JP2016018859A5 - - Google Patents
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- Publication number
- JP2016018859A5 JP2016018859A5 JP2014140000A JP2014140000A JP2016018859A5 JP 2016018859 A5 JP2016018859 A5 JP 2016018859A5 JP 2014140000 A JP2014140000 A JP 2014140000A JP 2014140000 A JP2014140000 A JP 2014140000A JP 2016018859 A5 JP2016018859 A5 JP 2016018859A5
- Authority
- JP
- Japan
- Prior art keywords
- layer
- insulating film
- interlayer insulating
- pixel region
- hydrogen concentration
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000010410 layer Substances 0.000 claims description 55
- 239000011229 interlayer Substances 0.000 claims description 26
- UFHFLCQGNIYNRP-UHFFFAOYSA-N Hydrogen Chemical compound [H][H] UFHFLCQGNIYNRP-UHFFFAOYSA-N 0.000 claims description 14
- 229910052739 hydrogen Inorganic materials 0.000 claims description 14
- 239000001257 hydrogen Substances 0.000 claims description 14
- 238000003384 imaging method Methods 0.000 claims description 12
- 230000003287 optical effect Effects 0.000 claims description 12
- 238000010438 heat treatment Methods 0.000 claims description 9
- 238000004519 manufacturing process Methods 0.000 claims description 6
- 230000001681 protective effect Effects 0.000 claims description 5
- 238000006243 chemical reaction Methods 0.000 claims description 4
- 239000004065 semiconductor Substances 0.000 claims description 4
- 239000000758 substrate Substances 0.000 claims description 4
- 238000000034 method Methods 0.000 claims description 3
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims 12
- 229910052802 copper Inorganic materials 0.000 claims 12
- 239000010949 copper Substances 0.000 claims 12
- 238000009792 diffusion process Methods 0.000 claims 8
- 230000002265 prevention Effects 0.000 claims 6
- 239000002184 metal Substances 0.000 claims 1
- 229910052751 metal Inorganic materials 0.000 claims 1
Priority Applications (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2014140000A JP6368177B2 (ja) | 2014-07-07 | 2014-07-07 | 固体撮像装置及びその製造方法 |
| US14/749,954 US9564399B2 (en) | 2014-07-07 | 2015-06-25 | Solid state image sensor and method for manufacturing the same |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2014140000A JP6368177B2 (ja) | 2014-07-07 | 2014-07-07 | 固体撮像装置及びその製造方法 |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JP2016018859A JP2016018859A (ja) | 2016-02-01 |
| JP2016018859A5 true JP2016018859A5 (enExample) | 2017-07-20 |
| JP6368177B2 JP6368177B2 (ja) | 2018-08-01 |
Family
ID=55017573
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2014140000A Expired - Fee Related JP6368177B2 (ja) | 2014-07-07 | 2014-07-07 | 固体撮像装置及びその製造方法 |
Country Status (2)
| Country | Link |
|---|---|
| US (1) | US9564399B2 (enExample) |
| JP (1) | JP6368177B2 (enExample) |
Families Citing this family (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105992432B (zh) * | 2015-02-05 | 2018-09-04 | 台达电子工业股份有限公司 | 应用于led负载的电源电路 |
| JP6598504B2 (ja) | 2015-05-07 | 2019-10-30 | キヤノン株式会社 | 半導体装置の製造方法 |
| JP6805766B2 (ja) * | 2016-02-26 | 2020-12-23 | 株式会社リコー | 撮像装置及び撮像システム |
| JP6574808B2 (ja) * | 2016-07-01 | 2019-09-11 | キヤノン株式会社 | 撮像装置 |
| US9818791B1 (en) * | 2016-10-04 | 2017-11-14 | Omnivision Technologies, Inc. | Stacked image sensor |
| JP2019012739A (ja) * | 2017-06-29 | 2019-01-24 | ソニーセミコンダクタソリューションズ株式会社 | 固体撮像素子および撮像装置 |
| US11244978B2 (en) * | 2018-10-17 | 2022-02-08 | Canon Kabushiki Kaisha | Photoelectric conversion apparatus and equipment including the same |
| JP7481811B2 (ja) * | 2019-07-26 | 2024-05-13 | キヤノン株式会社 | 半導体装置 |
| JP7414492B2 (ja) | 2019-11-29 | 2024-01-16 | キヤノン株式会社 | 光電変換装置、光電変換装置の製造方法 |
Family Cites Families (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2004363375A (ja) | 2003-06-05 | 2004-12-24 | Renesas Technology Corp | 固体撮像素子 |
| US7453109B2 (en) * | 2004-09-03 | 2008-11-18 | Canon Kabushiki Kaisha | Solid-state image sensor and imaging system |
| JP2007128979A (ja) * | 2005-11-01 | 2007-05-24 | Canon Inc | 固体撮像装置及びその製造方法 |
| JP2009290089A (ja) | 2008-05-30 | 2009-12-10 | Panasonic Corp | 固体撮像装置およびその製造方法 |
| JP5302644B2 (ja) | 2008-12-03 | 2013-10-02 | キヤノン株式会社 | 撮像装置、及び撮像システム |
| JP5493461B2 (ja) * | 2009-05-12 | 2014-05-14 | ソニー株式会社 | 固体撮像装置、電子機器及び固体撮像装置の製造方法 |
| JP2012023319A (ja) * | 2010-07-16 | 2012-02-02 | Sharp Corp | 固体撮像素子およびその製造方法、電子情報機器 |
| TWI595637B (zh) * | 2012-09-28 | 2017-08-11 | 新力股份有限公司 | 半導體裝置及電子機器 |
-
2014
- 2014-07-07 JP JP2014140000A patent/JP6368177B2/ja not_active Expired - Fee Related
-
2015
- 2015-06-25 US US14/749,954 patent/US9564399B2/en not_active Expired - Fee Related
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