JP2016526287A5 - - Google Patents

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Publication number
JP2016526287A5
JP2016526287A5 JP2016512967A JP2016512967A JP2016526287A5 JP 2016526287 A5 JP2016526287 A5 JP 2016526287A5 JP 2016512967 A JP2016512967 A JP 2016512967A JP 2016512967 A JP2016512967 A JP 2016512967A JP 2016526287 A5 JP2016526287 A5 JP 2016526287A5
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JP
Japan
Prior art keywords
inductor
varactor
3dic
frequency
layer
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Ceased
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JP2016512967A
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English (en)
Japanese (ja)
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JP2016526287A (ja
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Publication date
Priority claimed from US13/887,568 external-priority patent/US9634640B2/en
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Publication of JP2016526287A publication Critical patent/JP2016526287A/ja
Publication of JP2016526287A5 publication Critical patent/JP2016526287A5/ja
Ceased legal-status Critical Current

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JP2016512967A 2013-05-06 2014-05-02 ３次元（３ｄ）集積回路（ｉｃ）（３ｄｉｃ）における調整可能なダイプレクサならびに関連構成要素および方法 Ceased JP2016526287A (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US13/887,568 2013-05-06
US13/887,568 US9634640B2 (en) 2013-05-06 2013-05-06 Tunable diplexers in three-dimensional (3D) integrated circuits (IC) (3DIC) and related components and methods
PCT/US2014/036524 WO2014182556A1 (en) 2013-05-06 2014-05-02 Tunable diplexers in three-dimensional (3d) integrated circuits (ic) (3dic) and related components and methods

Publications (2)

Publication Number Publication Date
JP2016526287A JP2016526287A (ja) 2016-09-01
JP2016526287A5 true JP2016526287A5 (https=) 2017-06-08

Family

ID=50896553

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2016512967A Ceased JP2016526287A (ja) 2013-05-06 2014-05-02 ３次元（３ｄ）集積回路（ｉｃ）（３ｄｉｃ）における調整可能なダイプレクサならびに関連構成要素および方法

Country Status (6)

Country Link
US (2) US9634640B2 (https=)
EP (1) EP2995002A1 (https=)
JP (1) JP2016526287A (https=)
KR (1) KR20160005064A (https=)
CN (1) CN105191123B (https=)
WO (1) WO2014182556A1 (https=)

Families Citing this family (16)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20070200803A1 (en) * 2005-07-27 2007-08-30 Semiconductor Energy Laboratory Co., Ltd. Display device, and driving method and electronic device thereof
US9203373B2 (en) 2013-01-11 2015-12-01 Qualcomm Incorporated Diplexer design using through glass via technology
US9935166B2 (en) 2013-03-15 2018-04-03 Qualcomm Incorporated Capacitor with a dielectric between a via and a plate of the capacitor
US9634640B2 (en) 2013-05-06 2017-04-25 Qualcomm Incorporated Tunable diplexers in three-dimensional (3D) integrated circuits (IC) (3DIC) and related components and methods
US9264013B2 (en) 2013-06-04 2016-02-16 Qualcomm Incorporated Systems for reducing magnetic coupling in integrated circuits (ICS), and related components and methods
US9800338B2 (en) * 2014-07-25 2017-10-24 Arris Enterprises Llc Configurable diplex filter with tunable inductors
US10256863B2 (en) 2016-01-11 2019-04-09 Qualcomm Incorporated Monolithic integration of antenna switch and diplexer
US10103703B2 (en) 2016-05-20 2018-10-16 Qualcomm Incorporated Double-sided circuit
JP6881406B2 (ja) * 2018-08-31 2021-06-02 株式会社村田製作所 方向性結合器
US11652468B2 (en) * 2020-07-07 2023-05-16 Qualcomm Incorporated High performance tunable filter
US11342246B2 (en) * 2020-07-21 2022-05-24 Qualcomm Incorporated Multi-terminal integrated passive devices embedded on die and a method for fabricating the multi-terminal integrated passive devices
US11201602B1 (en) * 2020-09-17 2021-12-14 Analog Devices, Inc. Apparatus and methods for tunable filtering
US11770115B2 (en) 2020-10-16 2023-09-26 Qualcomm Incorporated Tunable circuit including integrated filter circuit coupled to variable capacitance, and related integrated circuit (IC) packages and fabrication methods
CN115084069B (zh) 2021-03-12 2025-02-07 京东方科技集团股份有限公司 半导体装置及其制造方法
CN115084068A (zh) 2021-03-12 2022-09-20 京东方科技集团股份有限公司 半导体装置及其制造方法
CN115241163B (zh) * 2021-04-23 2025-03-25 京东方科技集团股份有限公司 可调滤波器及其制备方法

Family Cites Families (82)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US2757320A (en) * 1953-10-15 1956-07-31 Westinghouse Electric Corp Frequency sensitive control device
US3656162A (en) * 1969-09-19 1972-04-11 Litton Systems Inc Diplexer for radio communication
JPS5291446U (https=) 1975-12-29 1977-07-08
JP3139327B2 (ja) 1995-05-31 2001-02-26 株式会社村田製作所 高周波複合部品
US5548255A (en) 1995-06-23 1996-08-20 Microphase Corporation Compact diplexer connection circuit
JPH0945866A (ja) 1995-08-02 1997-02-14 Hitachi Ltd マイクロ波集積回路
JPH0992539A (ja) 1995-09-22 1997-04-04 Uniden Corp 立体渦巻状インダクタ及びそれを用いた誘導結合フィルタ
WO1998013932A1 (en) 1996-09-26 1998-04-02 Matsushita Electric Industrial Co., Ltd. Branch filter and shared device and 2-frequency band mobile communication apparatus using the branch filter
US5886597A (en) 1997-03-28 1999-03-23 Virginia Tech Intellectual Properties, Inc. Circuit structure including RF/wideband resonant vias
JPH11112264A (ja) * 1997-10-08 1999-04-23 Murata Mfg Co Ltd フィルタ
US6013939A (en) 1997-10-31 2000-01-11 National Scientific Corp. Monolithic inductor with magnetic flux lines guided away from substrate
US6417754B1 (en) * 1997-12-08 2002-07-09 The Regents Of The University Of California Three-dimensional coil inductor
JP3255105B2 (ja) * 1998-01-22 2002-02-12 株式会社村田製作所 高周波複合部品
US6180976B1 (en) 1999-02-02 2001-01-30 Conexant Systems, Inc. Thin-film capacitors and methods for forming the same
JP2001136045A (ja) 1999-08-23 2001-05-18 Murata Mfg Co Ltd 積層型複合電子部品
JP2001119209A (ja) 1999-10-15 2001-04-27 Murata Mfg Co Ltd 積層型フィルタモジュール
KR100316693B1 (ko) 1999-12-22 2001-12-20 박종섭 이동통신 기지국의 ｒｆ블록
JP2002008942A (ja) 2000-06-16 2002-01-11 Fujitsu Ltd コンデンサ装置、コンデンサ装置の製造方法及びコンデンサ装置が実装されたモジュール
KR100860281B1 (ko) 2000-08-04 2008-09-25 미츠비시 마테리알 가부시키가이샤 안테나
KR100382765B1 (ko) 2001-06-15 2003-05-09 삼성전자주식회사 송수신용 수동소자와 그 집적모듈 및 그 제조방법
JP2003014592A (ja) 2001-06-28 2003-01-15 Nippon Shooter Ltd オンライン式ジャグ真空化装置およびその真空化方法
JPWO2003007379A1 (ja) 2001-07-12 2004-11-04 株式会社日立製作所 電子回路部品
US6597258B2 (en) 2001-08-30 2003-07-22 Spectrum Astro High performance diplexer and method
JP2003100553A (ja) 2001-09-26 2003-04-04 Toshiba Corp 受動素子部品及び受動素子内蔵基板
JP3998984B2 (ja) 2002-01-18 2007-10-31 富士通株式会社 回路基板及びその製造方法
JP2003258675A (ja) * 2002-02-27 2003-09-12 Kyocera Corp 通信制御方法
JP4103502B2 (ja) 2002-08-28 2008-06-18 株式会社トッパンＮｅｃサーキットソリューションズ 多層配線板及びその製造方法
US7091589B2 (en) 2002-12-11 2006-08-15 Dai Nippon Printing Co., Ltd. Multilayer wiring board and manufacture method thereof
JP2004200227A (ja) 2002-12-16 2004-07-15 Alps Electric Co Ltd プリントインダクタ
JP2004281847A (ja) * 2003-03-18 2004-10-07 Tdk Corp 積層複合電子部品
JP2004281850A (ja) 2003-03-18 2004-10-07 Tdk Corp 積層複合電子部品
US7044390B2 (en) 2003-06-02 2006-05-16 Stmicroelectronics, Inc. Smart card emulator and related methods using buffering interface
US8046508B2 (en) 2004-04-21 2011-10-25 Stmicroelectronics, Inc. Smart card with self-detachment features and related methods
KR20070086706A (ko) 2004-12-28 2007-08-27 니뽄 도쿠슈 도교 가부시키가이샤 배선 기판 및 배선 기판의 제조 방법
JP2006279604A (ja) 2005-03-29 2006-10-12 Tdk Corp 弾性表面波装置
EP1889359B1 (en) * 2005-06-08 2013-01-16 The Regents of the University of California Linear variable voltage diode capacitor and adaptive matching networks
US7323948B2 (en) 2005-08-23 2008-01-29 International Business Machines Corporation Vertical LC tank device
JP5180091B2 (ja) 2005-11-24 2013-04-10 テクニシェ・ウニフェルシテイト・デルフト バラクタ素子および低歪バラクタ回路装置
JP5055768B2 (ja) 2006-01-16 2012-10-24 富士通セミコンダクター株式会社 半導体装置及びその製造方法
CN100382065C (zh) 2006-03-31 2008-04-16 北京飞天诚信科技有限公司 基于usb接口的智能卡读写器及其控制方法
US7498918B2 (en) 2006-04-04 2009-03-03 United Microelectronics Corp. Inductor structure
EP1850491A3 (en) 2006-04-26 2012-02-22 Hitachi Metals, Ltd. High-frequency circuit, high-frequency device and communications apparatus
US7843302B2 (en) 2006-05-08 2010-11-30 Ibiden Co., Ltd. Inductor and electric power supply using it
US7825745B1 (en) 2006-09-12 2010-11-02 Rf Magic Inc. Variable bandwidth tunable silicon duplexer
TWI333684B (en) 2006-11-07 2010-11-21 Unimicron Technology Corp Package substrate having embedded capacitor
US8634029B2 (en) 2006-12-04 2014-01-21 Thomson Licensing Tuning device with diplexer input
DE102006058068B4 (de) 2006-12-07 2018-04-05 Infineon Technologies Ag Halbleiterbauelement mit Halbleiterchip und passivem Spulen-Bauelement sowie Verfahren zu dessen Herstellung
JP2008171965A (ja) 2007-01-11 2008-07-24 Fuji Electric Device Technology Co Ltd 超小型電力変換装置
JP2008182340A (ja) 2007-01-23 2008-08-07 Ngk Spark Plug Co Ltd ダイプレクサ及びそれを用いたマルチプレクサ
US7821359B2 (en) 2007-07-09 2010-10-26 John Messalingua Associates, Inc. Band-stop filters
TWI345243B (en) * 2007-08-14 2011-07-11 Ind Tech Res Inst Inter-helix inductor devices
EP2200179B1 (en) * 2007-10-23 2012-08-29 Murata Manufacturing Co., Ltd. Laminated electronic component and method for manufacturing the same
JP4605404B2 (ja) * 2007-11-12 2011-01-05 Ｔｄｋ株式会社 電子部品
JP2009159328A (ja) * 2007-12-26 2009-07-16 Ngk Spark Plug Co Ltd マルチプレクサ、トリプレクサ及びダイプレクサ
US20090219908A1 (en) 2008-02-29 2009-09-03 Ahmadreza Rofougaran Method and system for processing signals via diplexers embedded in an integrated circuit package
WO2009118694A1 (en) 2008-03-25 2009-10-01 Nxp B.V. Integrated 3d high density and high quality inductive element
WO2009128047A1 (en) 2008-04-18 2009-10-22 Nxp B.V. High density inductor, having a high quality factor
US8442586B2 (en) 2008-05-08 2013-05-14 Texas Instruments Incorporated Determining USB/ISO interface and power supply voltage in mobile device
ES2400165T3 (es) 2008-10-13 2013-04-08 Vodafone Holding Gmbh Procedimiento para proporcionar un acceso controlado a una tarjeta de memoria y tarjeta de memoria
KR101575387B1 (ko) 2009-03-18 2015-12-07 에이저 시스템즈 엘엘시 집적 회로 인덕터 구조체, 전자 시스템 및 집적 회로 인덕터 사이의 자기 커플링 감소 방법
US7955942B2 (en) 2009-05-18 2011-06-07 Stats Chippac, Ltd. Semiconductor device and method of forming a 3D inductor from prefabricated pillar frame
US8143952B2 (en) 2009-10-08 2012-03-27 Qualcomm Incorporated Three dimensional inductor and transformer
US8344478B2 (en) 2009-10-23 2013-01-01 Maxim Integrated Products, Inc. Inductors having inductor axis parallel to substrate surface
US8391316B2 (en) 2009-11-06 2013-03-05 Broadcom Corporation Front-end system for processing composite wideband signals and method for utilizing same
JP2011159953A (ja) * 2010-01-05 2011-08-18 Fujitsu Ltd 電子回路及び電子機器
US20110248405A1 (en) 2010-04-09 2011-10-13 Qualcomm Incorporated Selective Patterning for Low Cost through Vias
US8384507B2 (en) * 2010-06-01 2013-02-26 Qualcomm Incorporated Through via inductor or transformer in a high-resistance substrate with programmability
US8362591B2 (en) 2010-06-08 2013-01-29 Taiwan Semiconductor Manufacturing Co., Ltd. Integrated circuits and methods of forming the same
WO2012040063A1 (en) 2010-09-23 2012-03-29 Qualcomm Mems Technologies, Inc. Integrated passives and power amplifier
US8405135B2 (en) 2010-10-05 2013-03-26 International Business Machines Corporation 3D via capacitor with a floating conductive plate for improved reliability
JP2012100180A (ja) * 2010-11-05 2012-05-24 Hitachi Media Electoronics Co Ltd チューナブルフィルタ、チューナブルデュプレクサ、及び、それらを用いた移動通信端末
CN102569249B (zh) 2010-12-08 2014-01-22 财团法人工业技术研究院 立体式电感
US8736399B2 (en) 2011-04-06 2014-05-27 M/A-Com Technology Solutions Holdings, Inc. Triplexer topology
WO2012144482A1 (ja) 2011-04-18 2012-10-26 株式会社村田製作所 アンテナ装置および通信端末装置
US9002309B2 (en) 2011-05-27 2015-04-07 Qualcomm Incorporated Tunable multi-band receiver
US8803615B2 (en) * 2012-01-23 2014-08-12 Qualcomm Incorporated Impedance matching circuit with tunable notch filters for power amplifier
US20130207745A1 (en) 2012-02-13 2013-08-15 Qualcomm Incorporated 3d rf l-c filters using through glass vias
US20130223412A1 (en) 2012-02-24 2013-08-29 Qualcomm Incorporated Method and system to improve frame early termination success rate
US9203373B2 (en) 2013-01-11 2015-12-01 Qualcomm Incorporated Diplexer design using through glass via technology
US9935166B2 (en) 2013-03-15 2018-04-03 Qualcomm Incorporated Capacitor with a dielectric between a via and a plate of the capacitor
US9634640B2 (en) 2013-05-06 2017-04-25 Qualcomm Incorporated Tunable diplexers in three-dimensional (3D) integrated circuits (IC) (3DIC) and related components and methods
US9264013B2 (en) 2013-06-04 2016-02-16 Qualcomm Incorporated Systems for reducing magnetic coupling in integrated circuits (ICS), and related components and methods

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