SG10201903641TA - Method of bonding a first substrate and a second substrate - Google Patents
Method of bonding a first substrate and a second substrateInfo
- Publication number
- SG10201903641TA SG10201903641TA SG10201903641TA SG10201903641TA SG10201903641TA SG 10201903641T A SG10201903641T A SG 10201903641TA SG 10201903641T A SG10201903641T A SG 10201903641TA SG 10201903641T A SG10201903641T A SG 10201903641TA SG 10201903641T A SG10201903641T A SG 10201903641TA
- Authority
- SG
- Singapore
- Prior art keywords
- substrate
- bonding
- connection
- adhesive material
- fabricating
- Prior art date
Links
- 239000000758 substrate Substances 0.000 title abstract 9
- 239000000853 adhesive Substances 0.000 abstract 2
- 230000001070 adhesive effect Effects 0.000 abstract 2
- 239000000463 material Substances 0.000 abstract 2
Classifications
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- Engineering & Computer Science (AREA)
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- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
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- Wire Bonding (AREA)
Abstract
Title of Invention: Method of Bonding a First Substrate and a Second Substrate A method for bonding a first substrate and a second substrate, the first substrate having at least one first connection extending from one side of the first substrate, the method comprising fabricating a first adhesive material around and along a height of the at least one first connection; and bonding the at least one first connection, the first adhesive material, and the second substrate. [FIG. A] 29
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
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SG10201406863T | 2014-10-23 |
Publications (1)
Publication Number | Publication Date |
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SG10201903641TA true SG10201903641TA (en) | 2019-05-30 |
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Family Applications (2)
Application Number | Title | Priority Date | Filing Date |
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SG10201903641TA SG10201903641TA (en) | 2014-10-23 | 2015-10-23 | Method of bonding a first substrate and a second substrate |
SG11201703125WA SG11201703125WA (en) | 2014-10-23 | 2015-10-23 | Method of bonding a first substrate and a second substrate |
Family Applications After (1)
Application Number | Title | Priority Date | Filing Date |
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SG11201703125WA SG11201703125WA (en) | 2014-10-23 | 2015-10-23 | Method of bonding a first substrate and a second substrate |
Country Status (3)
Country | Link |
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US (1) | US20170309584A1 (en) |
SG (2) | SG10201903641TA (en) |
WO (1) | WO2016064350A1 (en) |
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SG10201903641TA (en) * | 2014-10-23 | 2019-05-30 | Agency Science Tech & Res | Method of bonding a first substrate and a second substrate |
AT14497U1 (en) * | 2015-01-26 | 2015-12-15 | Plansee Composite Mat Gmbh | coating source |
TWI657721B (en) | 2018-04-02 | 2019-04-21 | 欣興電子股份有限公司 | Circuit board, package structure and method of manufacturing the same |
US20200273823A1 (en) * | 2019-02-27 | 2020-08-27 | Advanced Semiconductor Engineering, Inc. | Semiconductor device package and method of manufacturing the same |
CN112151398B (en) * | 2019-06-26 | 2023-12-15 | 上海微电子装备(集团)股份有限公司 | Chip packaging method |
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-
2015
- 2015-10-23 SG SG10201903641TA patent/SG10201903641TA/en unknown
- 2015-10-23 WO PCT/SG2015/050407 patent/WO2016064350A1/en active Application Filing
- 2015-10-23 SG SG11201703125WA patent/SG11201703125WA/en unknown
- 2015-10-23 US US15/518,064 patent/US20170309584A1/en not_active Abandoned
Also Published As
Publication number | Publication date |
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SG11201703125WA (en) | 2017-05-30 |
US20170309584A1 (en) | 2017-10-26 |
WO2016064350A1 (en) | 2016-04-28 |
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