JP2016076709A - 太陽電池の基板 - Google Patents
太陽電池の基板 Download PDFInfo
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- JP2016076709A JP2016076709A JP2015217744A JP2015217744A JP2016076709A JP 2016076709 A JP2016076709 A JP 2016076709A JP 2015217744 A JP2015217744 A JP 2015217744A JP 2015217744 A JP2015217744 A JP 2015217744A JP 2016076709 A JP2016076709 A JP 2016076709A
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- 239000000758 substrate Substances 0.000 title claims abstract description 61
- 238000010438 heat treatment Methods 0.000 claims abstract description 51
- 238000004519 manufacturing process Methods 0.000 claims abstract description 44
- 239000002019 doping agent Substances 0.000 claims abstract description 26
- 235000012431 wafers Nutrition 0.000 claims description 83
- 238000000034 method Methods 0.000 claims description 66
- 229910052710 silicon Inorganic materials 0.000 claims description 34
- 239000010703 silicon Substances 0.000 claims description 34
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 claims description 26
- 239000012298 atmosphere Substances 0.000 claims description 22
- HEMHJVSKTPXQMS-UHFFFAOYSA-M Sodium hydroxide Chemical compound [OH-].[Na+] HEMHJVSKTPXQMS-UHFFFAOYSA-M 0.000 claims description 18
- 238000000151 deposition Methods 0.000 claims description 18
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 claims description 14
- 229910052760 oxygen Inorganic materials 0.000 claims description 14
- 239000001301 oxygen Substances 0.000 claims description 14
- 239000000377 silicon dioxide Substances 0.000 claims description 13
- 235000012239 silicon dioxide Nutrition 0.000 claims description 13
- 239000007800 oxidant agent Substances 0.000 claims description 7
- BLRPTPMANUNPDV-UHFFFAOYSA-N Silane Chemical compound [SiH4] BLRPTPMANUNPDV-UHFFFAOYSA-N 0.000 claims description 6
- XLYOFNOQVPJJNP-UHFFFAOYSA-M hydroxide Chemical compound [OH-] XLYOFNOQVPJJNP-UHFFFAOYSA-M 0.000 claims description 6
- 229910000077 silane Inorganic materials 0.000 claims description 6
- 238000004140 cleaning Methods 0.000 claims description 5
- ZOXJGFHDIHLPTG-UHFFFAOYSA-N Boron Chemical compound [B] ZOXJGFHDIHLPTG-UHFFFAOYSA-N 0.000 claims description 4
- OAICVXFJPJFONN-UHFFFAOYSA-N Phosphorus Chemical compound [P] OAICVXFJPJFONN-UHFFFAOYSA-N 0.000 claims description 4
- 229910052796 boron Inorganic materials 0.000 claims description 4
- 239000007788 liquid Substances 0.000 claims description 4
- 229910052698 phosphorus Inorganic materials 0.000 claims description 4
- 239000011574 phosphorus Substances 0.000 claims description 4
- MHAJPDPJQMAIIY-UHFFFAOYSA-N Hydrogen peroxide Chemical compound OO MHAJPDPJQMAIIY-UHFFFAOYSA-N 0.000 claims description 3
- CBENFWSGALASAD-UHFFFAOYSA-N Ozone Chemical compound [O-][O+]=O CBENFWSGALASAD-UHFFFAOYSA-N 0.000 claims description 3
- KWYUFKZDYYNOTN-UHFFFAOYSA-M Potassium hydroxide Chemical compound [OH-].[K+] KWYUFKZDYYNOTN-UHFFFAOYSA-M 0.000 claims description 3
- 230000001590 oxidative effect Effects 0.000 claims description 3
- 230000004308 accommodation Effects 0.000 claims description 2
- 239000010410 layer Substances 0.000 description 163
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 30
- 238000012545 processing Methods 0.000 description 8
- 230000008021 deposition Effects 0.000 description 4
- 229910021420 polycrystalline silicon Inorganic materials 0.000 description 4
- 229920005591 polysilicon Polymers 0.000 description 4
- 229910021417 amorphous silicon Inorganic materials 0.000 description 3
- 230000003647 oxidation Effects 0.000 description 3
- 238000007254 oxidation reaction Methods 0.000 description 3
- 238000013459 approach Methods 0.000 description 2
- 238000002955 isolation Methods 0.000 description 2
- 238000011068 loading method Methods 0.000 description 2
- 238000012423 maintenance Methods 0.000 description 2
- 229910052751 metal Inorganic materials 0.000 description 2
- 239000002184 metal Substances 0.000 description 2
- 230000005855 radiation Effects 0.000 description 2
- 239000004065 semiconductor Substances 0.000 description 2
- HBMJWWWQQXIZIP-UHFFFAOYSA-N silicon carbide Chemical group [Si+]#[C-] HBMJWWWQQXIZIP-UHFFFAOYSA-N 0.000 description 2
- 229910000577 Silicon-germanium Inorganic materials 0.000 description 1
- LEVVHYCKPQWKOP-UHFFFAOYSA-N [Si].[Ge] Chemical compound [Si].[Ge] LEVVHYCKPQWKOP-UHFFFAOYSA-N 0.000 description 1
- 239000006117 anti-reflective coating Substances 0.000 description 1
- 239000000969 carrier Substances 0.000 description 1
- 239000013626 chemical specie Substances 0.000 description 1
- 239000004020 conductor Substances 0.000 description 1
- 238000011109 contamination Methods 0.000 description 1
- 238000002425 crystallisation Methods 0.000 description 1
- 230000008025 crystallization Effects 0.000 description 1
- 239000003989 dielectric material Substances 0.000 description 1
- 238000005530 etching Methods 0.000 description 1
- 238000011065 in-situ storage Methods 0.000 description 1
- 150000002500 ions Chemical class 0.000 description 1
- 238000001459 lithography Methods 0.000 description 1
- 239000012528 membrane Substances 0.000 description 1
- 239000002245 particle Substances 0.000 description 1
- 238000002161 passivation Methods 0.000 description 1
- 230000003449 preventive effect Effects 0.000 description 1
- 238000011112 process operation Methods 0.000 description 1
- 238000012827 research and development Methods 0.000 description 1
- 230000000717 retained effect Effects 0.000 description 1
- 229910010271 silicon carbide Inorganic materials 0.000 description 1
- 239000007787 solid Substances 0.000 description 1
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Abstract
【解決手段】炉内で基板の表面上にトンネル酸化物層を形成する工程102、炉から基板を取り出すことなく、トンネル酸化物層上にアモルファス層を形成する工程104、アモルファス層をドープして、N型ドーパントを含む第1の領域と、P型ドーパントを含む第2の領域とを設ける工程106、アモルファス層が加熱されて、N型ドープ領域とP型ドープ領域とを有する多結晶層が形成される工程108を含む。
【選択図】図1
Description
本明細書で述べる本発明は、アメリカ合衆国エネルギー省から与えられた契約番号DE−FC36−07GO17043による政府支援により行われた。政府は、本発明において特定の権利を有し得る。
[項目1]
太陽電池のエミッタ領域の製造方法であって、
炉内で基板の表面にトンネル酸化物層を形成する工程と、
上記炉から上記基板を取り出すことなく、
上記トンネル酸化物層上にアモルファス層を形成する工程と、
N型ドーパントを含む第1の領域及びP型ドーパントを含む第2の領域を設けるべく、上記アモルファス層をドーピングする段階と、
上記ドーピングする段階の後に、N型ドープ領域とP型ドープ領域とを有する多結晶層を設けるべく、上記アモルファス層を加熱する工程とを備える太陽電池のエミッタ領域の製造方法。
[項目2]
上記基板はシリコンを含み、上記トンネル酸化物層は二酸化シリコンを含み、上記アモルファス層はシリコンを含み、上記N型ドーパントはリンを含み、上記P型ドーパントがホウ素を含む項目1に記載の太陽電池のエミッタ領域の製造方法。
[項目3]
上記トンネル酸化物層を形成する工程は、上記基板を上記炉内で約900℃の温度で加熱する工程を有する項目1に記載の太陽電池のエミッタ領域の製造方法。
[項目4]
上記基板を上記炉内で約900℃の温度で加熱する工程は、約1.5ナノメートルの厚さを有する上記トンネル酸化物層を設けるべく、約500mTorr(0.067kPa)の圧力の酸素の雰囲気中で約3分間加熱する工程を含む項目3に記載の太陽電池のエミッタ領域の製造方法。
[項目5]
上記トンネル酸化物層を形成する工程は、上記基板を上記炉内で600℃未満の温度で加熱する工程を含む項目1に記載の太陽電池のエミッタ領域の製造方法。
[項目6]
上記基板を上記炉内で600℃未満の温度で加熱する工程は、約1.5ナノメートルの厚さを有する上記トンネル酸化物層を設けるべく、約300Torr(39.9kPa)の圧力の酸素の雰囲気中で約565℃の温度で約60分間加熱する工程を含む項目5に記載の太陽電池のエミッタ領域の製造方法。
[項目7]
上記アモルファス層を形成する工程は、上記炉内で上記アモルファス層を575℃未満の温度で堆積させる工程を含む項目1に記載の太陽電池のエミッタ領域の製造方法。
[項目8]
上記炉内で上記アモルファス層を575℃未満の温度で堆積させる工程は、約200〜300ナノメートルの範囲の厚さを有する上記アモルファス層を設けるべく、約350mTorr(0.047kPa)の圧力のシラン(SiH4)の雰囲気中で、約565℃の温度で加熱する工程を含む項目7に記載の太陽電池のエミッタ領域の製造方法。
[項目9]
上記トンネル酸化物層及び上記アモルファス層は、約565℃の温度で形成され、上記多結晶層を設けるべく上記アモルファス層を加熱する工程は、約980℃の温度で加熱する工程を含む項目1に記載の太陽電池のエミッタ領域の製造方法。
[項目10]
太陽電池の基板上に複数の層を形成する方法であって、
背中合わせに配置された2枚のウェハをそれぞれ収容する1以上のウェハ収容スロットに複数のウェハを有するウェハキャリアを炉内に搬入する工程と、
上記炉内で、上記複数のウェハのぞれぞれの全ての面にトンネル酸化物層を形成する工程と、
上記炉から上記複数のウェハを取り出すことなく、上記トンネル酸化物層上にアモルファス層を形成する工程とを備え、
上記アモルファス層は、上記背中合わせに配置された2枚のウェハの接触部分以外の上記トンネル酸化物層の全ての部分に形成される方法。
[項目11]
上記背中合わせに配置された2枚のウェハについて、それぞれのウェハの裏面に上記アモルファス層のリングパターンが形成される、
項目10に記載の方法。
[項目12]
上記アモルファス層を形成する工程の後に、上記ウェハそれぞれの上記裏面に、酸化剤を含む洗浄液を塗布する工程と、
上記洗浄液を塗布する工程の後に、上記ウェハそれぞれの上記裏面に、水酸化物を含むテクスチャ加工溶液を塗布する工程とを更に備える項目11に記載の方法。
[項目13]
上記酸化剤は、オゾン及び過酸化水素(H2O2)からなる一群から選択され、
上記水酸化物は、水酸化カリウム(KOH)及び水酸化ナトリウム(NaOH)からなる一群から選択される項目12に記載の方法。
[項目14]
上記複数のウェハはそれぞれシリコンを含み、上記トンネル酸化物層は二酸化シリコンを含み、上記アモルファス層はシリコンを含む項目10に記載の方法。
[項目15]
上記トンネル酸化物層を形成する工程は、上記複数のウェハのそれぞれを上記炉内で約900℃の温度で加熱する工程を有する項目10に記載の方法。
[項目16]
上記複数のウェハのそれぞれを上記炉内で約900℃の温度で加熱する工程は、約1.5ナノメートルの厚さを有する上記トンネル酸化物層を設けるべく、約500mTorr(0.067kPa)の圧力の酸素の雰囲気中で約3分間加熱する工程を含む項目15に記載の方法。
[項目17]
上記トンネル酸化物層を形成する工程は、上記複数のウェハのそれぞれを上記炉内で600℃未満の温度で加熱する工程を含む、項目10に記載の方法。
[項目18]
上記複数のウェハのそれぞれを上記炉内で600℃未満の温度で加熱する工程は、約1.5ナノメートルの厚さを有する上記トンネル酸化物層を設けるべく、約300Torr(39.9kP)の圧力の酸素の雰囲気中で約565℃の温度で約60分間加熱する工程を含む項目17に記載の方法。
[項目19]
上記アモルファス層を形成する工程は、上記炉内で上記アモルファス層を575℃未満の温度で堆積させる工程を含む項目10に記載の方法。
[項目20]
上記炉内で上記アモルファス層を575℃未満の温度で堆積させる工程は、約200〜300ナノメートルの範囲の厚さを有するアモルファス層を設けるべく、約350mTorr(0.047kPa)の圧力のシラン(SiH4)の雰囲気中で、約565℃の温度に加熱する工程を含む、項目19に記載の方法。
[項目21]
シリコンウェハの全ての表面に堆積された二酸化シリコンを含むトンネル酸化物層と、
上記トンネル酸化物層上に堆積された多結晶層であって、上記多結晶層のリングパターンを含む上記シリコンウェハの裏面以外の上記トンネル酸化物層の全ての部分に堆積された多結晶層とを備える太陽電池基板。
[項目22]
シリコンウェハの全ての表面に堆積された二酸化シリコンを含むトンネル酸化物層と、
上記トンネル酸化物層上に堆積されたアモルファス層であって、上記アモルファス層のリングパターンを含む上記シリコンウェハの裏面以外の上記トンネル酸化物層の全ての部分に堆積されたアモルファス層とを備える太陽電池基板。
Claims (22)
- 太陽電池のエミッタ領域を製造する方法であって、
炉内で基板の表面に、二酸化シリコンを含むトンネル酸化物層を形成する工程と、
前記炉から前記基板を取り出すことなく、
前記トンネル酸化物層上にアモルファス層を形成する工程と、
N型ドーパントを含む第1の領域及びP型ドーパントを含む第2の領域を設けるべく、前記アモルファス層をドーピングする工程と、
その後に、N型ドープ領域とP型ドープ領域とを有する多結晶層を設けるべく、前記アモルファス層を加熱する工程と、
を備える方法。 - 前記基板はシリコンを含み、
前記アモルファス層はシリコンを含み、
前記N型ドーパントはリンを含み、
前記P型ドーパントがホウ素を含む、
請求項1に記載の方法。 - 前記トンネル酸化物層を形成する工程は、前記トンネル酸化物層を設けるべく、前記基板を、酸素又はN2Oを含む雰囲気中で加熱する工程を含む、
請求項1又は請求項2に記載の方法。 - 前記トンネル酸化物層を形成する工程は、前記基板を前記炉内で約900℃の温度で加熱する工程を有する、
請求項1又は2に記載の方法。 - 前記基板を前記炉内で約900℃の温度で加熱する工程は、約1.5ナノメートルの厚さを有する前記トンネル酸化物層を設けるべく、約500mTorr(0.067kPa)の圧力の酸素の雰囲気中で約3分間加熱する工程をさらに含む、
請求項4に記載の方法。 - 前記トンネル酸化物層を形成する工程は、前記基板を前記炉内で600℃未満の温度で加熱する工程を含む、
請求項1又は2に記載の方法。 - 前記基板を前記炉内で600℃未満の温度で加熱する工程は、約1.5ナノメートルの厚さを有する前記トンネル酸化物層を設けるべく、約300Torr(39.9kPa)の圧力の酸素の雰囲気中で約565℃の温度で約60分間加熱する工程をさらに含む、
請求項6に記載の方法。 - 前記アモルファス層を形成する工程は、前記炉内で前記アモルファス層を575℃未満の温度で堆積させる工程を含む、
請求項1から請求項7までのいずれか一項に記載の方法。 - 前記炉内で前記アモルファス層を575℃未満の温度で堆積させる工程は、約200〜300ナノメートルの範囲の厚さを有する前記アモルファス層を設けるべく、約350mTorr(0.047kPa)の圧力のシラン(SiH4)の雰囲気中で、約565℃の温度で加熱する工程をさらに含む、
請求項8に記載の方法。 - 前記トンネル酸化物層及び前記アモルファス層の両方は、約565℃の温度で形成され、
前記多結晶層を設けるべく前記アモルファス層を加熱する工程は、約980℃の温度で加熱する工程を含む、
請求項1から請求項3までのいずれか一項に記載の方法。 - ウェハキャリアが背中合わせに配置された2枚のウェハを収容する1以上のウェハ収容スロットを有し、複数のウェハとともに前記ウェハキャリアを炉内に搬入する工程をさらに備え、
前記炉内で基板の表面に、二酸化シリコンを含む前記トンネル酸化物層を形成する工程は、前記炉内で、前記複数のウェハのぞれぞれの全ての面に前記トンネル酸化物層を形成する工程を有し、
前記炉から前記基板を取り出すことなく、前記トンネル酸化物層上に前記アモルファス層を形成する工程は、前記炉から前記複数のウェハを取り出すことなく、前記トンネル酸化物層上に前記アモルファス層を形成する工程を有し、
前記アモルファス層は、背中合わせに配置されたウェハ間の接触部分以外の前記トンネル酸化物層の全ての部分に形成される、
請求項1に記載の方法。 - 前記背中合わせに配置されたウェハについて、それぞれのウェハの裏面に前記アモルファス層のリングパターンが形成される、
請求項11に記載の方法。 - 前記アモルファス層を形成する工程の後に、前記ウェハそれぞれの前記裏面に、酸化剤を含む洗浄液を塗布する工程と、
その後に、前記ウェハそれぞれの前記裏面に、水酸化物を含むテクスチャ加工溶液を塗布する工程と、
を更に備える、
請求項12に記載の方法。 - 前記酸化剤は、オゾン及び過酸化水素(H2O2)からなる一群から選択され、
前記水酸化物は、水酸化カリウム(KOH)及び水酸化ナトリウム(NaOH)からなる一群から選択される、
請求項13に記載の方法。 - 前記複数のウェハはそれぞれシリコンを含み、
前記アモルファス層はシリコンを含む、
請求項11から請求項14までのいずれか一項に記載の方法。 - 前記トンネル酸化物層を形成する工程は、前記トンネル酸化物層を設けるべく、前記複数のウェハのそれぞれを、酸素又はN2Oを含む雰囲気中で加熱する工程を含む、
請求項11から請求項15までのいずれか一項に記載の方法。 - 前記トンネル酸化物層を形成する工程は、前記複数のウェハのそれぞれを前記炉内で約900℃の温度で加熱する工程を有する、
請求項11から請求項15までのいずれか一項に記載の方法。 - 前記複数のウェハのそれぞれを前記炉内で約900℃の温度で加熱する工程は、約1.5ナノメートルの厚さを有する前記トンネル酸化物層を設けるべく、約500mTorr(0.067kPa)の圧力の酸素の雰囲気中で約3分間加熱する工程を含む、
請求項17に記載の方法。 - 前記トンネル酸化物層を形成する工程は、前記複数のウェハのそれぞれを前記炉内で600℃未満の温度で加熱する工程を含む、
請求項11から請求項15までのいずれか一項に記載の方法。 - 前記複数のウェハのそれぞれを前記炉内で600℃未満の温度で加熱する工程は、約1.5ナノメートルの厚さを有する前記トンネル酸化物層を設けるべく、約300Torr(39.9kPa)の圧力の酸素の雰囲気中で約565℃の温度で約60分間加熱する工程をさらに含む、
請求項19に記載の方法。 - 前記アモルファス層を形成する工程は、前記炉内で前記アモルファス層を575℃未満の温度で堆積させる工程を含む、
請求項11から請求項20までのいずれか一項に記載の方法。 - 前記炉内で前記アモルファス層を575℃未満の温度で堆積させる工程は、約200〜300ナノメートルの範囲の厚さを有するアモルファス層を設けるべく、約350mTorr(0.047kPa)の圧力のシラン(SiH4)の雰囲気中で、約565℃の温度で加熱する工程をさらに含む、
請求項21に記載の方法。
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EP2619806B1 (en) | 2021-06-23 |
CN102959738A (zh) | 2013-03-06 |
EP2619806A4 (en) | 2018-01-03 |
EP2619806A1 (en) | 2013-07-31 |
AU2011306011B2 (en) | 2015-05-14 |
AU2011306011A1 (en) | 2013-01-10 |
JP5837600B2 (ja) | 2015-12-24 |
JP6212095B2 (ja) | 2017-10-11 |
US20120073650A1 (en) | 2012-03-29 |
CN111769179A (zh) | 2020-10-13 |
CN111769179B (zh) | 2023-09-15 |
KR101788897B1 (ko) | 2017-10-20 |
CN102959738B (zh) | 2016-03-30 |
CN105789375A (zh) | 2016-07-20 |
JP2013538009A (ja) | 2013-10-07 |
KR20130109992A (ko) | 2013-10-08 |
WO2012039831A1 (en) | 2012-03-29 |
US10629760B2 (en) | 2020-04-21 |
US20170263795A1 (en) | 2017-09-14 |
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