CN105210201B - 发光器件 - Google Patents

发光器件 Download PDF

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Publication number
CN105210201B
CN105210201B CN201480026275.0A CN201480026275A CN105210201B CN 105210201 B CN105210201 B CN 105210201B CN 201480026275 A CN201480026275 A CN 201480026275A CN 105210201 B CN105210201 B CN 105210201B
Authority
CN
China
Prior art keywords
luminescence chip
conducting wire
straight line
metal layer
heat sink
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
CN201480026275.0A
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English (en)
Chinese (zh)
Other versions
CN105210201A (zh
Inventor
朴己勋
朴正焕
赵贤硕
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Suzhou Liyu Semiconductor Co ltd
Original Assignee
LG Innotek Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by LG Innotek Co Ltd filed Critical LG Innotek Co Ltd
Publication of CN105210201A publication Critical patent/CN105210201A/zh
Application granted granted Critical
Publication of CN105210201B publication Critical patent/CN105210201B/zh
Active legal-status Critical Current
Anticipated expiration legal-status Critical

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Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/85—Packages
    • H10H20/857—Interconnections, e.g. lead-frames, bond wires or solder balls
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/84—Coatings, e.g. passivation layers or antireflective coatings
    • H10H20/841—Reflective coatings, e.g. dielectric Bragg reflectors
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/85—Packages
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/85—Packages
    • H10H20/858—Means for heat extraction or cooling
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/075—Connecting or disconnecting of bond wires
    • H10W72/07541—Controlling the environment, e.g. atmosphere composition or temperature
    • H10W72/07554—Controlling the environment, e.g. atmosphere composition or temperature changes in dispositions
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
    • H10W90/753—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between laterally-adjacent chips
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
    • H10W90/754—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked insulating package substrate, interposer or RDL

Landscapes

  • Led Device Packages (AREA)
  • Non-Portable Lighting Devices Or Systems Thereof (AREA)
CN201480026275.0A 2013-05-08 2014-04-29 发光器件 Active CN105210201B (zh)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
KR10-2013-0051766 2013-05-08
KR1020130051766A KR102085888B1 (ko) 2013-05-08 2013-05-08 발광 소자
PCT/KR2014/003781 WO2014181996A1 (ko) 2013-05-08 2014-04-29 발광 소자

Publications (2)

Publication Number Publication Date
CN105210201A CN105210201A (zh) 2015-12-30
CN105210201B true CN105210201B (zh) 2019-06-04

Family

ID=51867433

Family Applications (1)

Application Number Title Priority Date Filing Date
CN201480026275.0A Active CN105210201B (zh) 2013-05-08 2014-04-29 发光器件

Country Status (6)

Country Link
US (1) US9543489B2 (enExample)
EP (1) EP2996164B1 (enExample)
JP (1) JP2016524322A (enExample)
KR (1) KR102085888B1 (enExample)
CN (1) CN105210201B (enExample)
WO (1) WO2014181996A1 (enExample)

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* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US11085591B2 (en) 2014-09-28 2021-08-10 Zhejiang Super Lighting Electric Appliance Co., Ltd LED light bulb with curved filament
US11543083B2 (en) 2014-09-28 2023-01-03 Zhejiang Super Lighting Electric Appliance Co., Ltd LED filament and LED light bulb
US11997768B2 (en) 2014-09-28 2024-05-28 Zhejiang Super Lighting Electric Appliance Co., Ltd LED filament and LED light bulb
US11686436B2 (en) 2014-09-28 2023-06-27 Zhejiang Super Lighting Electric Appliance Co., Ltd LED filament and light bulb using LED filament
US11525547B2 (en) 2014-09-28 2022-12-13 Zhejiang Super Lighting Electric Appliance Co., Ltd LED light bulb with curved filament
US11421827B2 (en) 2015-06-19 2022-08-23 Zhejiang Super Lighting Electric Appliance Co., Ltd LED filament and LED light bulb
US11073248B2 (en) 2014-09-28 2021-07-27 Zhejiang Super Lighting Electric Appliance Co., Ltd. LED bulb lamp
USD770987S1 (en) 2014-10-17 2016-11-08 Panasonic Intellectual Property Management Co., Ltd. Light emitting diode
KR102402577B1 (ko) * 2017-09-19 2022-05-26 쑤저우 레킨 세미컨덕터 컴퍼니 리미티드 발광 소자 패키지
EP3460861B1 (en) * 2017-09-21 2023-03-01 InnoLux Corporation Display device
JP7037044B2 (ja) * 2017-12-27 2022-03-16 日亜化学工業株式会社 発光装置及びその製造方法
US10982048B2 (en) 2018-04-17 2021-04-20 Jiaxing Super Lighting Electric Appliance Co., Ltd Organosilicon-modified polyimide resin composition and use thereof
TWI728816B (zh) * 2020-05-21 2021-05-21 健策精密工業股份有限公司 發光二極體模組及其製作方法
US12543414B2 (en) 2020-05-21 2026-02-03 Jentech Precision Industrial Co., Ltd. Light emitting diode module and manufacturing method thereof

Citations (2)

* Cited by examiner, † Cited by third party
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CN102334202A (zh) * 2009-02-27 2012-01-25 东芝照明技术株式会社 发光模块及照明装置
TW201308696A (zh) * 2011-07-25 2013-02-16 日亞化學工業股份有限公司 發光裝置

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JP3993302B2 (ja) * 1998-05-20 2007-10-17 ローム株式会社 半導体装置
JP2005236182A (ja) * 2004-02-23 2005-09-02 Pentax Corp 半導体発光素子
US7514724B2 (en) * 2007-03-23 2009-04-07 Avago Technologies Ecbu Ip (Singapore) Pte. Ltd. Solid state light source having a variable number of dies
KR100977260B1 (ko) 2007-12-28 2010-08-23 한국 고덴시 주식회사 고출력 엘이디 패키지 및 그 제조방법
JP4890576B2 (ja) * 2009-02-27 2012-03-07 東芝ライテック株式会社 発光モジュール
JP5408414B2 (ja) * 2009-06-10 2014-02-05 東芝ライテック株式会社 発光モジュール
JP2011009298A (ja) 2009-06-23 2011-01-13 Citizen Electronics Co Ltd 発光ダイオード光源装置
TW201116145A (en) * 2009-10-19 2011-05-01 Paragon Sc Lighting Tech Co LED package structure for generating similar-circle light-emitting effect
JP2011151268A (ja) * 2010-01-22 2011-08-04 Sharp Corp 発光装置
JP2011181888A (ja) * 2010-02-03 2011-09-15 Toshiba Lighting & Technology Corp 発光装置及び照明装置
WO2011136236A1 (ja) 2010-04-26 2011-11-03 パナソニック電工株式会社 リードフレーム、配線板、発光ユニット、照明装置
JP5531823B2 (ja) * 2010-06-29 2014-06-25 日亜化学工業株式会社 発光装置およびその検査方法、製造方法
TWI419373B (zh) * 2010-10-22 2013-12-11 柏友照明科技股份有限公司 使用定電壓電源供應器之多晶封裝結構
JP2012124249A (ja) * 2010-12-07 2012-06-28 Toshiba Corp Ｌｅｄパッケージ及びその製造方法
US8455908B2 (en) * 2011-02-16 2013-06-04 Cree, Inc. Light emitting devices
US8674376B2 (en) * 2011-04-28 2014-03-18 Paragon Semiconductor Lighting Technology Co., Ltd. LED package structure
JP5810758B2 (ja) * 2011-08-31 2015-11-11 日亜化学工業株式会社 発光装置
KR20130046175A (ko) * 2011-10-27 2013-05-07 서울반도체 주식회사 멀티칩형 엘이디 패키지
JP6046514B2 (ja) 2012-03-01 2016-12-14 株式会社半導体エネルギー研究所 半導体装置
JP5857928B2 (ja) * 2012-09-25 2016-02-10 豊田合成株式会社 発光装置

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN102334202A (zh) * 2009-02-27 2012-01-25 东芝照明技术株式会社 发光模块及照明装置
TW201308696A (zh) * 2011-07-25 2013-02-16 日亞化學工業股份有限公司 發光裝置

Also Published As

Publication number Publication date
EP2996164A1 (en) 2016-03-16
KR102085888B1 (ko) 2020-03-06
KR20140132517A (ko) 2014-11-18
WO2014181996A1 (ko) 2014-11-13
JP2016524322A (ja) 2016-08-12
CN105210201A (zh) 2015-12-30
US9543489B2 (en) 2017-01-10
US20160087178A1 (en) 2016-03-24
EP2996164A4 (en) 2016-11-30
EP2996164B1 (en) 2021-06-16

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C06 Publication
PB01 Publication
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SE01 Entry into force of request for substantive examination
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GR01 Patent grant
TR01 Transfer of patent right

Effective date of registration: 20210816

Address after: 168 Changsheng North Road, Taicang City, Suzhou City, Jiangsu Province

Patentee after: Suzhou Leyu Semiconductor Co.,Ltd.

Address before: Seoul, South Kerean

Patentee before: LG INNOTEK Co.,Ltd.

TR01 Transfer of patent right
CP03 Change of name, title or address

Address after: 215499 No. 168, Changsheng North Road, Taicang City, Suzhou City, Jiangsu Province

Patentee after: Suzhou Liyu Semiconductor Co.,Ltd.

Country or region after: China

Address before: 168 Changsheng North Road, Taicang City, Suzhou City, Jiangsu Province

Patentee before: Suzhou Leyu Semiconductor Co.,Ltd.

Country or region before: China

CP03 Change of name, title or address