JP2016072626A5 - - Google Patents

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Publication number
JP2016072626A5
JP2016072626A5 JP2015187642A JP2015187642A JP2016072626A5 JP 2016072626 A5 JP2016072626 A5 JP 2016072626A5 JP 2015187642 A JP2015187642 A JP 2015187642A JP 2015187642 A JP2015187642 A JP 2015187642A JP 2016072626 A5 JP2016072626 A5 JP 2016072626A5
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JP
Japan
Prior art keywords
semiconductor chip
semiconductor
package
stacked
base substrate
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JP2015187642A
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English (en)
Japanese (ja)
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JP2016072626A (ja
JP6584258B2 (ja
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Priority claimed from KR1020140130335A external-priority patent/KR102254104B1/ko
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Publication of JP2016072626A5 publication Critical patent/JP2016072626A5/ja
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JP2015187642A 2014-09-29 2015-09-25 半導体パッケージ Active JP6584258B2 (ja)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
KR10-2014-0130335 2014-09-29
KR1020140130335A KR102254104B1 (ko) 2014-09-29 2014-09-29 반도체 패키지

Publications (3)

Publication Number Publication Date
JP2016072626A JP2016072626A (ja) 2016-05-09
JP2016072626A5 true JP2016072626A5 (cg-RX-API-DMAC10.html) 2018-10-11
JP6584258B2 JP6584258B2 (ja) 2019-10-02

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Family Applications (1)

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JP2015187642A Active JP6584258B2 (ja) 2014-09-29 2015-09-25 半導体パッケージ

Country Status (3)

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US (1) US9589945B2 (cg-RX-API-DMAC10.html)
JP (1) JP6584258B2 (cg-RX-API-DMAC10.html)
KR (1) KR102254104B1 (cg-RX-API-DMAC10.html)

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