JP2016085993A - 電気的な接続素子を備えているガラス板 - Google Patents
電気的な接続素子を備えているガラス板 Download PDFInfo
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- 239000011521 glass Substances 0.000 title claims abstract description 132
- 229910000679 solder Inorganic materials 0.000 claims abstract description 122
- 239000000463 material Substances 0.000 claims abstract description 104
- 239000000758 substrate Substances 0.000 claims abstract description 29
- VYZAMTAEIAYCRO-UHFFFAOYSA-N Chromium Chemical compound [Cr] VYZAMTAEIAYCRO-UHFFFAOYSA-N 0.000 claims abstract description 25
- 229910052804 chromium Inorganic materials 0.000 claims abstract description 25
- 239000011651 chromium Substances 0.000 claims abstract description 25
- 229910000831 Steel Inorganic materials 0.000 claims abstract description 21
- 239000010959 steel Substances 0.000 claims abstract description 21
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 claims description 34
- 229910052709 silver Inorganic materials 0.000 claims description 30
- 239000004332 silver Substances 0.000 claims description 30
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 claims description 27
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 claims description 24
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 19
- 239000010949 copper Substances 0.000 claims description 18
- 229910052802 copper Inorganic materials 0.000 claims description 18
- RTAQQCXQSZGOHL-UHFFFAOYSA-N Titanium Chemical compound [Ti] RTAQQCXQSZGOHL-UHFFFAOYSA-N 0.000 claims description 17
- 239000000203 mixture Substances 0.000 claims description 17
- 229910052759 nickel Inorganic materials 0.000 claims description 17
- 239000010936 titanium Substances 0.000 claims description 17
- 229910052719 titanium Inorganic materials 0.000 claims description 17
- 239000004020 conductor Substances 0.000 claims description 13
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 claims description 12
- 229910052742 iron Inorganic materials 0.000 claims description 12
- 229910052718 tin Inorganic materials 0.000 claims description 12
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 claims description 10
- 229910052799 carbon Inorganic materials 0.000 claims description 10
- 238000010438 heat treatment Methods 0.000 claims description 9
- WPBNNNQJVZRUHP-UHFFFAOYSA-L manganese(2+);methyl n-[[2-(methoxycarbonylcarbamothioylamino)phenyl]carbamothioyl]carbamate;n-[2-(sulfidocarbothioylamino)ethyl]carbamodithioate Chemical compound [Mn+2].[S-]C(=S)NCCNC([S-])=S.COC(=O)NC(=S)NC1=CC=CC=C1NC(=S)NC(=O)OC WPBNNNQJVZRUHP-UHFFFAOYSA-L 0.000 claims description 9
- HCHKCACWOHOZIP-UHFFFAOYSA-N Zinc Chemical compound [Zn] HCHKCACWOHOZIP-UHFFFAOYSA-N 0.000 claims description 8
- 229910052797 bismuth Inorganic materials 0.000 claims description 8
- JCXGWMGPZLAOME-UHFFFAOYSA-N bismuth atom Chemical compound [Bi] JCXGWMGPZLAOME-UHFFFAOYSA-N 0.000 claims description 8
- 229910052725 zinc Inorganic materials 0.000 claims description 8
- 239000011701 zinc Substances 0.000 claims description 8
- ZOKXTWBITQBERF-UHFFFAOYSA-N Molybdenum Chemical compound [Mo] ZOKXTWBITQBERF-UHFFFAOYSA-N 0.000 claims description 7
- 229910052738 indium Inorganic materials 0.000 claims description 7
- APFVFJFRJDLVQX-UHFFFAOYSA-N indium atom Chemical compound [In] APFVFJFRJDLVQX-UHFFFAOYSA-N 0.000 claims description 7
- 229910052750 molybdenum Inorganic materials 0.000 claims description 7
- 239000011733 molybdenum Substances 0.000 claims description 7
- -1 polyethylene Polymers 0.000 claims description 6
- 239000005361 soda-lime glass Substances 0.000 claims description 4
- 239000011135 tin Substances 0.000 claims description 4
- 239000004698 Polyethylene Substances 0.000 claims description 3
- 239000004743 Polypropylene Substances 0.000 claims description 3
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 claims description 3
- 239000005388 borosilicate glass Substances 0.000 claims description 3
- 239000005357 flat glass Substances 0.000 claims description 3
- 239000005329 float glass Substances 0.000 claims description 3
- 229920003229 poly(methyl methacrylate) Polymers 0.000 claims description 3
- 229920000515 polycarbonate Polymers 0.000 claims description 3
- 239000004417 polycarbonate Substances 0.000 claims description 3
- 229920000573 polyethylene Polymers 0.000 claims description 3
- 229920000642 polymer Polymers 0.000 claims description 3
- 239000004926 polymethyl methacrylate Substances 0.000 claims description 3
- 229920001155 polypropylene Polymers 0.000 claims description 3
- 230000035882 stress Effects 0.000 description 23
- 238000005476 soldering Methods 0.000 description 18
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 description 12
- 125000006850 spacer group Chemical group 0.000 description 12
- 238000000034 method Methods 0.000 description 11
- 238000004519 manufacturing process Methods 0.000 description 10
- 230000008569 process Effects 0.000 description 9
- 230000007704 transition Effects 0.000 description 9
- 238000003466 welding Methods 0.000 description 9
- 229910052782 aluminium Inorganic materials 0.000 description 8
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 8
- 230000006978 adaptation Effects 0.000 description 7
- 229910052758 niobium Inorganic materials 0.000 description 7
- 239000010955 niobium Substances 0.000 description 7
- GUCVJGMIXFAOAE-UHFFFAOYSA-N niobium atom Chemical compound [Nb] GUCVJGMIXFAOAE-UHFFFAOYSA-N 0.000 description 7
- 239000000654 additive Substances 0.000 description 6
- 229910052757 nitrogen Inorganic materials 0.000 description 6
- 230000008646 thermal stress Effects 0.000 description 6
- 229910052720 vanadium Inorganic materials 0.000 description 6
- LEONUFNNVUYDNQ-UHFFFAOYSA-N vanadium atom Chemical compound [V] LEONUFNNVUYDNQ-UHFFFAOYSA-N 0.000 description 6
- 230000008901 benefit Effects 0.000 description 5
- 229910045601 alloy Inorganic materials 0.000 description 4
- 239000000956 alloy Substances 0.000 description 4
- 230000015572 biosynthetic process Effects 0.000 description 4
- 238000000151 deposition Methods 0.000 description 4
- 238000009826 distribution Methods 0.000 description 4
- 239000005349 heatable glass Substances 0.000 description 4
- 230000005499 meniscus Effects 0.000 description 4
- 230000000052 comparative effect Effects 0.000 description 3
- 230000007797 corrosion Effects 0.000 description 3
- 238000005260 corrosion Methods 0.000 description 3
- 239000007789 gas Substances 0.000 description 3
- 238000003892 spreading Methods 0.000 description 3
- 230000007480 spreading Effects 0.000 description 3
- 206010011906 Death Diseases 0.000 description 2
- PWHULOQIROXLJO-UHFFFAOYSA-N Manganese Chemical compound [Mn] PWHULOQIROXLJO-UHFFFAOYSA-N 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 238000003754 machining Methods 0.000 description 2
- 229910052748 manganese Inorganic materials 0.000 description 2
- 239000011572 manganese Substances 0.000 description 2
- 229910052751 metal Inorganic materials 0.000 description 2
- 239000002184 metal Substances 0.000 description 2
- 239000002245 particle Substances 0.000 description 2
- 238000009736 wetting Methods 0.000 description 2
- OAICVXFJPJFONN-UHFFFAOYSA-N Phosphorus Chemical compound [P] OAICVXFJPJFONN-UHFFFAOYSA-N 0.000 description 1
- 230000009471 action Effects 0.000 description 1
- 238000005452 bending Methods 0.000 description 1
- 229910052793 cadmium Inorganic materials 0.000 description 1
- BDOSMKKIYDKNTQ-UHFFFAOYSA-N cadmium atom Chemical compound [Cd] BDOSMKKIYDKNTQ-UHFFFAOYSA-N 0.000 description 1
- 239000011248 coating agent Substances 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- 238000010276 construction Methods 0.000 description 1
- 238000007796 conventional method Methods 0.000 description 1
- 238000002788 crimping Methods 0.000 description 1
- 238000004049 embossing Methods 0.000 description 1
- 230000007613 environmental effect Effects 0.000 description 1
- 229910052732 germanium Inorganic materials 0.000 description 1
- GNPVGFCGXDBREM-UHFFFAOYSA-N germanium atom Chemical compound [Ge] GNPVGFCGXDBREM-UHFFFAOYSA-N 0.000 description 1
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 1
- 229910052737 gold Inorganic materials 0.000 description 1
- 239000010931 gold Substances 0.000 description 1
- 231100001261 hazardous Toxicity 0.000 description 1
- 230000006698 induction Effects 0.000 description 1
- 239000007788 liquid Substances 0.000 description 1
- 230000002093 peripheral effect Effects 0.000 description 1
- 230000002085 persistent effect Effects 0.000 description 1
- 239000004033 plastic Substances 0.000 description 1
- 229920003023 plastic Polymers 0.000 description 1
- 230000035755 proliferation Effects 0.000 description 1
- 238000004080 punching Methods 0.000 description 1
- 238000000746 purification Methods 0.000 description 1
- 230000009467 reduction Effects 0.000 description 1
- 239000005336 safety glass Substances 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
- H05B3/00—Ohmic-resistance heating
- H05B3/84—Heating arrangements specially adapted for transparent or reflecting areas, e.g. for demisting or de-icing windows, mirrors or vehicle windshields
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R4/00—Electrically-conductive connections between two or more conductive members in direct contact, i.e. touching one another; Means for effecting or maintaining such contact; Electrically-conductive connections having two or more spaced connecting locations for conductors and using contact members penetrating insulation
- H01R4/58—Electrically-conductive connections between two or more conductive members in direct contact, i.e. touching one another; Means for effecting or maintaining such contact; Electrically-conductive connections having two or more spaced connecting locations for conductors and using contact members penetrating insulation characterised by the form or material of the contacting members
- H01R4/62—Connections between conductors of different materials; Connections between or with aluminium or steel-core aluminium conductors
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
- H05K3/4007—Surface contacts, e.g. bumps
- H05K3/4015—Surface contacts, e.g. bumps using auxiliary conductive elements, e.g. pieces of metal foil, metallic spheres
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R12/00—Structural associations of a plurality of mutually-insulated electrical connecting elements, specially adapted for printed circuits, e.g. printed circuit boards [PCB], flat or ribbon cables, or like generally planar structures, e.g. terminal strips, terminal blocks; Coupling devices specially adapted for printed circuits, flat or ribbon cables, or like generally planar structures; Terminals specially adapted for contact with, or insertion into, printed circuits, flat or ribbon cables, or like generally planar structures
- H01R12/50—Fixed connections
- H01R12/51—Fixed connections for rigid printed circuits or like structures
- H01R12/55—Fixed connections for rigid printed circuits or like structures characterised by the terminals
- H01R12/57—Fixed connections for rigid printed circuits or like structures characterised by the terminals surface mounting terminals
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R4/00—Electrically-conductive connections between two or more conductive members in direct contact, i.e. touching one another; Means for effecting or maintaining such contact; Electrically-conductive connections having two or more spaced connecting locations for conductors and using contact members penetrating insulation
- H01R4/02—Soldered or welded connections
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
- H05B2203/00—Aspects relating to Ohmic resistive heating covered by group H05B3/00
- H05B2203/016—Heaters using particular connecting means
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10227—Other objects, e.g. metallic pieces
- H05K2201/1028—Thin metal strips as connectors or conductors
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10227—Other objects, e.g. metallic pieces
- H05K2201/1031—Surface mounted metallic connector elements
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/04—Soldering or other types of metallurgic bonding
- H05K2203/0465—Shape of solder, e.g. differing from spherical shape, different shapes due to different solder pads
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
- H05K3/3457—Solder materials or compositions; Methods of application thereof
- H05K3/3463—Solder compositions in relation to features of the printed circuit board or the mounting process
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
- H05K3/3494—Heating methods for reflowing of solder
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
- Y02P70/50—Manufacturing or production processes characterised by the final manufactured product
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/49002—Electrical device making
- Y10T29/49117—Conductor or circuit manufacturing
- Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
- Y10T29/49128—Assembling formed circuit to base
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Connections Effected By Soldering, Adhesion, Or Permanent Deformation (AREA)
- Resistance Heating (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
- Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
- Details Of Aerials (AREA)
- Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)
- Non-Insulated Conductors (AREA)
- Laminated Bodies (AREA)
- Manufacturing Of Electrical Connectors (AREA)
- Joining Of Glass To Other Materials (AREA)
- Surface Heating Bodies (AREA)
Abstract
Description
−サブストレートと、
−サブストレートの所定の領域上の導電性の構造体と、
−少なくともクロム、有利には少なくともクロム含有鋼を含む接続素子と、
−接続素子を導電性の構造体の部分領域に電気的に接続させる、はんだ材料の層とを有している。
a)はんだ材料を、所定の層厚、体積、形状及び配置構成を有する小型のプレートとして、接続素子のコンタクト面に被着させるステップと、
b)導電性の構造体をサブストレート上に被着させるステップと、
c)接続素子をはんだ材料によって導電性の構造体上に配置するステップと、
d)接続素子を導電性の構造体にはんだ付けするステップとを備えている。
ガラス板1(厚さ3mm、幅150cm及び高さ80cm)、加熱導体構造体の形態の導電性の構造体2、図1による電気的な接続素子3、接続素子3のコンタクト面8上の銀層5及びはんだ材料4を備える試験体が作成された。接続素子3の材料厚さは0.8mmであった。接続素子3のコンタクト面8は4mmの幅及び4mmの長さを有していた。はんだ材料4を、所定の層厚、体積及び形状を有している小型のプレートとして、接続素子3のコンタクト面8上に被着させた。そのようにして被着されたはんだ材料4を用いて、接続素子3を導電性の構造体2に取り付けた。接続素子3を200℃の温度及び2秒の処理時間で導電性の構造体2にはんだ付けした。50μmの層厚tを上回っていた、電気的な接続素子3と導電性の構造体2との間の間隙からのはんだ材料4の漏れは、b=0.5mmの最大漏れ幅でしか観測されなかった。電気的な接続素子3、この接続素子3のコンタクト面8上の銀層5及びはんだ材料4の寸法及び組成は表1から見て取れる。接続素子3及び導電性の構造体2によって設定されるはんだ材料4の配置構成によって、ガラス板1において危険な機械的応力は観測されなかった。ガラス板1と電気的な接続素子3との接続部は導電性の構造体2を介して持続的に安定していた。
比較例は実施例と同様に実施された。相異点として、接続素子3に対して別の材料を使用した。接続素子3を100重量パーセントのチタンから構成した。従って、接続素子3は、比較的低い熱伝導率、比較的低い熱膨張率、及び、接続素子3の熱膨張率とサブストレート1の熱膨張率との比較的小さい差を有していた。電気的な接続素子3、この接続素子3のコンタクト面8上の金属層及びはんだ材料4の寸法及び成分は表2から見て取れる。接続素子3を、従来技術の方法に応じて、はんだ材料4を用いて導電性の構造体2にはんだ付けした。50μmの層厚tを上回っていた、電気的な接続素子3と導電性の構造体2との間の間隙からのはんだ材料4の漏れ部では、b=2mmから3mmの平均漏れ幅が得られた。接続素子のための材料の熱伝導率が比較的低いことから、この比較例では、はんだプロセス中の接続素子の均一な加熱は弱かった。
[請求項1]
少なくとも一つの電気的な接続素子を備えているガラス板において、
サブストレート(1)と、
前記サブストレート(1)の所定の領域上の導電性の構造体(2)と、
少なくともクロム含有鋼を含む接続素子(3)と、
前記接続素子(3)を前記導電性の構造体(2)の部分領域に電気的に接続させる、はんだ材料(4)の層とを有している、
ことを特徴とするガラス板。
[請求項2]
前記サブストレート(1)はガラス、有利には平板ガラス、フロートガラス、石英ガラス、ホウケイ酸ガラス、ソーダ石灰ガラス、若しくは、ポリマー、有利にはポリエチレン、ポリプロピレン、ポリカーボネート、ポリメチルメタクリレート、及び/又は、それらの混合物を含んでいる、請求項1に記載のガラス板。
[請求項3]
前記サブストレート(1)の熱膨張率と前記接続素子(3)の熱膨張率の差は5×10-6/℃未満である、請求項1又は2に記載のガラス板。
[請求項4]
前記接続素子(3)は、少なくとも50重量パーセントから89.5重量パーセントの鉄、10.5重量パーセントから20重量パーセントのクロム、0重量パーセントから1重量パーセントの炭素、0重量パーセントから5重量パーセントのニッケル、0重量パーセントから2重量パーセントのマンガン、0重量パーセントから2.5重量パーセントのモリブデン、又は、0重量パーセントから1重量パーセントのチタンを含んでいる、請求項1乃至3のいずれか一項に記載のガラス板。
[請求項5]
前記接続素子(3)は、少なくとも75重量パーセントから84重量パーセントの鉄、16重量パーセントから18.5重量パーセントのクロム、0重量パーセントから0.1重量パーセントの炭素、0重量パーセントから1重量パーセントのマンガン、又は、0重量パーセントから1重量パーセントのチタンを含んでいる、請求項4に記載のガラス板。
[請求項6]
前記導電性の構造体(2)は銀を含んでいる、請求項1乃至5のいずれか一項に記載のガラス板。
[請求項7]
前記はんだ(4)の層厚は3.0×10-4m未満である、請求項1乃至6のいずれか一項に記載のガラス板。
[請求項8]
前記はんだ材料(4)はスズ及びビスマス、インジウム、亜鉛、銅、銀又はそれらの混合物を含んでいる、請求項1乃至7のいずれか一項に記載のガラス板。
[請求項9]
前記はんだ材料(4)の組成におけるスズの割合は3重量パーセントから99.5重量パーセントであり、ビスマス、インジウム、亜鉛、銅、銀又はそれらの混合物の割合は0.5重量パーセントから97重量パーセントである、請求項8に記載のガラス板。
[請求項10]
前記接続素子(3)はニッケル、スズ、銅及び/又は銀で被覆されている、請求項1乃至9のいずれか一項に記載のガラス板。
[請求項11]
前記接続素子(3)は0.1μmから0.3μmのニッケル、及び/又は、3μmから20μmの銀で被覆されている、請求項10に記載のガラス板。
[請求項12]
前記接続素子(3)は少なくとも一つのコンタクト面(8)を介して全面が前記導電性の構造体(2)の部分領域(22)と接続されている、請求項1乃至11のいずれか一項に記載のガラス板。
[請求項13]
前記コンタクト面(8)は角を有していない、請求項1乃至12のいずれか一項に記載のガラス板。
[請求項14]
少なくとも一つの電気的な接続素子(3)を備えているガラス板の製造方法において、
a)はんだ材料(4)を、所定の層厚、体積、形状及び配置構成を有する小型のプレートとして、前記接続素子(3)の少なくとも一つのコンタクト面(8)に被着させるステップと、
b)導電性の構造体(2)をサブストレート(1)上に被着させるステップと、
c)前記接続素子(3)を前記はんだ材料(4)によって前記導電性の構造体(2)上に配置するステップと、
d)前記接続素子(3)を前記導電性の構造体(2)にはんだ付けするステップと、
を備えている、ことを特徴とする製造方法。
[請求項15]
導電性の構造体、有利には加熱導体及び/又はアンテナ導体を備えている車両のための、請求項1乃至13のいずれか一項に記載の電気的な接続素子を備えているガラス板の使用。
Claims (14)
- 導電性の構造体、有利には加熱導体および/またはアンテナ導体を備えている車両のためのガラス板であって、少なくとも一つの電気的な接続素子を備えているガラス板において、
サブストレート(1)と、
前記サブストレート(1)の所定の領域上の導電性の構造体(2)と、
少なくともクロム含有鋼を含む接続素子(3)と、
前記接続素子(3)を前記導電性の構造体(2)の部分領域に電気的に接続させるはんだ材料(4)の層と、
を有し、
前記はんだ材料(4)は、前記接続素子(3)と前記導電性の構造体(2)との間の間隙から1mm未満の漏れ幅を有する、
ガラス板。 - 前記サブストレート(1)は、ガラス、有利には平板ガラス、フロートガラス、石英ガラス、ホウケイ酸ガラス、ソーダ石灰ガラス、もしくは、ポリマー、有利にはポリエチレン、ポリプロピレン、ポリカーボネート、ポリメチルメタクリレート、および/または、それらの混合物を含んでいる、
請求項1に記載のガラス板。 - 前記サブストレート(1)の熱膨張率と前記接続素子(3)の熱膨張率との差は、5×10-6/℃未満である、
請求項1または2に記載のガラス板。 - 前記接続素子(3)は、少なくとも50重量%から89.5重量%の鉄、10.5重量%から20重量%のクロム、0重量%から1重量%の炭素、0重量%から5重量%のニッケル、0重量%から2重量%のマンガン、0重量%から2.5重量%のモリブデン、または、0重量%から1重量%のチタンを含んでいる、
請求項1から3のいずれかに記載のガラス板。 - 前記接続素子(3)は、少なくとも75重量%から84重量%の鉄、16重量%から18.5重量%のクロム、0重量%から0.1重量%の炭素、0重量%から1重量%のマンガン、または、0重量%から1重量%のチタンを含んでいる、
請求項4に記載のガラス板。 - 前記導電性の構造体(2)は、銀を含んでいる、
請求項1から5のいずれかに記載のガラス板。 - 前記はんだ(4)の層厚は、3.0×10-4m未満である、
請求項1から6のいずれかに記載のガラス板。 - 前記はんだ材料(4)は、スズおよびビスマス、インジウム、亜鉛、銅、銀またはそれらの混合物を含んでいる、
請求項1から7のいずれかに記載のガラス板。 - 前記はんだ材料(4)の組成におけるスズの割合は、3重量%から99.5重量%であり、ビスマス、インジウム、亜鉛、銅、銀またはそれらの混合物の割合は0.5重量%から97重量%である、
請求項8に記載のガラス板。 - 前記接続素子(3)は、ニッケル、スズ、銅および/または銀で被覆されている、
請求項1から9のいずれかに記載のガラス板。 - 前記接続素子(3)は、0.1μmから0.3μmのニッケル、および/または、3μmから20μmの銀で被覆されている、
請求項10に記載のガラス板。 - 前記接続素子(3)は、少なくとも一つのコンタクト面(8)を介して全面が前記導電性の構造体(2)の部分領域(22)と接続されている、
請求項1から11のいずれかに記載のガラス板。 - 前記コンタクト面(8)は、角を有していない、
請求項1から12のいずれかに記載のガラス板。 - 導電性の構造体、有利には加熱導体および/またはアンテナ導体を備えている車両のための、請求項1から13のいずれかに記載の電気的な接続素子を少なくとも1つ備えているガラス板の使用。
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