCC([O-])=O FUZZWVXGSFPDMH-UHFFFAOYSA-M 0.000 description 1
- 150000004678 hydrides Chemical class 0.000 description 1
- 150000002431 hydrogen Chemical group 0.000 description 1
- 125000004435 hydrogen atom Chemical group [H]* 0.000 description 1
- 238000002329 infrared spectrum Methods 0.000 description 1
- 238000002347 injection Methods 0.000 description 1
- 239000007924 injection Substances 0.000 description 1
- 125000000959 isobutyl group Chemical group [H]C([H])([H])C([H])(C([H])([H])[H])C([H])([H])* 0.000 description 1
- 239000012948 isocyanate Substances 0.000 description 1
- 150000002513 isocyanates Chemical class 0.000 description 1
- 239000004973 liquid crystal related substance Substances 0.000 description 1
- 238000004020 luminiscence type Methods 0.000 description 1
- 229910052749 magnesium Inorganic materials 0.000 description 1
- 239000011777 magnesium Substances 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 125000004123 n-propyl group Chemical group [H]C([H])([H])C([H])([H])C([H])([H])* 0.000 description 1
- 239000002105 nanoparticle Substances 0.000 description 1
- 239000012299 nitrogen atmosphere Substances 0.000 description 1
- QJGQUHMNIGDVPM-UHFFFAOYSA-N nitrogen group Chemical group [N] QJGQUHMNIGDVPM-UHFFFAOYSA-N 0.000 description 1
- 239000012454 non-polar solvent Substances 0.000 description 1
- 229910052763 palladium Inorganic materials 0.000 description 1
- 150000002978 peroxides Chemical class 0.000 description 1
- 239000004033 plastic Substances 0.000 description 1
- 229920003023 plastic Polymers 0.000 description 1
- 229910052697 platinum Inorganic materials 0.000 description 1
- 239000003880 polar aprotic solvent Substances 0.000 description 1
- 231100000719 pollutant Toxicity 0.000 description 1
- 239000004417 polycarbonate Substances 0.000 description 1
- 229920000515 polycarbonate Polymers 0.000 description 1
- 238000006068 polycondensation reaction Methods 0.000 description 1
- 239000002861 polymer material Substances 0.000 description 1
- LLHKCFNBLRBOGN-UHFFFAOYSA-N propylene glycol methyl ether acetate Chemical compound COCC(C)OC(C)=O LLHKCFNBLRBOGN-UHFFFAOYSA-N 0.000 description 1
- 230000001681 protective effect Effects 0.000 description 1
- 239000002096 quantum dot Substances 0.000 description 1
- 238000007348 radical reaction Methods 0.000 description 1
- 230000004044 response Effects 0.000 description 1
- 230000000717 retained effect Effects 0.000 description 1
- 229910052594 sapphire Inorganic materials 0.000 description 1
- 239000010980 sapphire Substances 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
- 239000002210 silicon-based material Substances 0.000 description 1
- 238000001542 size-exclusion chromatography Methods 0.000 description 1
- ODZPKZBBUMBTMG-UHFFFAOYSA-N sodium amide Chemical compound [NH2-].[Na+] ODZPKZBBUMBTMG-UHFFFAOYSA-N 0.000 description 1
- 239000007787 solid Substances 0.000 description 1
- 239000011877 solvent mixture Substances 0.000 description 1
- 238000004611 spectroscopical analysis Methods 0.000 description 1
- 125000000999 tert-butyl group Chemical group [H]C([H])([H])C(*)(C([H])([H])[H])C([H])([H])[H] 0.000 description 1
- 238000001029 thermal curing Methods 0.000 description 1
- 230000001960 triggered effect Effects 0.000 description 1
- QLNOVKKVHFRGMA-UHFFFAOYSA-N trimethoxy(propyl)silane Chemical group [CH2]CC[Si](OC)(OC)OC QLNOVKKVHFRGMA-UHFFFAOYSA-N 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
- 230000004580 weight loss Effects 0.000 description 1
- 238000009736 wetting Methods 0.000 description 1
- XLOMVQKBTHCTTD-UHFFFAOYSA-N zinc oxide Inorganic materials [Zn]=O XLOMVQKBTHCTTD-UHFFFAOYSA-N 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
- H01L23/29—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the material, e.g. carbon
- H01L23/293—Organic, e.g. plastic
- H01L23/296—Organo-silicon compounds
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
- C08J3/00—Processes of treating or compounding macromolecular substances
- C08J3/24—Crosslinking, e.g. vulcanising, of macromolecules
- C08J3/241—Preventing premature crosslinking by physical separation of components, e.g. encapsulation
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
- C08J3/00—Processes of treating or compounding macromolecular substances
- C08J3/24—Crosslinking, e.g. vulcanising, of macromolecules
- C08J3/247—Heating methods
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L83/00—Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon only; Compositions of derivatives of such polymers
- C08L83/16—Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon only; Compositions of derivatives of such polymers in which all the silicon atoms are connected by linkages other than oxygen atoms
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
- H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
- H10H20/01—Manufacture or treatment
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
- H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
- H10H20/80—Constructional details
- H10H20/85—Packages
- H10H20/852—Encapsulations
- H10H20/854—Encapsulations characterised by their material, e.g. epoxy or silicone resins
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G77/00—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
- C08G77/60—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule in which all the silicon atoms are connected by linkages other than oxygen atoms
- C08G77/62—Nitrogen atoms
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
- C08J2383/00—Characterised by the use of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon with or without sulfur, nitrogen, oxygen, or carbon only; Derivatives of such polymers
- C08J2383/16—Characterised by the use of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon with or without sulfur, nitrogen, oxygen, or carbon only; Derivatives of such polymers in which all the silicon atoms are connected by linkages other than oxygen atoms
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
- H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
- H10H20/01—Manufacture or treatment
- H10H20/036—Manufacture or treatment of packages
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
- H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
- H10H20/01—Manufacture or treatment
- H10H20/036—Manufacture or treatment of packages
- H10H20/0362—Manufacture or treatment of packages of encapsulations
Landscapes
- Chemical & Material Sciences (AREA)
- Organic Chemistry (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Health & Medical Sciences (AREA)
- Polymers & Plastics (AREA)
- Medicinal Chemistry (AREA)
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- General Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Analytical Chemistry (AREA)
- Silicon Polymers (AREA)
- Manufacturing & Machinery (AREA)
- Life Sciences & Earth Sciences (AREA)
- Materials Engineering (AREA)
- Wood Science & Technology (AREA)
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- Led Device Packages (AREA)
Applications Claiming Priority (5)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| EP13177289.9 | 2013-07-19 | ||
| EP13177289 | 2013-07-19 | ||
| EP14157208 | 2014-02-28 | ||
| EP14157208.1 | 2014-02-28 | ||
| PCT/EP2014/065248 WO2015007778A1 (en) | 2013-07-19 | 2014-07-16 | Encapsulation material for light emitting diodes |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN105392825A true CN105392825A (zh) | 2016-03-09 |
Family
ID=51205398
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201480040899.8A Pending CN105392825A (zh) | 2013-07-19 | 2014-07-16 | 用于发光二极管的封装材料 |
Country Status (8)
| Country | Link |
|---|---|
| US (1) | US9991182B2 (enExample) |
| EP (1) | EP3022249A1 (enExample) |
| JP (1) | JP2016529354A (enExample) |
| KR (1) | KR20160035581A (enExample) |
| CN (1) | CN105392825A (enExample) |
| SG (2) | SG10201800517XA (enExample) |
| TW (1) | TW201510001A (enExample) |
| WO (1) | WO2015007778A1 (enExample) |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110799622A (zh) * | 2017-06-30 | 2020-02-14 | 默克专利股份有限公司 | 波长转换组件 |
| CN111263981A (zh) * | 2017-10-31 | 2020-06-09 | 陶氏环球技术有限责任公司 | 用于光伏封装膜的聚烯烃组成物 |
| CN112420892A (zh) * | 2020-10-28 | 2021-02-26 | 吉安市木林森半导体材料有限公司 | 一种使用硅氮烷进行粘结的紫外led灯珠及其制备方法 |
| CN112420893A (zh) * | 2020-10-28 | 2021-02-26 | 吉安市木林森半导体材料有限公司 | 一种使用硅氮烷进行封装的紫外led灯珠及其制备方法 |
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| TWI737610B (zh) * | 2015-05-20 | 2021-09-01 | 美商納諾光子公司 | 用於改進發光二極體之效率的程序 |
| CN109075238B (zh) | 2016-04-18 | 2021-10-12 | 奥斯兰姆奥普托半导体有限责任公司 | 制造光电子部件的方法和光电子部件 |
| US10822459B2 (en) | 2016-07-18 | 2020-11-03 | Az Electronic Materials (Luxembourg) S.A.R.L. | Formulation for an LED encapsulation material |
| KR102400691B1 (ko) | 2016-07-18 | 2022-05-23 | 에이제트 일렉트로닉 머티어리얼스 (룩셈부르크) 에스.에이.알.엘. | Led 밀봉 물질용 제형 |
| KR101947113B1 (ko) * | 2016-08-15 | 2019-02-12 | 주식회사 에스제이하이테크 | 투명 엘이디 디스플레이 패널 및 이를 이용한 디지털 사이니지 시스템 |
| CN110139912A (zh) | 2016-12-20 | 2019-08-16 | 默克专利股份有限公司 | 光学介质和光学器件 |
| WO2019025392A1 (en) | 2017-08-03 | 2019-02-07 | Merck Patent Gmbh | QUANTUM PERFORMANCE RECOVERY |
| JP7119332B2 (ja) * | 2017-10-18 | 2022-08-17 | 信越化学工業株式会社 | ポリシラザン化合物を用いた撥水処理剤および撥水処理方法 |
| US11724963B2 (en) | 2019-05-01 | 2023-08-15 | Corning Incorporated | Pharmaceutical packages with coatings comprising polysilazane |
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| US4395460A (en) | 1981-09-21 | 1983-07-26 | Dow Corning Corporation | Preparation of polysilazane polymers and the polymers therefrom |
| FR2579602B1 (fr) * | 1985-03-29 | 1987-06-05 | Rhone Poulenc Rech | Composition polysilazane pouvant reticuler en presence d'un metal ou d'un compose metallique catalysant la reaction d'hydrosilylation |
| FR2581391B1 (fr) * | 1985-05-06 | 1987-06-05 | Rhone Poulenc Rech | Composition organo-polysilazane comportant des generateurs de radicaux libres et reticulable par apport d'energie |
| JPH01153730A (ja) | 1987-12-11 | 1989-06-15 | Shin Etsu Chem Co Ltd | 有機シラザン重合体の製造方法 |
| US5030744A (en) | 1989-03-23 | 1991-07-09 | Tonen Corporation | Polyborosilazane and process for producing same |
| JP3074041B2 (ja) * | 1989-11-27 | 2000-08-07 | ランクサイド・テクノロジー・カンパニー・エルピー | 有機アミド変性ポリシラザンセラミック前駆体 |
| JP3916278B2 (ja) * | 1996-12-27 | 2007-05-16 | Ａｚエレクトロニックマテリアルズ株式会社 | フェニルシリル基架橋ポリシラザン及びその製造方法 |
| US6274924B1 (en) | 1998-11-05 | 2001-08-14 | Lumileds Lighting, U.S. Llc | Surface mountable LED package |
| US6204523B1 (en) | 1998-11-06 | 2001-03-20 | Lumileds Lighting, U.S., Llc | High stability optical encapsulation and packaging for light-emitting diodes in the green, blue, and near UV range |
| US6329487B1 (en) * | 1999-11-12 | 2001-12-11 | Kion Corporation | Silazane and/or polysilazane compounds and methods of making |
| TW515223B (en) | 2000-07-24 | 2002-12-21 | Tdk Corp | Light emitting device |
| JP4040850B2 (ja) * | 2000-07-24 | 2008-01-30 | Ｔｄｋ株式会社 | 発光素子 |
| JP4507636B2 (ja) | 2003-03-27 | 2010-07-21 | 日亜化学工業株式会社 | 半導体発光素子 |
| JP4415572B2 (ja) | 2003-06-05 | 2010-02-17 | 日亜化学工業株式会社 | 半導体発光素子およびその製造方法 |
| JP5160189B2 (ja) * | 2007-10-26 | 2013-03-13 | ＡｚエレクトロニックマテリアルズＩｐ株式会社 | 緻密なシリカ質膜を得ることができるポリシラザン化合物含有組成物 |
| KR101445878B1 (ko) | 2008-04-04 | 2014-09-29 | 삼성전자주식회사 | 보호 필름 및 이를 포함하는 봉지 재료 |
| DE102008044769A1 (de) | 2008-08-28 | 2010-03-04 | Clariant International Limited | Verfahren zur Herstellung von keramischen Passivierungsschichten auf Silizium für die Solarzellenfertigung |
| US8329830B2 (en) * | 2009-06-30 | 2012-12-11 | 3M Innovative Properties Company | Surface treatment process and treated article |
| WO2011077547A1 (ja) * | 2009-12-25 | 2011-06-30 | コニカミノルタオプト株式会社 | 発光装置 |
| JP5266532B2 (ja) | 2010-01-12 | 2013-08-21 | コニカミノルタ株式会社 | 発光素子 |
| DE102011009873B4 (de) * | 2010-09-29 | 2017-02-09 | Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung e.V. | Reaktivharze und damit hergestellte Formkörper und flächige oder textile Materialien mit teilchenförmigen Polysilazanen als neuen Flammfestmachern sowie Herstellungsverfahren der Formkörper und Materialien |
| WO2012067766A2 (en) * | 2010-11-18 | 2012-05-24 | 3M Innovative Properties Company | Light emitting diode component comprising polysilazane bonding layer |
| KR101238738B1 (ko) | 2010-12-27 | 2013-03-06 | 한국세라믹기술원 | 자기 발광 소자용 봉지재 및 봉지재 제조 방법, 그 봉지재를 이용한 자기 발광 소자 및 그의 제조 방법 |
| DE102011009773A1 (de) | 2011-01-29 | 2012-08-16 | Volkswagen Aktiengesellschaft | Wechselbezug für ein Ausstattungsteil eines Fahrzeuges, insbesondere für einen Fahrzeugsitz |
| KR101310107B1 (ko) | 2011-12-22 | 2013-09-23 | 한국세라믹기술원 | Ｕｖｌｅｄ 소자용 봉지재, 그를 이용한 ｕｖｌｅｄ 소자 및 그의 제조 방법 |
| KR102016348B1 (ko) * | 2013-02-28 | 2019-08-30 | 주식회사 동진쎄미켐 | 광학소자 봉지용 수지 조성물 |
-
2014
- 2014-07-16 KR KR1020167001454A patent/KR20160035581A/ko not_active Withdrawn
- 2014-07-16 US US14/905,404 patent/US9991182B2/en not_active Expired - Fee Related
- 2014-07-16 SG SG10201800517XA patent/SG10201800517XA/en unknown
- 2014-07-16 CN CN201480040899.8A patent/CN105392825A/zh active Pending
- 2014-07-16 JP JP2016526602A patent/JP2016529354A/ja not_active Ceased
- 2014-07-16 EP EP14739453.0A patent/EP3022249A1/en not_active Withdrawn
- 2014-07-16 SG SG11201600363XA patent/SG11201600363XA/en unknown
- 2014-07-16 WO PCT/EP2014/065248 patent/WO2015007778A1/en not_active Ceased
- 2014-07-18 TW TW103124717A patent/TW201510001A/zh unknown
Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110799622A (zh) * | 2017-06-30 | 2020-02-14 | 默克专利股份有限公司 | 波长转换组件 |
| CN110799622B (zh) * | 2017-06-30 | 2024-01-02 | 默克专利股份有限公司 | 波长转换组件 |
| CN111263981A (zh) * | 2017-10-31 | 2020-06-09 | 陶氏环球技术有限责任公司 | 用于光伏封装膜的聚烯烃组成物 |
| CN112420892A (zh) * | 2020-10-28 | 2021-02-26 | 吉安市木林森半导体材料有限公司 | 一种使用硅氮烷进行粘结的紫外led灯珠及其制备方法 |
| CN112420893A (zh) * | 2020-10-28 | 2021-02-26 | 吉安市木林森半导体材料有限公司 | 一种使用硅氮烷进行封装的紫外led灯珠及其制备方法 |
| CN112420893B (zh) * | 2020-10-28 | 2021-11-16 | 吉安市木林森半导体材料有限公司 | 一种使用硅氮烷进行封装的紫外led灯珠及其制备方法 |
Also Published As
| Publication number | Publication date |
|---|---|
| JP2016529354A (ja) | 2016-09-23 |
| SG10201800517XA (en) | 2018-02-27 |
| WO2015007778A1 (en) | 2015-01-22 |
| TW201510001A (zh) | 2015-03-16 |
| EP3022249A1 (en) | 2016-05-25 |
| SG11201600363XA (en) | 2016-02-26 |
| US9991182B2 (en) | 2018-06-05 |
| KR20160035581A (ko) | 2016-03-31 |
| US20160172552A1 (en) | 2016-06-16 |
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Inventor after: R Grosso Muller Inventor after: Carona Nan Dan R Inventor after: Bei Wenxiong Inventor after: H. Renz Inventor after: Wagner Daniel Inventor before: R Grosso Muller Inventor before: Carona Nan Dan R Inventor before: F, Inventor before: H. Renz Inventor before: Wagner Daniel |
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Effective date of abandoning: 20190416 |