JP2016523442A5 - - Google Patents

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JP2016523442A5
JP2016523442A5 JP2016524299A JP2016524299A JP2016523442A5 JP 2016523442 A5 JP2016523442 A5 JP 2016523442A5 JP 2016524299 A JP2016524299 A JP 2016524299A JP 2016524299 A JP2016524299 A JP 2016524299A JP 2016523442 A5 JP2016523442 A5 JP 2016523442A5
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JP2016523442A (ja
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Priority claimed from PCT/US2014/044954 external-priority patent/WO2014210613A1/en
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Publication of JP2016523442A5 publication Critical patent/JP2016523442A5/ja
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JP2016524299A 2013-06-29 2014-06-30 高性能コーティングの堆積方法及びカプセル化電子デバイス Pending JP2016523442A (ja)

Applications Claiming Priority (5)

Application Number Priority Date Filing Date Title
US201361841287P 2013-06-29 2013-06-29
US61/841,287 2013-06-29
US201461976420P 2014-04-07 2014-04-07
US61/976,420 2014-04-07
PCT/US2014/044954 WO2014210613A1 (en) 2013-06-29 2014-06-30 Method for deposition of high-performance coatings and encapsulated electronic devices

Related Child Applications (1)

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JP2016000447A Division JP6370816B2 (ja) 2013-06-29 2016-01-05 高性能コーティングの堆積装置

Publications (2)

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JP2016523442A JP2016523442A (ja) 2016-08-08
JP2016523442A5 true JP2016523442A5 (enExample) 2016-09-23

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JP2016524299A Pending JP2016523442A (ja) 2013-06-29 2014-06-30 高性能コーティングの堆積方法及びカプセル化電子デバイス
JP2016000447A Active JP6370816B2 (ja) 2013-06-29 2016-01-05 高性能コーティングの堆積装置

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JP2016000447A Active JP6370816B2 (ja) 2013-06-29 2016-01-05 高性能コーティングの堆積装置

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US (1) US9831466B2 (enExample)
EP (1) EP3014675B1 (enExample)
JP (2) JP2016523442A (enExample)
KR (2) KR101772135B1 (enExample)
CN (2) CN105720207B (enExample)
WO (1) WO2014210613A1 (enExample)

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