JP2016060164A - 圧電素子、液体噴射ヘッド、液体噴射装置及び圧電素子の製造方法 - Google Patents
圧電素子、液体噴射ヘッド、液体噴射装置及び圧電素子の製造方法 Download PDFInfo
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- JP2016060164A JP2016060164A JP2014191789A JP2014191789A JP2016060164A JP 2016060164 A JP2016060164 A JP 2016060164A JP 2014191789 A JP2014191789 A JP 2014191789A JP 2014191789 A JP2014191789 A JP 2014191789A JP 2016060164 A JP2016060164 A JP 2016060164A
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- electrode
- piezoelectric element
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Classifications
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- B41J2/1646—Manufacturing processes thin film formation thin film formation by sputtering
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
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- H10N30/01—Manufacture or treatment
- H10N30/02—Forming enclosures or casings
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- H—ELECTRICITY
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- H10N30/03—Assembling devices that include piezoelectric or electrostrictive parts
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
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- H10N30/08—Shaping or machining of piezoelectric or electrostrictive bodies
- H10N30/082—Shaping or machining of piezoelectric or electrostrictive bodies by etching, e.g. lithography
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
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- H10N30/20—Piezoelectric or electrostrictive devices with electrical input and mechanical output, e.g. functioning as actuators or vibrators
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
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- H10N30/20—Piezoelectric or electrostrictive devices with electrical input and mechanical output, e.g. functioning as actuators or vibrators
- H10N30/204—Piezoelectric or electrostrictive devices with electrical input and mechanical output, e.g. functioning as actuators or vibrators using bending displacement, e.g. unimorph, bimorph or multimorph cantilever or membrane benders
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- H10N30/2048—Membrane type having non-planar shape
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
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- B41J2202/01—Embodiments of or processes related to ink-jet heads
- B41J2202/11—Embodiments of or processes related to ink-jet heads characterised by specific geometrical characteristics
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
- Particle Formation And Scattering Control In Inkjet Printers (AREA)
Abstract
Description
かかる態様では、圧電体層に第1面を有する溝部を形成すると共に、溝部の内面上に内部応力が引っ張り応力となる応力付与膜を設けることで、圧電素子に基板とは反対側に引き上げる応力を付与すると共に、第1面によって圧電素子を引き上げる応力を向上して、圧電素子が凹部側に変形する応力を低減させることができる。したがって、圧電素子を駆動して凹部内に変形させた際の変形量を向上することができる。
かかる態様では、変位効率の向上した圧電素子を有する液体噴射ヘッドを実現できる。
かかる態様では、変位効率の向上した圧電素子を有する液体噴射装置を実現できる。
かかる態様では、圧電体層に第1面を有する溝部を形成すると共に、溝部の内面上に内部応力が引っ張り応力となる応力付与膜を設けることで、圧電素子に基板とは反対側に引き上げる応力を付与すると共に、第1面によって圧電素子を引き上げる応力を向上して、圧電素子が凹部側に変形する応力を低減させることができる。したがって、圧電素子を駆動して凹部内に変形させた際の変形量を向上することができる。
(実施形態1)
図1は、本発明の実施形態1に係る液体噴射ヘッドの一例であるインクジェット式記録ヘッドの斜視図であり、図2は、インクジェット式記録ヘッドの流路形成基板の平面図であり、図3は図2のA−A′線に準ずる断面図及び拡大断面図であり、図4は、図3(a)のB−B′線に準ずる断面図である。
図15は、本発明の実施形態2に係る液体噴射ヘッドの一例であるインクジェット式記録ヘッドの要部を拡大した断面図である。なお、上述した実施形態1と同様の部材には同一の符号を付して重複する説明は省略する。
以上、本発明の各実施形態について説明したが、本発明の基本的な構成は上述したものに限定されるものではない。
Claims (12)
- 凹部が設けられた基板の一方面側に、振動板を介して設けられた、第1電極、圧電体層及び第2電極を有する圧電素子であって、
前記圧電体層の側面には、前記基板の前記振動板の表面に相対向する第1面を有する溝部が設けられており、
前記溝部の内面上には、内部応力が引っ張り応力となる応力付与膜が設けられていることを特徴とする圧電素子。 - 前記応力付与膜は、前記第2電極の前記圧電体層とは反対側の上面に達するまで設けられており、当該応力付与膜の前記圧電素子の上面の中央部に対応する領域に開口部が設けられていることを特徴とする請求項1記載の圧電素子。
- 前記溝部の前記第1面は、前記第1電極、前記圧電体層及び前記第2電極の積層方向に対して傾斜し、且つ前記振動板の表面に対して傾斜した傾斜面となっていることを特徴とする請求項1又は2記載の圧電素子。
- 前記溝部は、前記第2電極側に向かって設けられた第2面を有し、前記第2面は、前記第1電極、前記圧電体層及び前記第2電極の積層方向に対して傾斜し、且つ前記振動板の表面に対して傾斜した傾斜面となっていることを特徴とする請求項1〜3の何れか一項に記載の圧電素子。
- 前記応力付与膜の前記振動板からの厚さは、当該圧電素子の振動板からの厚さに対して100%以上、200%以下であることを特徴とする請求項1〜4の何れか一項に記載の圧電素子。
- 前記第2電極は、内部応力が圧縮応力であることを特徴とする請求項1〜5の何れか一項に記載の圧電素子。
- 前記応力付与膜が、感光性樹脂であることを特徴とする請求項1〜6の何れか一項に記載の圧電素子。
- 請求項1〜7の何れか一項に記載の圧電素子を具備し、前記凹部が圧力発生室であると共に、前記圧力発生室に連通して液体を噴射するノズル開口を有することを特徴とする液体噴射ヘッド。
- 請求項8記載の液体噴射ヘッドを具備することを特徴とする液体噴射装置。
- 凹部が設けられた基板の一方面側に、振動板を介して設けられた第1電極、圧電体層及び第2電極を有し、
前記圧電体層の側面には、前記基板の前記振動板の表面に相対向する第1面を有する溝部が設けられた圧電素子の製造方法であって、
前記溝部の内面上には、内部応力が引っ張り応力となる応力付与膜を設けることを特徴とする圧電素子の製造方法。 - 前記溝部は、前記圧電体層をウェットエッチングによりパターニングすることにより同時に形成することを特徴とする請求項10記載の圧電素子の製造方法。
- 前記応力付与膜は、液相法によって形成することを特徴とする請求項10又は11に記載の圧電デバイスの製造方法。
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