JP2016524322A5 - - Google Patents

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Publication number
JP2016524322A5
JP2016524322A5 JP2016512822A JP2016512822A JP2016524322A5 JP 2016524322 A5 JP2016524322 A5 JP 2016524322A5 JP 2016512822 A JP2016512822 A JP 2016512822A JP 2016512822 A JP2016512822 A JP 2016512822A JP 2016524322 A5 JP2016524322 A5 JP 2016524322A5
Authority
JP
Japan
Prior art keywords
light emitting
straight line
wire
disposed
metal layer
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2016512822A
Other languages
English (en)
Japanese (ja)
Other versions
JP2016524322A (ja
Filing date
Publication date
Priority claimed from KR1020130051766A external-priority patent/KR102085888B1/ko
Application filed filed Critical
Publication of JP2016524322A publication Critical patent/JP2016524322A/ja
Publication of JP2016524322A5 publication Critical patent/JP2016524322A5/ja
Pending legal-status Critical Current

Links

JP2016512822A 2013-05-08 2014-04-29 発光素子 Pending JP2016524322A (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
KR1020130051766A KR102085888B1 (ko) 2013-05-08 2013-05-08 발광 소자
KR10-2013-0051766 2013-05-08
PCT/KR2014/003781 WO2014181996A1 (ko) 2013-05-08 2014-04-29 발광 소자

Publications (2)

Publication Number Publication Date
JP2016524322A JP2016524322A (ja) 2016-08-12
JP2016524322A5 true JP2016524322A5 (enExample) 2017-06-08

Family

ID=51867433

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2016512822A Pending JP2016524322A (ja) 2013-05-08 2014-04-29 発光素子

Country Status (6)

Country Link
US (1) US9543489B2 (enExample)
EP (1) EP2996164B1 (enExample)
JP (1) JP2016524322A (enExample)
KR (1) KR102085888B1 (enExample)
CN (1) CN105210201B (enExample)
WO (1) WO2014181996A1 (enExample)

Families Citing this family (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US11073248B2 (en) 2014-09-28 2021-07-27 Zhejiang Super Lighting Electric Appliance Co., Ltd. LED bulb lamp
US11085591B2 (en) 2014-09-28 2021-08-10 Zhejiang Super Lighting Electric Appliance Co., Ltd LED light bulb with curved filament
US11525547B2 (en) 2014-09-28 2022-12-13 Zhejiang Super Lighting Electric Appliance Co., Ltd LED light bulb with curved filament
US11686436B2 (en) 2014-09-28 2023-06-27 Zhejiang Super Lighting Electric Appliance Co., Ltd LED filament and light bulb using LED filament
US11421827B2 (en) 2015-06-19 2022-08-23 Zhejiang Super Lighting Electric Appliance Co., Ltd LED filament and LED light bulb
US11997768B2 (en) 2014-09-28 2024-05-28 Zhejiang Super Lighting Electric Appliance Co., Ltd LED filament and LED light bulb
US11543083B2 (en) 2014-09-28 2023-01-03 Zhejiang Super Lighting Electric Appliance Co., Ltd LED filament and LED light bulb
USD770987S1 (en) * 2014-10-17 2016-11-08 Panasonic Intellectual Property Management Co., Ltd. Light emitting diode
KR102402577B1 (ko) * 2017-09-19 2022-05-26 쑤저우 레킨 세미컨덕터 컴퍼니 리미티드 발광 소자 패키지
EP3460861B1 (en) * 2017-09-21 2023-03-01 InnoLux Corporation Display device
JP7037044B2 (ja) * 2017-12-27 2022-03-16 日亜化学工業株式会社 発光装置及びその製造方法
US10982048B2 (en) 2018-04-17 2021-04-20 Jiaxing Super Lighting Electric Appliance Co., Ltd Organosilicon-modified polyimide resin composition and use thereof
TWI728816B (zh) * 2020-05-21 2021-05-21 健策精密工業股份有限公司 發光二極體模組及其製作方法

Family Cites Families (22)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3993302B2 (ja) * 1998-05-20 2007-10-17 ローム株式会社 半導体装置
JP2005236182A (ja) * 2004-02-23 2005-09-02 Pentax Corp 半導体発光素子
US7514724B2 (en) * 2007-03-23 2009-04-07 Avago Technologies Ecbu Ip (Singapore) Pte. Ltd. Solid state light source having a variable number of dies
KR100977260B1 (ko) 2007-12-28 2010-08-23 한국 고덴시 주식회사 고출력 엘이디 패키지 및 그 제조방법
WO2010098457A1 (ja) * 2009-02-27 2010-09-02 東芝ライテック株式会社 発光モジュールおよび照明装置
JP4890576B2 (ja) 2009-02-27 2012-03-07 東芝ライテック株式会社 発光モジュール
JP5408414B2 (ja) 2009-06-10 2014-02-05 東芝ライテック株式会社 発光モジュール
JP2011009298A (ja) 2009-06-23 2011-01-13 Citizen Electronics Co Ltd 発光ダイオード光源装置
TW201116145A (en) * 2009-10-19 2011-05-01 Paragon Sc Lighting Tech Co LED package structure for generating similar-circle light-emitting effect
JP2011151268A (ja) * 2010-01-22 2011-08-04 Sharp Corp 発光装置
JP2011181888A (ja) * 2010-02-03 2011-09-15 Toshiba Lighting & Technology Corp 発光装置及び照明装置
EP2565951B1 (en) 2010-04-26 2019-07-31 Panasonic Intellectual Property Management Co., Ltd. Light emitting unit and illuminating apparatus
JP5531823B2 (ja) * 2010-06-29 2014-06-25 日亜化学工業株式会社 発光装置およびその検査方法、製造方法
TWI419373B (zh) * 2010-10-22 2013-12-11 柏友照明科技股份有限公司 使用定電壓電源供應器之多晶封裝結構
JP2012124249A (ja) * 2010-12-07 2012-06-28 Toshiba Corp Ledパッケージ及びその製造方法
US8455908B2 (en) * 2011-02-16 2013-06-04 Cree, Inc. Light emitting devices
US8674376B2 (en) * 2011-04-28 2014-03-18 Paragon Semiconductor Lighting Technology Co., Ltd. LED package structure
US9412914B2 (en) 2011-07-25 2016-08-09 Nichia Corporation Light emitting device
JP5810758B2 (ja) * 2011-08-31 2015-11-11 日亜化学工業株式会社 発光装置
KR20130046175A (ko) * 2011-10-27 2013-05-07 서울반도체 주식회사 멀티칩형 엘이디 패키지
JP6046514B2 (ja) 2012-03-01 2016-12-14 株式会社半導体エネルギー研究所 半導体装置
JP5857928B2 (ja) * 2012-09-25 2016-02-10 豊田合成株式会社 発光装置

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