JP2018526933A5 - - Google Patents

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Publication number
JP2018526933A5
JP2018526933A5 JP2018512862A JP2018512862A JP2018526933A5 JP 2018526933 A5 JP2018526933 A5 JP 2018526933A5 JP 2018512862 A JP2018512862 A JP 2018512862A JP 2018512862 A JP2018512862 A JP 2018512862A JP 2018526933 A5 JP2018526933 A5 JP 2018526933A5
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JP
Japan
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signal
input
output
chip
flip
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JP2018512862A
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Japanese (ja)
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JP2018526933A (ja
JP6648262B2 (ja
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Priority claimed from US14/853,802 external-priority patent/US9443810B1/en
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JP2018512862A 2015-09-14 2016-08-30 一体型キャビティフィルタを使用するフリップチップ、ならびに関連する構成要素、システム、および方法 Active JP6648262B2 (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US14/853,802 2015-09-14
US14/853,802 US9443810B1 (en) 2015-09-14 2015-09-14 Flip-chip employing integrated cavity filter, and related components, systems, and methods
PCT/US2016/049440 WO2017048500A1 (en) 2015-09-14 2016-08-30 Flip-chip employing integrated cavity filter, and related components, systems, and methods

Publications (3)

Publication Number Publication Date
JP2018526933A JP2018526933A (ja) 2018-09-13
JP2018526933A5 true JP2018526933A5 (https=) 2019-12-26
JP6648262B2 JP6648262B2 (ja) 2020-02-14

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ID=56881442

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JP2018512862A Active JP6648262B2 (ja) 2015-09-14 2016-08-30 一体型キャビティフィルタを使用するフリップチップ、ならびに関連する構成要素、システム、および方法

Country Status (11)

Country Link
US (2) US9443810B1 (https=)
EP (1) EP3350874B1 (https=)
JP (1) JP6648262B2 (https=)
KR (1) KR102118558B1 (https=)
CN (1) CN108028453B (https=)
BR (1) BR112018004941B1 (https=)
CA (1) CA2993991A1 (https=)
ES (1) ES2763034T3 (https=)
HU (1) HUE046872T2 (https=)
TW (1) TWI588913B (https=)
WO (1) WO2017048500A1 (https=)

Families Citing this family (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US9443810B1 (en) 2015-09-14 2016-09-13 Qualcomm Incorporated Flip-chip employing integrated cavity filter, and related components, systems, and methods
CN108701680B (zh) * 2016-03-31 2023-05-30 英特尔公司 带有使用金属层和通孔的电磁干扰屏蔽的半导体封装
EP3679385B1 (en) * 2017-09-07 2022-10-26 Amherst College Loop-gap resonators for spin resonance spectroscopy
US11527696B2 (en) * 2017-10-05 2022-12-13 Google Llc Low footprint resonator in flip chip geometry
CN111226348B (zh) * 2017-10-17 2022-03-11 康普技术有限责任公司 用于具有多层基板的微波和毫米波通信系统的垂直过渡
JP6965732B2 (ja) * 2017-12-26 2021-11-10 Tdk株式会社 バンドパスフィルタ
CN109219299B (zh) * 2018-10-31 2023-08-18 重庆山淞信息技术有限公司 一种多滤波功能的滤波器
CN109768357B (zh) * 2019-02-25 2020-12-08 广东曼克维通信科技有限公司 一种传输零点可控的基片集成波导滤波器
CN114285391B (zh) * 2021-03-23 2025-12-16 偲百创(深圳)科技有限公司 射频滤波器及其制造方法
CN119785837A (zh) * 2021-08-26 2025-04-08 株式会社东芝 盘装置

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Publication number Priority date Publication date Assignee Title
US6130483A (en) 1997-03-05 2000-10-10 Kabushiki Kaisha Toshiba MMIC module using flip-chip mounting
US6297716B1 (en) * 1999-12-16 2001-10-02 Lockheed Martin Corporation Q-switched cavity multiplier
JP2002026611A (ja) * 2000-07-07 2002-01-25 Nec Corp フィルタ
DE10164494B9 (de) * 2001-12-28 2014-08-21 Epcos Ag Verkapseltes Bauelement mit geringer Bauhöhe sowie Verfahren zur Herstellung
DE102004014018B3 (de) 2004-03-19 2005-08-11 Forschungsverbund Berlin E.V. Mikrowellenantenne für in Flip-Chip-Technologie hergestellte Halbleiterbaugruppen
WO2010026990A1 (ja) 2008-09-05 2010-03-11 三菱電機株式会社 高周波回路パッケージおよびセンサモジュール
WO2010139366A1 (en) 2009-06-04 2010-12-09 Telefonaktiebolaget L M Ericsson (Publ) A package resonator cavity
US8447250B2 (en) * 2009-06-09 2013-05-21 Broadcom Corporation Method and system for an integrated voltage controlled oscillator-based transmitter and on-chip power distribution network
KR101077011B1 (ko) * 2009-06-09 2011-10-26 서울대학교산학협력단 미세가공 공동 공진기와 그 제조 방법 및 이를 이용한 대역통과 필터와 발진기
JP5499879B2 (ja) * 2010-04-26 2014-05-21 三菱電機株式会社 高周波フィルタ
US9398694B2 (en) * 2011-01-18 2016-07-19 Sony Corporation Method of manufacturing a package for embedding one or more electronic components
US8749056B2 (en) * 2011-05-26 2014-06-10 Infineon Technologies Ag Module and method of manufacturing a module
CN202120888U (zh) * 2011-06-21 2012-01-18 成都嘉纳海威科技有限责任公司 一种超宽带多功能变频芯片
US8866291B2 (en) 2012-02-10 2014-10-21 Raytheon Company Flip-chip mounted microstrip monolithic microwave integrated circuits (MMICs)
US9123983B1 (en) * 2012-07-20 2015-09-01 Hittite Microwave Corporation Tunable bandpass filter integrated circuit
CN203434139U (zh) * 2013-08-16 2014-02-12 深圳华远微电科技有限公司 倒装芯片式滤波器封装结构
US10062494B2 (en) * 2014-11-03 2018-08-28 Qorvo Us, Inc. Apparatus with 3D inductors
US9443810B1 (en) 2015-09-14 2016-09-13 Qualcomm Incorporated Flip-chip employing integrated cavity filter, and related components, systems, and methods

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