JP2016524322A - 発光素子 - Google Patents

発光素子 Download PDF

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Publication number
JP2016524322A
JP2016524322A JP2016512822A JP2016512822A JP2016524322A JP 2016524322 A JP2016524322 A JP 2016524322A JP 2016512822 A JP2016512822 A JP 2016512822A JP 2016512822 A JP2016512822 A JP 2016512822A JP 2016524322 A JP2016524322 A JP 2016524322A
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JP
Japan
Prior art keywords
light emitting
straight line
wire
disposed
metal layer
Prior art date
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Pending
Application number
JP2016512822A
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English (en)
Japanese (ja)
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JP2016524322A5 (enExample
Inventor
パク，キフン
パク，チョンファン
チョ，ヒョンソク
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
LG Innotek Co Ltd
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LG Innotek Co Ltd
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Filing date
Publication date
Application filed by LG Innotek Co Ltd filed Critical LG Innotek Co Ltd
Publication of JP2016524322A publication Critical patent/JP2016524322A/ja
Publication of JP2016524322A5 publication Critical patent/JP2016524322A5/ja
Pending legal-status Critical Current

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    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/85—Packages
    • H10H20/857—Interconnections, e.g. lead-frames, bond wires or solder balls
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L24/42—Wire connectors; Manufacturing methods related thereto
    • H01L24/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L24/49—Structure, shape, material or disposition of the wire connectors after the connecting process of a plurality of wire connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L25/00—Assemblies consisting of a plurality of semiconductor or other solid state devices
    • H01L25/03—Assemblies consisting of a plurality of semiconductor or other solid state devices all the devices being of a type provided for in a single subclass of subclasses H10B, H10D, H10F, H10H, H10K or H10N, e.g. assemblies of rectifier diodes
    • H01L25/04—Assemblies consisting of a plurality of semiconductor or other solid state devices all the devices being of a type provided for in a single subclass of subclasses H10B, H10D, H10F, H10H, H10K or H10N, e.g. assemblies of rectifier diodes the devices not having separate containers
    • H01L25/075—Assemblies consisting of a plurality of semiconductor or other solid state devices all the devices being of a type provided for in a single subclass of subclasses H10B, H10D, H10F, H10H, H10K or H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H10H20/00
    • H01L25/0753—Assemblies consisting of a plurality of semiconductor or other solid state devices all the devices being of a type provided for in a single subclass of subclasses H10B, H10D, H10F, H10H, H10K or H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H10H20/00 the devices being arranged next to each other
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/84—Coatings, e.g. passivation layers or antireflective coatings
    • H10H20/841—Reflective coatings, e.g. dielectric Bragg reflectors
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/85—Packages
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/85—Packages
    • H10H20/858—Means for heat extraction or cooling
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48135—Connecting between different semiconductor or solid-state bodies, i.e. chip-to-chip
    • H01L2224/48137—Connecting between different semiconductor or solid-state bodies, i.e. chip-to-chip the bodies being arranged next to each other, e.g. on a common substrate
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48225—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
    • H01L2224/48227—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation connecting the wire to a bond pad of the item
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48225—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
    • H01L2224/48227—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation connecting the wire to a bond pad of the item
    • H01L2224/48229—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation connecting the wire to a bond pad of the item the bond pad protruding from the surface of the item
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/49—Structure, shape, material or disposition of the wire connectors after the connecting process of a plurality of wire connectors
    • H01L2224/491—Disposition
    • H01L2224/4912—Layout
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L24/42—Wire connectors; Manufacturing methods related thereto
    • H01L24/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L24/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/00014—Technical content checked by a classifier the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/181—Encapsulation

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  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Computer Hardware Design (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Led Device Packages (AREA)
  • Non-Portable Lighting Devices Or Systems Thereof (AREA)
JP2016512822A 2013-05-08 2014-04-29 発光素子 Pending JP2016524322A (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
KR1020130051766A KR102085888B1 (ko) 2013-05-08 2013-05-08 발광 소자
KR10-2013-0051766 2013-05-08
PCT/KR2014/003781 WO2014181996A1 (ko) 2013-05-08 2014-04-29 발광 소자

Publications (2)

Publication Number Publication Date
JP2016524322A true JP2016524322A (ja) 2016-08-12
JP2016524322A5 JP2016524322A5 (enExample) 2017-06-08

Family

ID=51867433

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2016512822A Pending JP2016524322A (ja) 2013-05-08 2014-04-29 発光素子

Country Status (6)

Country Link
US (1) US9543489B2 (enExample)
EP (1) EP2996164B1 (enExample)
JP (1) JP2016524322A (enExample)
KR (1) KR102085888B1 (enExample)
CN (1) CN105210201B (enExample)
WO (1) WO2014181996A1 (enExample)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2019117850A (ja) * 2017-12-27 2019-07-18 日亜化学工業株式会社 発光装置及びその製造方法

Families Citing this family (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US11073248B2 (en) 2014-09-28 2021-07-27 Zhejiang Super Lighting Electric Appliance Co., Ltd. LED bulb lamp
US11085591B2 (en) 2014-09-28 2021-08-10 Zhejiang Super Lighting Electric Appliance Co., Ltd LED light bulb with curved filament
US11525547B2 (en) 2014-09-28 2022-12-13 Zhejiang Super Lighting Electric Appliance Co., Ltd LED light bulb with curved filament
US11686436B2 (en) 2014-09-28 2023-06-27 Zhejiang Super Lighting Electric Appliance Co., Ltd LED filament and light bulb using LED filament
US11421827B2 (en) 2015-06-19 2022-08-23 Zhejiang Super Lighting Electric Appliance Co., Ltd LED filament and LED light bulb
US11997768B2 (en) 2014-09-28 2024-05-28 Zhejiang Super Lighting Electric Appliance Co., Ltd LED filament and LED light bulb
US11543083B2 (en) 2014-09-28 2023-01-03 Zhejiang Super Lighting Electric Appliance Co., Ltd LED filament and LED light bulb
USD770987S1 (en) * 2014-10-17 2016-11-08 Panasonic Intellectual Property Management Co., Ltd. Light emitting diode
KR102402577B1 (ko) * 2017-09-19 2022-05-26 쑤저우 레킨 세미컨덕터 컴퍼니 리미티드 발광 소자 패키지
EP3460861B1 (en) * 2017-09-21 2023-03-01 InnoLux Corporation Display device
US10982048B2 (en) 2018-04-17 2021-04-20 Jiaxing Super Lighting Electric Appliance Co., Ltd Organosilicon-modified polyimide resin composition and use thereof
TWI728816B (zh) * 2020-05-21 2021-05-21 健策精密工業股份有限公司 發光二極體模組及其製作方法

Citations (8)

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Publication number Priority date Publication date Assignee Title
JPH11330131A (ja) * 1998-05-20 1999-11-30 Rohm Co Ltd 半導体装置
JP2005236182A (ja) * 2004-02-23 2005-09-02 Pentax Corp 半導体発光素子
US20080273340A1 (en) * 2007-03-23 2008-11-06 Keat Chuan Ng Solid State Light Source Having a Variable Number of Dies
JP2011151268A (ja) * 2010-01-22 2011-08-04 Sharp Corp 発光装置
JP2011181888A (ja) * 2010-02-03 2011-09-15 Toshiba Lighting & Technology Corp 発光装置及び照明装置
JP2012015176A (ja) * 2010-06-29 2012-01-19 Nichia Chem Ind Ltd 発光装置およびその検査方法、製造方法
JP2012124249A (ja) * 2010-12-07 2012-06-28 Toshiba Corp Ｌｅｄパッケージ及びその製造方法
WO2013015058A1 (ja) * 2011-07-25 2013-01-31 日亜化学工業株式会社 発光装置

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KR100977260B1 (ko) 2007-12-28 2010-08-23 한국 고덴시 주식회사 고출력 엘이디 패키지 및 그 제조방법
WO2010098457A1 (ja) * 2009-02-27 2010-09-02 東芝ライテック株式会社 発光モジュールおよび照明装置
JP4890576B2 (ja) 2009-02-27 2012-03-07 東芝ライテック株式会社 発光モジュール
JP5408414B2 (ja) 2009-06-10 2014-02-05 東芝ライテック株式会社 発光モジュール
JP2011009298A (ja) 2009-06-23 2011-01-13 Citizen Electronics Co Ltd 発光ダイオード光源装置
TW201116145A (en) * 2009-10-19 2011-05-01 Paragon Sc Lighting Tech Co LED package structure for generating similar-circle light-emitting effect
EP2565951B1 (en) 2010-04-26 2019-07-31 Panasonic Intellectual Property Management Co., Ltd. Light emitting unit and illuminating apparatus
TWI419373B (zh) * 2010-10-22 2013-12-11 柏友照明科技股份有限公司 使用定電壓電源供應器之多晶封裝結構
US8455908B2 (en) * 2011-02-16 2013-06-04 Cree, Inc. Light emitting devices
US8674376B2 (en) * 2011-04-28 2014-03-18 Paragon Semiconductor Lighting Technology Co., Ltd. LED package structure
JP5810758B2 (ja) * 2011-08-31 2015-11-11 日亜化学工業株式会社 発光装置
KR20130046175A (ko) * 2011-10-27 2013-05-07 서울반도체 주식회사 멀티칩형 엘이디 패키지
JP6046514B2 (ja) 2012-03-01 2016-12-14 株式会社半導体エネルギー研究所 半導体装置
JP5857928B2 (ja) * 2012-09-25 2016-02-10 豊田合成株式会社 発光装置

Patent Citations (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH11330131A (ja) * 1998-05-20 1999-11-30 Rohm Co Ltd 半導体装置
JP2005236182A (ja) * 2004-02-23 2005-09-02 Pentax Corp 半導体発光素子
US20080273340A1 (en) * 2007-03-23 2008-11-06 Keat Chuan Ng Solid State Light Source Having a Variable Number of Dies
JP2011151268A (ja) * 2010-01-22 2011-08-04 Sharp Corp 発光装置
JP2011181888A (ja) * 2010-02-03 2011-09-15 Toshiba Lighting & Technology Corp 発光装置及び照明装置
JP2012015176A (ja) * 2010-06-29 2012-01-19 Nichia Chem Ind Ltd 発光装置およびその検査方法、製造方法
JP2012124249A (ja) * 2010-12-07 2012-06-28 Toshiba Corp Ｌｅｄパッケージ及びその製造方法
WO2013015058A1 (ja) * 2011-07-25 2013-01-31 日亜化学工業株式会社 発光装置

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2019117850A (ja) * 2017-12-27 2019-07-18 日亜化学工業株式会社 発光装置及びその製造方法
JP7037044B2 (ja) 2017-12-27 2022-03-16 日亜化学工業株式会社 発光装置及びその製造方法

Also Published As

Publication number Publication date
CN105210201B (zh) 2019-06-04
KR20140132517A (ko) 2014-11-18
US9543489B2 (en) 2017-01-10
EP2996164B1 (en) 2021-06-16
EP2996164A1 (en) 2016-03-16
US20160087178A1 (en) 2016-03-24
CN105210201A (zh) 2015-12-30
KR102085888B1 (ko) 2020-03-06
EP2996164A4 (en) 2016-11-30
WO2014181996A1 (ko) 2014-11-13

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