JP2016219468A5 - - Google Patents
Download PDFInfo
- Publication number
- JP2016219468A5 JP2016219468A5 JP2015099485A JP2015099485A JP2016219468A5 JP 2016219468 A5 JP2016219468 A5 JP 2016219468A5 JP 2015099485 A JP2015099485 A JP 2015099485A JP 2015099485 A JP2015099485 A JP 2015099485A JP 2016219468 A5 JP2016219468 A5 JP 2016219468A5
- Authority
- JP
- Japan
- Prior art keywords
- region
- opening
- solid
- layer
- imaging device
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 238000003384 imaging method Methods 0.000 claims 15
- 239000004065 semiconductor Substances 0.000 claims 6
- 239000000758 substrate Substances 0.000 claims 6
- 230000002093 peripheral effect Effects 0.000 claims 4
- 230000001681 protective effect Effects 0.000 claims 3
- 229910052581 Si3N4 Inorganic materials 0.000 claims 2
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical group O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 claims 2
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 claims 2
- 238000004519 manufacturing process Methods 0.000 claims 2
- 229910052710 silicon Inorganic materials 0.000 claims 2
- 239000010703 silicon Substances 0.000 claims 2
- HQVNEWCFYHHQES-UHFFFAOYSA-N silicon nitride Chemical group N12[Si]34N5[Si]62N3[Si]51N64 HQVNEWCFYHHQES-UHFFFAOYSA-N 0.000 claims 2
- 229910052814 silicon oxide Inorganic materials 0.000 claims 2
Priority Applications (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2015099485A JP6685653B2 (ja) | 2015-05-14 | 2015-05-14 | 固体撮像装置の製造方法 |
| US15/149,767 US9837463B2 (en) | 2015-05-14 | 2016-05-09 | Solid-state imaging device and method of manufacturing the same |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2015099485A JP6685653B2 (ja) | 2015-05-14 | 2015-05-14 | 固体撮像装置の製造方法 |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JP2016219468A JP2016219468A (ja) | 2016-12-22 |
| JP2016219468A5 true JP2016219468A5 (enExample) | 2018-06-21 |
| JP6685653B2 JP6685653B2 (ja) | 2020-04-22 |
Family
ID=57277695
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2015099485A Active JP6685653B2 (ja) | 2015-05-14 | 2015-05-14 | 固体撮像装置の製造方法 |
Country Status (2)
| Country | Link |
|---|---|
| US (1) | US9837463B2 (enExample) |
| JP (1) | JP6685653B2 (enExample) |
Families Citing this family (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110291636B (zh) * | 2017-02-21 | 2023-07-18 | 索尼半导体解决方案公司 | 成像器件和电子装置 |
| CN109524427A (zh) * | 2018-10-26 | 2019-03-26 | 上海华力集成电路制造有限公司 | Cis的内部透镜的制造方法 |
| US10985199B2 (en) | 2018-10-31 | 2021-04-20 | Taiwan Semiconductor Manufacturing Company Ltd. | Image sensor having stress releasing structure and method of forming same |
| KR102639539B1 (ko) | 2018-11-05 | 2024-02-26 | 삼성전자주식회사 | 이미지 센서 및 이의 형성 방법 |
| JP7301530B2 (ja) * | 2018-11-30 | 2023-07-03 | キヤノン株式会社 | 光学装置および機器 |
| US20230326942A1 (en) * | 2022-04-08 | 2023-10-12 | Visera Technologies Company Limited | Image sensor |
Family Cites Families (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP3809708B2 (ja) | 1997-07-15 | 2006-08-16 | ソニー株式会社 | 固体撮像素子並びにその製造方法 |
| JP4873001B2 (ja) * | 2008-12-10 | 2012-02-08 | ソニー株式会社 | 固体撮像装置とその製造方法、電子機器並びに半導体装置 |
| JP5493461B2 (ja) * | 2009-05-12 | 2014-05-14 | ソニー株式会社 | 固体撮像装置、電子機器及び固体撮像装置の製造方法 |
| JP5853351B2 (ja) * | 2010-03-25 | 2016-02-09 | ソニー株式会社 | 半導体装置、半導体装置の製造方法、及び電子機器 |
| JP2012182426A (ja) * | 2011-02-09 | 2012-09-20 | Canon Inc | 固体撮像装置、固体撮像装置を用いた撮像システム及び固体撮像装置の製造方法 |
-
2015
- 2015-05-14 JP JP2015099485A patent/JP6685653B2/ja active Active
-
2016
- 2016-05-09 US US15/149,767 patent/US9837463B2/en active Active
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| US11991889B2 (en) | Solid-state image pickup device and manufacturing method thereof | |
| JP2016219468A5 (enExample) | ||
| JP2013251539A5 (enExample) | ||
| JP5693924B2 (ja) | 半導体撮像装置 | |
| JP2009252949A5 (enExample) | ||
| JP2015015332A5 (enExample) | ||
| TWI456746B (zh) | 固態成像器件，其製造方法，電子裝置以及半導體器件 | |
| JP2016219551A5 (enExample) | ||
| JP2012182429A5 (ja) | 固体撮像装置、及び固体撮像装置の製造方法 | |
| JP2013247246A5 (enExample) | ||
| JP2012164945A5 (enExample) | ||
| JP2017055080A5 (enExample) | ||
| JP6685653B2 (ja) | 固体撮像装置の製造方法 | |
| US20140080245A1 (en) | Method for fabricating optical micro structure and applications thereof | |
| JP2016018859A (ja) | 固体撮像装置及びその製造方法 | |
| JP6103947B2 (ja) | 固体撮像装置及びその製造方法 | |
| JP6108698B2 (ja) | 固体撮像装置の製造方法 | |
| US20160172406A1 (en) | Semiconductor device and solid-state imaging device | |
| JP2014204048A5 (enExample) | ||
| JP2016058599A5 (enExample) | ||
| JP2015041711A5 (enExample) | ||
| JP2016004838A5 (enExample) | ||
| JP2013145917A5 (ja) | 固体撮像装置の製造方法 | |
| JP2015115402A5 (enExample) | ||
| CN106486505A (zh) | 成像器件及其制造方法 |