JP2016082048A5 - - Google Patents

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Publication number
JP2016082048A5
JP2016082048A5 JP2014211424A JP2014211424A JP2016082048A5 JP 2016082048 A5 JP2016082048 A5 JP 2016082048A5 JP 2014211424 A JP2014211424 A JP 2014211424A JP 2014211424 A JP2014211424 A JP 2014211424A JP 2016082048 A5 JP2016082048 A5 JP 2016082048A5
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JP
Japan
Prior art keywords
semiconductor device
semiconductor element
lead terminal
lead
semiconductor
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP2014211424A
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English (en)
Japanese (ja)
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JP2016082048A (ja
JP6385234B2 (ja
Filing date
Publication date
Application filed filed Critical
Priority claimed from JP2014211424A external-priority patent/JP6385234B2/ja
Priority to JP2014211424A priority Critical patent/JP6385234B2/ja
Priority to US14/790,682 priority patent/US9917064B2/en
Priority to DE102015215786.5A priority patent/DE102015215786A1/de
Priority to CN201910281594.0A priority patent/CN110071072B/zh
Priority to CN201611055874.2A priority patent/CN106952877B/zh
Priority to CN201510673980.6A priority patent/CN105529319B/zh
Publication of JP2016082048A publication Critical patent/JP2016082048A/ja
Publication of JP2016082048A5 publication Critical patent/JP2016082048A5/ja
Publication of JP6385234B2 publication Critical patent/JP6385234B2/ja
Application granted granted Critical
Active legal-status Critical Current
Anticipated expiration legal-status Critical

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JP2014211424A 2014-10-16 2014-10-16 半導体装置 Active JP6385234B2 (ja)

Priority Applications (6)

Application Number Priority Date Filing Date Title
JP2014211424A JP6385234B2 (ja) 2014-10-16 2014-10-16 半導体装置
US14/790,682 US9917064B2 (en) 2014-10-16 2015-07-02 Semiconductor device with a plate-shaped lead terminal
DE102015215786.5A DE102015215786A1 (de) 2014-10-16 2015-08-19 Halbleitervorrichtung
CN201611055874.2A CN106952877B (zh) 2014-10-16 2015-10-16 半导体装置
CN201910281594.0A CN110071072B (zh) 2014-10-16 2015-10-16 半导体装置
CN201510673980.6A CN105529319B (zh) 2014-10-16 2015-10-16 半导体装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2014211424A JP6385234B2 (ja) 2014-10-16 2014-10-16 半導体装置

Publications (3)

Publication Number Publication Date
JP2016082048A JP2016082048A (ja) 2016-05-16
JP2016082048A5 true JP2016082048A5 (enExample) 2016-12-22
JP6385234B2 JP6385234B2 (ja) 2018-09-05

Family

ID=55638195

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2014211424A Active JP6385234B2 (ja) 2014-10-16 2014-10-16 半導体装置

Country Status (4)

Country Link
US (1) US9917064B2 (enExample)
JP (1) JP6385234B2 (enExample)
CN (3) CN106952877B (enExample)
DE (1) DE102015215786A1 (enExample)

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* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US10204847B2 (en) * 2016-10-06 2019-02-12 Infineon Technologies Americas Corp. Multi-phase common contact package
DE112016007432B4 (de) 2016-11-11 2023-06-22 Mitsubishi Electric Corporation Halbleitervorrichtung, Invertereinheit und Automobil
JP6776840B2 (ja) * 2016-11-21 2020-10-28 オムロン株式会社 電子装置およびその製造方法
JP6806170B2 (ja) * 2017-02-09 2021-01-06 三菱電機株式会社 半導体装置及び電力変換装置
KR20190108163A (ko) * 2017-02-20 2019-09-23 신덴겐코교 가부시키가이샤 전자 장치 및 접속자
WO2019116457A1 (ja) * 2017-12-13 2019-06-20 三菱電機株式会社 半導体装置及び電力変換装置
EP3792961A4 (en) * 2018-05-08 2021-04-07 Mitsubishi Electric Corporation WIRING ELEMENT AND ASSEMBLED SEMI-CONDUCTOR MODULE
EP3832705A4 (en) * 2018-11-30 2021-09-15 Hitachi Metals, Ltd. ELECTRICAL CONNECTOR, ELECTRICAL CONNECTOR STRUCTURE AND METHOD FOR MANUFACTURING THE ELECTRICAL CONNECTOR
US11387210B2 (en) * 2019-03-15 2022-07-12 Fuji Electric Co., Ltd. Semiconductor module and manufacturing method therefor
US12131971B2 (en) * 2019-07-30 2024-10-29 Sansha Electric Manufacturing Co., Ltd. Semiconductor module
WO2022004644A1 (ja) * 2020-06-29 2022-01-06 京セラ株式会社 配線基体及び電子装置
JP7301805B2 (ja) * 2020-09-24 2023-07-03 株式会社東芝 半導体モジュール
DE112022007088T5 (de) * 2022-04-20 2025-04-10 Mitsubishi Electric Corporation Halbleitervorrichtung und Produktionsverfahren für eine Halbleitervorrichtung

Family Cites Families (24)

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Publication number Priority date Publication date Assignee Title
JPH01276655A (ja) 1988-04-27 1989-11-07 Japan Radio Co Ltd トランスファーモールド型集積回路
JPH065742A (ja) 1992-06-22 1994-01-14 Mitsubishi Electric Corp 半導体装置、その封止に用いられる樹脂および半導体装置の製造方法
JPH06120406A (ja) 1992-10-02 1994-04-28 Mitsubishi Electric Corp 半導体装置
JP3866880B2 (ja) 1999-06-28 2007-01-10 株式会社日立製作所 樹脂封止型電子装置
JP2005012085A (ja) * 2003-06-20 2005-01-13 Toyota Motor Corp 半導体モジュールの電極構造
JP4628687B2 (ja) * 2004-03-09 2011-02-09 ルネサスエレクトロニクス株式会社 半導体装置
JP4468115B2 (ja) 2004-08-30 2010-05-26 株式会社ルネサステクノロジ 半導体装置
CN100442483C (zh) 2004-09-16 2008-12-10 夏普株式会社 半导体光器件、其制造方法、引线框以及电子设备
DE102005043928B4 (de) * 2004-09-16 2011-08-18 Sharp Kk Optisches Halbleiterbauteil und Verfahren zu dessen Herstellung
JP4348267B2 (ja) 2004-09-22 2009-10-21 シャープ株式会社 光半導体装置、光通信装置および電子機器
TWI280673B (en) * 2004-09-22 2007-05-01 Sharp Kk Optical semiconductor device, optical communication device, and electronic equipment
JP4492448B2 (ja) 2005-06-15 2010-06-30 株式会社日立製作所 半導体パワーモジュール
JP4455488B2 (ja) * 2005-12-19 2010-04-21 三菱電機株式会社 半導体装置
JP4349364B2 (ja) * 2005-12-26 2009-10-21 三菱電機株式会社 半導体装置
JP2008016529A (ja) * 2006-07-04 2008-01-24 Renesas Technology Corp 半導体装置
JP2008218688A (ja) * 2007-03-05 2008-09-18 Denso Corp 半導体装置
JP5384913B2 (ja) * 2008-11-18 2014-01-08 ルネサスエレクトロニクス株式会社 半導体装置およびその製造方法
JP5218009B2 (ja) * 2008-12-16 2013-06-26 富士電機株式会社 半導体装置
JP5251991B2 (ja) * 2011-01-14 2013-07-31 トヨタ自動車株式会社 半導体モジュール
JP5665572B2 (ja) 2011-01-28 2015-02-04 三菱電機株式会社 半導体装置および半導体装置の製造方法
WO2013046400A1 (ja) * 2011-09-29 2013-04-04 トヨタ自動車株式会社 半導体装置
JP2013197573A (ja) 2012-03-23 2013-09-30 Mitsubishi Electric Corp 半導体装置
CN103545268B (zh) * 2012-07-09 2016-04-13 万国半导体股份有限公司 底部源极的功率器件及制备方法
JP6230238B2 (ja) * 2013-02-06 2017-11-15 三菱電機株式会社 半導体装置及びその製造方法

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