JP2016507870A - バッテリー保護装置の製造方法、及びバッテリー保護装置 - Google Patents
バッテリー保護装置の製造方法、及びバッテリー保護装置 Download PDFInfo
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- JP2016507870A JP2016507870A JP2015552598A JP2015552598A JP2016507870A JP 2016507870 A JP2016507870 A JP 2016507870A JP 2015552598 A JP2015552598 A JP 2015552598A JP 2015552598 A JP2015552598 A JP 2015552598A JP 2016507870 A JP2016507870 A JP 2016507870A
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- pcb
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- battery protection
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01M—PROCESSES OR MEANS, e.g. BATTERIES, FOR THE DIRECT CONVERSION OF CHEMICAL ENERGY INTO ELECTRICAL ENERGY
- H01M10/00—Secondary cells; Manufacture thereof
- H01M10/42—Methods or arrangements for servicing or maintenance of secondary cells or secondary half-cells
- H01M10/425—Structural combination with electronic components, e.g. electronic circuits integrated to the outside of the casing
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01M—PROCESSES OR MEANS, e.g. BATTERIES, FOR THE DIRECT CONVERSION OF CHEMICAL ENERGY INTO ELECTRICAL ENERGY
- H01M10/00—Secondary cells; Manufacture thereof
- H01M10/42—Methods or arrangements for servicing or maintenance of secondary cells or secondary half-cells
- H01M10/425—Structural combination with electronic components, e.g. electronic circuits integrated to the outside of the casing
- H01M10/4257—Smart batteries, e.g. electronic circuits inside the housing of the cells or batteries
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/46—Manufacturing multilayer circuits
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/46—Manufacturing multilayer circuits
- H05K3/4602—Manufacturing multilayer circuits characterized by a special circuit board as base or central core whereon additional circuit layers are built or additional circuit boards are laminated
- H05K3/4608—Manufacturing multilayer circuits characterized by a special circuit board as base or central core whereon additional circuit layers are built or additional circuit boards are laminated comprising an electrically conductive base or core
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01M—PROCESSES OR MEANS, e.g. BATTERIES, FOR THE DIRECT CONVERSION OF CHEMICAL ENERGY INTO ELECTRICAL ENERGY
- H01M2200/00—Safety devices for primary or secondary batteries
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01M—PROCESSES OR MEANS, e.g. BATTERIES, FOR THE DIRECT CONVERSION OF CHEMICAL ENERGY INTO ELECTRICAL ENERGY
- H01M2200/00—Safety devices for primary or secondary batteries
- H01M2200/10—Temperature sensitive devices
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01M—PROCESSES OR MEANS, e.g. BATTERIES, FOR THE DIRECT CONVERSION OF CHEMICAL ENERGY INTO ELECTRICAL ENERGY
- H01M2200/00—Safety devices for primary or secondary batteries
- H01M2200/10—Temperature sensitive devices
- H01M2200/108—Normal resistors
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/03—Use of materials for the substrate
- H05K1/05—Insulated conductive substrates, e.g. insulated metal substrate
- H05K1/053—Insulated conductive substrates, e.g. insulated metal substrate the metal substrate being covered by an inorganic insulating layer
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/14—Structural association of two or more printed circuits
- H05K1/144—Stacked arrangements of planar printed circuit boards
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/04—Assemblies of printed circuits
- H05K2201/041—Stacked PCBs, i.e. having neither an empty space nor mounted components in between
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
- H05K3/4038—Through-connections; Vertical interconnect access [VIA] connections
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
- Y02E60/00—Enabling technologies; Technologies with a potential or indirect contribution to GHG emissions mitigation
- Y02E60/10—Energy storage using batteries
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- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Chemical & Material Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Electrochemistry (AREA)
- General Chemical & Material Sciences (AREA)
- Battery Mounting, Suspending (AREA)
- Connection Of Batteries Or Terminals (AREA)
Abstract
Description
12:貫通孔
20:金属製スペーサ
22、26:水平延長部
24:垂直延長部
30:回路素子
32:サーミスタ
40:バッテリーセル
50:合成樹脂製機構物
100:PCB上板
110:合成樹脂板材
110:金属薄膜
200:スペーサ用金属板
210:絶縁孔
220:折り曲げ部
222:垂直延長部
224:水平延長部
300:PCB上板
310:合成樹脂板材
320:金属薄膜
400:接着剤
500、510:鍍金体
Claims (9)
- 上面に金属薄膜が形成されたPCB上板と、下面に金属薄膜が形成されたPCB下板と、少なくとも一側が前記PCB上板及び前記PCB下板の側面に突き出され、少なくとも一つの絶縁孔が形成されているスペーサ用金属板とを準備するステップaと、
前記スペーサ用金属板を介在させたままで、前記PCB上板と前記PCB下板とを接合するステップbと、
前記PCB上板と前記PCB下板に回路パターンを形成するステップcと、
前記絶縁孔より小さく、前記PCB上板と前記PCB下板との両方を貫通する貫通孔を形成し、前記貫通孔を通じて前記PCB上板と前記PCB下板とを電気的に接続させるステップdと、
前記スペーサ用金属板が露出されるように、前記PCB上板に露出孔を形成し、前記露出孔を通じて前記スペーサ用金属板と前記PCB上板とを電気的に接続させるステップeと、
前記スペーサ用金属板の前記突出部を2段折り曲げし、垂直延長部と水平延長部を形成するステップfと、を含めて構成される、バッテリー保護装置の製造方法。 - 前記ステップdにおいては、前記PCB下板の回路接続点と、前記PCB上板の少なくとも「P+」端子、「P−」端子、及び「CF」端子を電気的に接続させることを特徴とする、請求項1に記載のバッテリー保護装置の製造方法。
- 前記ステップeにおいては、前記PCB上板の「P+」端子と前記スペーサ用金属板とを電気的に接続させることを特徴とする、請求項1に記載のバッテリー保護装置の製造方法。
- 前記ステップbは、絶縁材質の接着剤または接着シートによって構成され、前記ステップbの以降に、前記接着剤または接着シートによって前記絶縁孔の内部が充填されることを特徴とする、請求項1から3までの何れか1項に記載のバッテリー保護装置の製造方法。
- 前記スペーサ用金属板は、表面がニッケル鍍金されたアルミニウム、銅、リン青銅、またはベリリウム銅板材で構成されるか、或いは、アルミニウム、銅、リン青銅、ベリリウム銅、またはニッケル板材で構成されることを特徴とする、請求項3に記載のバッテリー保護装置の製造方法。
- 前記スペーサ用金属板は、左右の2個部分に分離され、前記分離された部位の空間は絶縁材質で充填されることを特徴とする、請求項3に記載のバッテリー保護装置の製造方法。
- 上面に回路パターンが形成されているPCB上板と、
前記PCB上板の下部に接合され、前記PCB上板の少なくとも一側に突き出され、垂直延長部と水平延長部が形成されているスペーサ用金属板と、
下面に回路パターンが形成されており、前記スペーサ用金属板の下部に接合されるPCB下板と、を含めて構成され、
前記スペーサ用金属板には絶縁孔が形成されており、前記PCB上板と前記PCB下板は、前記PCB上板と前記PCB下板を貫通し、前記絶縁孔より小さな貫通孔を通じて電気的に接続され、前記PCB上板と前記スペーサ用金属板は前記露出孔によって電気的に接続されているバッテリー保護装置。 - 前記PCB下板は、前記PCB上板の少なくとも「P+」端子、「P−」端子、及び「CF」端子と、前記貫通孔を通じて連結されることを特徴とする、請求項7に記載のバッテリー保護装置。
- 前記PCB上板の「P+」端子は、前記露出孔を通じて前記スペーサ用金属板と電気的に接続されることを特徴とする、請求項7または8に記載のバッテリー保護装置。
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
KR1020130040425A KR101411584B1 (ko) | 2013-04-12 | 2013-04-12 | 배터리 보호 장치 제조 방법 및 배터리 보호 장치 |
KR10-2013-0040425 | 2013-04-12 | ||
PCT/KR2014/002652 WO2014168363A1 (ko) | 2013-04-12 | 2014-03-28 | 배터리 보호 장치 제조 방법 및 배터리 보호 장치 |
Publications (2)
Publication Number | Publication Date |
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JP2016507870A true JP2016507870A (ja) | 2016-03-10 |
JP6067883B2 JP6067883B2 (ja) | 2017-01-25 |
Family
ID=51134176
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
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JP2015552598A Expired - Fee Related JP6067883B2 (ja) | 2013-04-12 | 2014-03-28 | バッテリー保護装置の製造方法、及びバッテリー保護装置 |
Country Status (5)
Country | Link |
---|---|
US (1) | US10164238B2 (ja) |
JP (1) | JP6067883B2 (ja) |
KR (1) | KR101411584B1 (ja) |
CN (1) | CN104937744B (ja) |
WO (1) | WO2014168363A1 (ja) |
Families Citing this family (8)
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KR101652904B1 (ko) * | 2016-01-14 | 2016-08-31 | 주식회사 엠디엠 | 전력반도체 모듈 패키지와 pcb의 방열을 위한 대전력 다층 pcb 및 그 제조 방법 |
KR101819033B1 (ko) | 2016-08-05 | 2018-01-17 | (주)티이에스 | 배터리 보호 장치 제조 방법 |
KR102088976B1 (ko) | 2017-09-25 | 2020-03-13 | 주식회사 엘지화학 | 접속 슬롯부를 구비한 이차전지 팩 |
KR102483624B1 (ko) * | 2018-01-10 | 2023-01-02 | 삼성전기주식회사 | 인쇄회로기판 및 이를 포함하는 배터리 모듈 |
KR102002848B1 (ko) | 2018-01-15 | 2019-07-24 | (주)티이에스 | Mipcm 검사 장치 |
CN109037784A (zh) * | 2018-07-20 | 2018-12-18 | 深圳市鑫成泰科技有限公司 | 一种用于热压化成夹具的pcb板调整装置 |
KR20200014008A (ko) | 2018-07-31 | 2020-02-10 | (주)티이에스 | 인쇄회로기판 제조 방법 및 이에 의해 생성된 인쇄회로기판 |
KR20200144286A (ko) | 2019-06-18 | 2020-12-29 | 김영대 | 고방열 pcb 제조 방법 및 이에 의해 제조된 고방열 pcb |
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2013
- 2013-04-12 KR KR1020130040425A patent/KR101411584B1/ko active IP Right Grant
-
2014
- 2014-03-28 WO PCT/KR2014/002652 patent/WO2014168363A1/ko active Application Filing
- 2014-03-28 US US14/759,197 patent/US10164238B2/en not_active Expired - Fee Related
- 2014-03-28 JP JP2015552598A patent/JP6067883B2/ja not_active Expired - Fee Related
- 2014-03-28 CN CN201480002622.6A patent/CN104937744B/zh not_active Expired - Fee Related
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Also Published As
Publication number | Publication date |
---|---|
JP6067883B2 (ja) | 2017-01-25 |
CN104937744B (zh) | 2018-01-26 |
CN104937744A (zh) | 2015-09-23 |
US10164238B2 (en) | 2018-12-25 |
WO2014168363A1 (ko) | 2014-10-16 |
KR101411584B1 (ko) | 2014-06-24 |
US20160133911A1 (en) | 2016-05-12 |
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