JP2016225343A - 半導体装置 - Google Patents
半導体装置 Download PDFInfo
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- JP2016225343A JP2016225343A JP2015107287A JP2015107287A JP2016225343A JP 2016225343 A JP2016225343 A JP 2016225343A JP 2015107287 A JP2015107287 A JP 2015107287A JP 2015107287 A JP2015107287 A JP 2015107287A JP 2016225343 A JP2016225343 A JP 2016225343A
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- 239000004065 semiconductor Substances 0.000 title claims abstract description 122
- 239000000758 substrate Substances 0.000 claims abstract description 78
- 210000000746 body region Anatomy 0.000 claims description 25
- HBMJWWWQQXIZIP-UHFFFAOYSA-N silicon carbide Chemical group [Si+]#[C-] HBMJWWWQQXIZIP-UHFFFAOYSA-N 0.000 claims description 10
- 229910010271 silicon carbide Inorganic materials 0.000 claims description 9
- 239000012535 impurity Substances 0.000 claims description 8
- 239000000463 material Substances 0.000 claims description 5
- 238000000034 method Methods 0.000 description 16
- 239000002344 surface layer Substances 0.000 description 10
- 230000005684 electric field Effects 0.000 description 7
- 238000005468 ion implantation Methods 0.000 description 5
- 229910052782 aluminium Inorganic materials 0.000 description 4
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 4
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 3
- 239000010410 layer Substances 0.000 description 3
- 230000004048 modification Effects 0.000 description 3
- 238000012986 modification Methods 0.000 description 3
- 229910052814 silicon oxide Inorganic materials 0.000 description 3
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 description 2
- 230000004888 barrier function Effects 0.000 description 2
- 239000012141 concentrate Substances 0.000 description 2
- 239000013078 crystal Substances 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- OAICVXFJPJFONN-UHFFFAOYSA-N Phosphorus Chemical compound [P] OAICVXFJPJFONN-UHFFFAOYSA-N 0.000 description 1
- 239000000969 carrier Substances 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 230000005669 field effect Effects 0.000 description 1
- 239000011229 interlayer Substances 0.000 description 1
- 229910044991 metal oxide Inorganic materials 0.000 description 1
- 150000004706 metal oxides Chemical class 0.000 description 1
- 229910052757 nitrogen Inorganic materials 0.000 description 1
- 229910052698 phosphorus Inorganic materials 0.000 description 1
- 239000011574 phosphorus Substances 0.000 description 1
- 229910021420 polycrystalline silicon Inorganic materials 0.000 description 1
- 229920005591 polysilicon Polymers 0.000 description 1
- 229910052710 silicon Inorganic materials 0.000 description 1
- 239000010703 silicon Substances 0.000 description 1
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L29/00—Semiconductor devices adapted for rectifying, amplifying, oscillating or switching, or capacitors or resistors with at least one potential-jump barrier or surface barrier, e.g. PN junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
- H01L29/02—Semiconductor bodies ; Multistep manufacturing processes therefor
- H01L29/06—Semiconductor bodies ; Multistep manufacturing processes therefor characterised by their shape; characterised by the shapes, relative sizes, or dispositions of the semiconductor regions ; characterised by the concentration or distribution of impurities within semiconductor regions
- H01L29/10—Semiconductor bodies ; Multistep manufacturing processes therefor characterised by their shape; characterised by the shapes, relative sizes, or dispositions of the semiconductor regions ; characterised by the concentration or distribution of impurities within semiconductor regions with semiconductor regions connected to an electrode not carrying current to be rectified, amplified or switched and such electrode being part of a semiconductor device which comprises three or more electrodes
- H01L29/107—Substrate region of field-effect devices
- H01L29/1075—Substrate region of field-effect devices of field-effect transistors
- H01L29/1079—Substrate region of field-effect devices of field-effect transistors with insulated gate
- H01L29/1083—Substrate region of field-effect devices of field-effect transistors with insulated gate with an inactive supplementary region, e.g. for preventing punch-through, improving capacity effect or leakage current
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L29/00—Semiconductor devices adapted for rectifying, amplifying, oscillating or switching, or capacitors or resistors with at least one potential-jump barrier or surface barrier, e.g. PN junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
- H01L29/40—Electrodes ; Multistep manufacturing processes therefor
- H01L29/41—Electrodes ; Multistep manufacturing processes therefor characterised by their shape, relative sizes or dispositions
- H01L29/423—Electrodes ; Multistep manufacturing processes therefor characterised by their shape, relative sizes or dispositions not carrying the current to be rectified, amplified or switched
- H01L29/42312—Gate electrodes for field effect devices
- H01L29/42316—Gate electrodes for field effect devices for field-effect transistors
- H01L29/4232—Gate electrodes for field effect devices for field-effect transistors with insulated gate
- H01L29/42364—Gate electrodes for field effect devices for field-effect transistors with insulated gate characterised by the insulating layer, e.g. thickness or uniformity
- H01L29/42368—Gate electrodes for field effect devices for field-effect transistors with insulated gate characterised by the insulating layer, e.g. thickness or uniformity the thickness being non-uniform
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L29/00—Semiconductor devices adapted for rectifying, amplifying, oscillating or switching, or capacitors or resistors with at least one potential-jump barrier or surface barrier, e.g. PN junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
- H01L29/66—Types of semiconductor device ; Multistep manufacturing processes therefor
- H01L29/68—Types of semiconductor device ; Multistep manufacturing processes therefor controllable by only the electric current supplied, or only the electric potential applied, to an electrode which does not carry the current to be rectified, amplified or switched
- H01L29/76—Unipolar devices, e.g. field effect transistors
- H01L29/772—Field effect transistors
- H01L29/78—Field effect transistors with field effect produced by an insulated gate
- H01L29/7801—DMOS transistors, i.e. MISFETs with a channel accommodating body or base region adjoining a drain drift region
- H01L29/7802—Vertical DMOS transistors, i.e. VDMOS transistors
- H01L29/7811—Vertical DMOS transistors, i.e. VDMOS transistors with an edge termination structure
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L29/00—Semiconductor devices adapted for rectifying, amplifying, oscillating or switching, or capacitors or resistors with at least one potential-jump barrier or surface barrier, e.g. PN junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
- H01L29/66—Types of semiconductor device ; Multistep manufacturing processes therefor
- H01L29/68—Types of semiconductor device ; Multistep manufacturing processes therefor controllable by only the electric current supplied, or only the electric potential applied, to an electrode which does not carry the current to be rectified, amplified or switched
- H01L29/76—Unipolar devices, e.g. field effect transistors
- H01L29/772—Field effect transistors
- H01L29/78—Field effect transistors with field effect produced by an insulated gate
- H01L29/7801—DMOS transistors, i.e. MISFETs with a channel accommodating body or base region adjoining a drain drift region
- H01L29/7802—Vertical DMOS transistors, i.e. VDMOS transistors
- H01L29/7813—Vertical DMOS transistors, i.e. VDMOS transistors with trench gate electrode, e.g. UMOS transistors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L29/00—Semiconductor devices adapted for rectifying, amplifying, oscillating or switching, or capacitors or resistors with at least one potential-jump barrier or surface barrier, e.g. PN junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
- H01L29/02—Semiconductor bodies ; Multistep manufacturing processes therefor
- H01L29/06—Semiconductor bodies ; Multistep manufacturing processes therefor characterised by their shape; characterised by the shapes, relative sizes, or dispositions of the semiconductor regions ; characterised by the concentration or distribution of impurities within semiconductor regions
- H01L29/10—Semiconductor bodies ; Multistep manufacturing processes therefor characterised by their shape; characterised by the shapes, relative sizes, or dispositions of the semiconductor regions ; characterised by the concentration or distribution of impurities within semiconductor regions with semiconductor regions connected to an electrode not carrying current to be rectified, amplified or switched and such electrode being part of a semiconductor device which comprises three or more electrodes
- H01L29/1095—Body region, i.e. base region, of DMOS transistors or IGBTs
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L29/00—Semiconductor devices adapted for rectifying, amplifying, oscillating or switching, or capacitors or resistors with at least one potential-jump barrier or surface barrier, e.g. PN junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
- H01L29/02—Semiconductor bodies ; Multistep manufacturing processes therefor
- H01L29/12—Semiconductor bodies ; Multistep manufacturing processes therefor characterised by the materials of which they are formed
- H01L29/16—Semiconductor bodies ; Multistep manufacturing processes therefor characterised by the materials of which they are formed including, apart from doping materials or other impurities, only elements of Group IV of the Periodic System
- H01L29/1608—Silicon carbide
Abstract
Description
11:ドレイン領域
12:ドリフト領域
13:ボディ領域
14:ボディコンタクト領域
15:ソース領域
16:上面領域
17:高濃度上面領域
20:トレンチゲート
22:ゲート絶縁膜
24:ゲート電極
Claims (6)
- 半導体基板と、
前記半導体基板の上面から深部に向けて伸びるトレンチゲートと、を備え、
前記半導体基板は、
前記トレンチゲートに接する第1導電型のドリフト領域と、
前記ドリフト領域上に設けられており、前記トレンチゲートに接する第2導電型のボディ領域と、
前記ボディ領域上に設けられており、前記半導体基板の前記上面に露出しており、前記トレンチゲートに接する第1導電型のソース領域と、
前記ソース領域上に設けられており、前記半導体基板の前記上面に露出しており、前記トレンチゲートに接する第2導電型の上面領域と、を有する半導体装置。 - 前記上面領域は、前記半導体基板の前記上面に直交する方向から観測したときに、前記トレンチゲートの長手方向に平行な側面に接する、請求項1に記載の半導体装置。
- 前記上面領域はさらに、前記半導体基板の前記上面に直交する方向から観測したときに、前記トレンチゲートの前記長手方向の端部を取り囲むように設けられている、請求項2に記載の半導体装置。
- 前記半導体基板の前記上面に露出しており、前記上面領域よりも不純物濃度が濃い第2導電型の高濃度上面領域をさらに備え、
前記高濃度上面領域は、前記半導体基板の前記上面に直交する方向から観測したときに、前記トレンチゲートの前記長手方向の端部において、前記長手方向に平行な一対の側面を結ぶ端部側面に接する、請求項3に記載の半導体装置。 - 前記トレンチゲートは、
ゲート絶縁膜と、
前記ゲート絶縁膜で被覆されるゲート電極と、を有し、
前記ゲート絶縁膜は、前記上面領域及び前記ソース領域と接する部分の膜厚が、前記ボディ領域と接する部分の膜厚よりも厚い、請求項1〜4のいずれか一項に記載の半導体装置。 - 前記半導体基板の材料が炭化珪素である、請求項1〜5のいずれか一項に記載の半導体装置。
Priority Applications (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2015107287A JP6514035B2 (ja) | 2015-05-27 | 2015-05-27 | 半導体装置 |
US15/157,865 US10068972B2 (en) | 2015-05-27 | 2016-05-18 | Semiconductor device with opposite conductivity-type impurity regions between source and trench gate for reducing leakage |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
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JP2015107287A JP6514035B2 (ja) | 2015-05-27 | 2015-05-27 | 半導体装置 |
Publications (2)
Publication Number | Publication Date |
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JP2016225343A true JP2016225343A (ja) | 2016-12-28 |
JP6514035B2 JP6514035B2 (ja) | 2019-05-15 |
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JP2015107287A Active JP6514035B2 (ja) | 2015-05-27 | 2015-05-27 | 半導体装置 |
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US (1) | US10068972B2 (ja) |
JP (1) | JP6514035B2 (ja) |
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2017126472A1 (ja) * | 2016-01-20 | 2017-07-27 | ローム株式会社 | 半導体装置 |
WO2020036015A1 (ja) * | 2018-08-14 | 2020-02-20 | 富士電機株式会社 | 半導体装置および製造方法 |
JP2020077800A (ja) * | 2018-11-08 | 2020-05-21 | 富士電機株式会社 | 半導体装置 |
Families Citing this family (2)
Publication number | Priority date | Publication date | Assignee | Title |
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TWI739252B (zh) * | 2019-12-25 | 2021-09-11 | 杰力科技股份有限公司 | 溝槽式mosfet元件及其製造方法 |
CN115347039B (zh) * | 2022-10-14 | 2023-01-17 | 强元芯电子(广东)有限公司 | 一种低功耗半导体功率器件 |
Citations (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US20070075362A1 (en) * | 2005-09-30 | 2007-04-05 | Ching-Yuan Wu | Self-aligned schottky-barrier clamped trench DMOS transistor structure and its manufacturing methods |
JP2009094484A (ja) * | 2007-09-20 | 2009-04-30 | Rohm Co Ltd | 半導体装置および半導体装置の製造方法 |
JP2012160601A (ja) * | 2011-02-01 | 2012-08-23 | Toshiba Corp | 半導体装置の製造方法 |
JP2012238834A (ja) * | 2011-04-12 | 2012-12-06 | Denso Corp | 半導体装置の製造方法及び半導体装置 |
WO2013118437A1 (ja) * | 2012-02-10 | 2013-08-15 | パナソニック株式会社 | 半導体装置及びその製造方法 |
WO2013118203A1 (ja) * | 2012-02-10 | 2013-08-15 | パナソニック株式会社 | 半導体装置及びその製造方法 |
WO2013187019A1 (ja) * | 2012-06-14 | 2013-12-19 | 株式会社デンソー | 炭化珪素半導体装置およびその製造方法 |
JP2014038966A (ja) * | 2012-08-17 | 2014-02-27 | Rohm Co Ltd | 半導体装置 |
Family Cites Families (23)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5448083A (en) * | 1991-08-08 | 1995-09-05 | Kabushiki Kaisha Toshiba | Insulated-gate semiconductor device |
US5554862A (en) * | 1992-03-31 | 1996-09-10 | Kabushiki Kaisha Toshiba | Power semiconductor device |
US5689128A (en) * | 1995-08-21 | 1997-11-18 | Siliconix Incorporated | High density trenched DMOS transistor |
DE19845003C1 (de) * | 1998-09-30 | 2000-02-10 | Siemens Ag | Vertikaler Feldeffekttransistor mit innenliegendem ringförmigen Gate und Herstellverfahren |
US7084456B2 (en) * | 1999-05-25 | 2006-08-01 | Advanced Analogic Technologies, Inc. | Trench MOSFET with recessed clamping diode using graded doping |
US6291298B1 (en) * | 1999-05-25 | 2001-09-18 | Advanced Analogic Technologies, Inc. | Process of manufacturing Trench gate semiconductor device having gate oxide layer with multiple thicknesses |
US7345342B2 (en) * | 2001-01-30 | 2008-03-18 | Fairchild Semiconductor Corporation | Power semiconductor devices and methods of manufacture |
JP4073176B2 (ja) * | 2001-04-02 | 2008-04-09 | 新電元工業株式会社 | 半導体装置およびその製造方法 |
US6674124B2 (en) * | 2001-11-15 | 2004-01-06 | General Semiconductor, Inc. | Trench MOSFET having low gate charge |
US7417266B1 (en) * | 2004-06-10 | 2008-08-26 | Qspeed Semiconductor Inc. | MOSFET having a JFET embedded as a body diode |
JP2006120789A (ja) * | 2004-10-20 | 2006-05-11 | Toshiba Corp | 半導体装置 |
US20060113588A1 (en) * | 2004-11-29 | 2006-06-01 | Sillicon-Based Technology Corp. | Self-aligned trench-type DMOS transistor structure and its manufacturing methods |
US8836015B2 (en) * | 2005-02-11 | 2014-09-16 | Alpha And Omega Semiconductor Incorporated | Planar SRFET using no additional masks and layout method |
US8384152B2 (en) * | 2007-09-20 | 2013-02-26 | Rohm Co., Ltd. | Semiconductor device having trench gate VDMOSFET and method of manufacturing the same |
JPWO2010109572A1 (ja) * | 2009-03-23 | 2012-09-20 | トヨタ自動車株式会社 | 半導体装置 |
US8373224B2 (en) * | 2009-12-28 | 2013-02-12 | Force Mos Technology Co., Ltd. | Super-junction trench MOSFET with resurf stepped oxides and trenched contacts |
JP5136578B2 (ja) * | 2010-03-09 | 2013-02-06 | トヨタ自動車株式会社 | 半導体装置 |
WO2012169022A1 (ja) * | 2011-06-08 | 2012-12-13 | トヨタ自動車株式会社 | 半導体装置とその製造方法 |
JP5894383B2 (ja) | 2011-06-30 | 2016-03-30 | ローム株式会社 | 半導体装置およびその製造方法 |
US8785278B2 (en) * | 2012-02-02 | 2014-07-22 | Alpha And Omega Semiconductor Incorporated | Nano MOSFET with trench bottom oxide shielded and third dimensional P-body contact |
US9306047B2 (en) * | 2012-10-05 | 2016-04-05 | Hitachi, Ltd. | Semiconductor device and electric power converter in which same is used |
CN104838500B (zh) * | 2012-12-04 | 2017-08-15 | 株式会社电装 | 半导体装置及其制造方法 |
JP6102354B2 (ja) * | 2013-03-06 | 2017-03-29 | トヨタ自動車株式会社 | 逆導通igbt |
-
2015
- 2015-05-27 JP JP2015107287A patent/JP6514035B2/ja active Active
-
2016
- 2016-05-18 US US15/157,865 patent/US10068972B2/en active Active
Patent Citations (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US20070075362A1 (en) * | 2005-09-30 | 2007-04-05 | Ching-Yuan Wu | Self-aligned schottky-barrier clamped trench DMOS transistor structure and its manufacturing methods |
JP2009094484A (ja) * | 2007-09-20 | 2009-04-30 | Rohm Co Ltd | 半導体装置および半導体装置の製造方法 |
JP2012160601A (ja) * | 2011-02-01 | 2012-08-23 | Toshiba Corp | 半導体装置の製造方法 |
JP2012238834A (ja) * | 2011-04-12 | 2012-12-06 | Denso Corp | 半導体装置の製造方法及び半導体装置 |
WO2013118437A1 (ja) * | 2012-02-10 | 2013-08-15 | パナソニック株式会社 | 半導体装置及びその製造方法 |
WO2013118203A1 (ja) * | 2012-02-10 | 2013-08-15 | パナソニック株式会社 | 半導体装置及びその製造方法 |
WO2013187019A1 (ja) * | 2012-06-14 | 2013-12-19 | 株式会社デンソー | 炭化珪素半導体装置およびその製造方法 |
JP2014038966A (ja) * | 2012-08-17 | 2014-02-27 | Rohm Co Ltd | 半導体装置 |
Cited By (9)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2017126472A1 (ja) * | 2016-01-20 | 2017-07-27 | ローム株式会社 | 半導体装置 |
JPWO2017126472A1 (ja) * | 2016-01-20 | 2018-11-08 | ローム株式会社 | 半導体装置 |
US10804388B2 (en) | 2016-01-20 | 2020-10-13 | Rohm Co., Ltd. | Semiconductor device |
DE112017000441B4 (de) | 2016-01-20 | 2023-03-09 | Rohm Co., Ltd. | Halbleiterbauteil |
WO2020036015A1 (ja) * | 2018-08-14 | 2020-02-20 | 富士電機株式会社 | 半導体装置および製造方法 |
JPWO2020036015A1 (ja) * | 2018-08-14 | 2021-02-15 | 富士電機株式会社 | 半導体装置および製造方法 |
US11901443B2 (en) | 2018-08-14 | 2024-02-13 | Fuji Electric Co., Ltd. | Semiconductor device and manufacturing method |
JP2020077800A (ja) * | 2018-11-08 | 2020-05-21 | 富士電機株式会社 | 半導体装置 |
JP7326725B2 (ja) | 2018-11-08 | 2023-08-16 | 富士電機株式会社 | 半導体装置 |
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US20160351665A1 (en) | 2016-12-01 |
US10068972B2 (en) | 2018-09-04 |
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