JP2016004965A - 半導体装置 - Google Patents
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- 239000004065 semiconductor Substances 0.000 title claims abstract description 210
- 239000012535 impurity Substances 0.000 claims description 7
- 230000007423 decrease Effects 0.000 abstract description 11
- 230000006866 deterioration Effects 0.000 abstract 1
- 229910021332 silicide Inorganic materials 0.000 description 41
- FVBUAEGBCNSCDD-UHFFFAOYSA-N silicide(4-) Chemical group [Si-4] FVBUAEGBCNSCDD-UHFFFAOYSA-N 0.000 description 41
- 229910052751 metal Inorganic materials 0.000 description 10
- 239000002184 metal Substances 0.000 description 10
- BASFCYQUMIYNBI-UHFFFAOYSA-N platinum Chemical compound [Pt] BASFCYQUMIYNBI-UHFFFAOYSA-N 0.000 description 7
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 6
- 230000004888 barrier function Effects 0.000 description 6
- 239000010931 gold Substances 0.000 description 6
- 239000000463 material Substances 0.000 description 6
- 239000010936 titanium Substances 0.000 description 5
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 description 4
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 4
- 229910052782 aluminium Inorganic materials 0.000 description 4
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 4
- 239000010949 copper Substances 0.000 description 4
- 239000010410 layer Substances 0.000 description 4
- 238000000034 method Methods 0.000 description 4
- 229910052710 silicon Inorganic materials 0.000 description 4
- 239000010703 silicon Substances 0.000 description 4
- OAICVXFJPJFONN-UHFFFAOYSA-N Phosphorus Chemical compound [P] OAICVXFJPJFONN-UHFFFAOYSA-N 0.000 description 3
- 239000012141 concentrate Substances 0.000 description 3
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 3
- 229910052737 gold Inorganic materials 0.000 description 3
- 238000012986 modification Methods 0.000 description 3
- 230000004048 modification Effects 0.000 description 3
- 150000004767 nitrides Chemical class 0.000 description 3
- 229910052698 phosphorus Inorganic materials 0.000 description 3
- 239000011574 phosphorus Substances 0.000 description 3
- HBMJWWWQQXIZIP-UHFFFAOYSA-N silicon carbide Chemical compound [Si+]#[C-] HBMJWWWQQXIZIP-UHFFFAOYSA-N 0.000 description 3
- ZOXJGFHDIHLPTG-UHFFFAOYSA-N Boron Chemical compound [B] ZOXJGFHDIHLPTG-UHFFFAOYSA-N 0.000 description 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 2
- ZOKXTWBITQBERF-UHFFFAOYSA-N Molybdenum Chemical compound [Mo] ZOKXTWBITQBERF-UHFFFAOYSA-N 0.000 description 2
- RTAQQCXQSZGOHL-UHFFFAOYSA-N Titanium Chemical compound [Ti] RTAQQCXQSZGOHL-UHFFFAOYSA-N 0.000 description 2
- 229910052785 arsenic Inorganic materials 0.000 description 2
- RQNWIZPPADIBDY-UHFFFAOYSA-N arsenic atom Chemical compound [As] RQNWIZPPADIBDY-UHFFFAOYSA-N 0.000 description 2
- 229910052796 boron Inorganic materials 0.000 description 2
- 229910052802 copper Inorganic materials 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 230000001678 irradiating effect Effects 0.000 description 2
- 229910052750 molybdenum Inorganic materials 0.000 description 2
- 239000011733 molybdenum Substances 0.000 description 2
- 229910052759 nickel Inorganic materials 0.000 description 2
- 229910052757 nitrogen Inorganic materials 0.000 description 2
- 229910052697 platinum Inorganic materials 0.000 description 2
- 239000011241 protective layer Substances 0.000 description 2
- 238000009864 tensile test Methods 0.000 description 2
- 229910052719 titanium Inorganic materials 0.000 description 2
- WFKWXMTUELFFGS-UHFFFAOYSA-N tungsten Chemical compound [W] WFKWXMTUELFFGS-UHFFFAOYSA-N 0.000 description 2
- 229910052721 tungsten Inorganic materials 0.000 description 2
- 239000010937 tungsten Substances 0.000 description 2
- 230000002411 adverse Effects 0.000 description 1
- 238000000137 annealing Methods 0.000 description 1
- 239000013078 crystal Substances 0.000 description 1
- 230000005684 electric field Effects 0.000 description 1
- -1 for example Chemical compound 0.000 description 1
- 238000004093 laser heating Methods 0.000 description 1
- 150000002739 metals Chemical class 0.000 description 1
- 230000000704 physical effect Effects 0.000 description 1
- 230000002040 relaxant effect Effects 0.000 description 1
- 230000000630 rising effect Effects 0.000 description 1
- 229910010271 silicon carbide Inorganic materials 0.000 description 1
- 229910000679 solder Inorganic materials 0.000 description 1
- 238000003466 welding Methods 0.000 description 1
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Abstract
【解決手段】実施形態の半導体装置は、第1電極と、第2電極と、前記第1電極と前記第2電極との間に設けられ、前記第1電極に接する第1導電形の第1半導体領域と、前記第1半導体領域と前記第2電極との間において選択的に設けられた第2導電形の第2半導体領域と、前記第2半導体領域と前記第2電極との間に設けられ、前記第2半導体領域および前記第2電極に接するコンタクト領域と、前記第2電極と前記第1半導体領域との間に設けられ、前記第2電極に接する複数の第2導電形の第3半導体領域と、前記第2電極に接し、前記第2電極との接合部分が前記第3半導体領域の上に位置し前記コンタクト領域の上に位置していない配線と、を備える。
【選択図】図1
Description
JBSダイオードでは、低い電圧では電流の立ち上がりが早いショットキーバリアダイオードを機能させ、高い電圧ではサージ耐量が高いPINダイオードを機能させることができる。また、アノード電極とPINダイオードとの間にシリサイド領域を設ける場合がある。これにより、アノード電極とPINダイオードとの電気的接触性が向上する。
図1(a)は、第1実施形態に係る半導体装置を表す模式的平面図であり、図1(b)は、第1実施形態に係る半導体装置を表す模式的断面図である。
図2(a)および図2(b)は、第1実施形態に係る半導体装置を表す模式的断面図である。
図2(a)には、図1(a)の半導体領域35が配置されていないA−A’線断面が表され、図2(b)には、図1(a)の半導体領域35が配置されているB−B’線断面が表されている。
また、図1(a)には、図1(b)に表すアノード電極11が表示されていない。
図4(a)および図4(b)は、参考例に係る半導体装置を表す模式的断面図である。
図4(a)には、図3(a)の半導体領域35が配置されていないA−A’線断面が表され、図4(b)には、図3(a)の半導体領域35が配置されているB−B’線断面が表されている。
図6(a)は、第1実施形態に係る半導体装置を表す模式的平面図であり、図6(b)は、第1実施形態に係る半導体装置を表す模式的断面図である。
図7(a)は、第2実施形態の第1実施例に係る半導体装置を表す模式的平面図であり、図7(b)は、第2実施形態の第2実施例に係る半導体装置を表す模式的平面図である。
図9(a)は、第3実施形態の第1実施例に係る半導体装置を表す模式的平面図であり、図9(b)は、第3実施形態の第2実施例に係る半導体装置を表す模式的平面図である。
Claims (10)
- 第1電極と、
第2電極と、
前記第1電極と前記第2電極との間に設けられ、前記第1電極に接する第1導電形の第1半導体領域と、
前記第1半導体領域と前記第2電極との間において選択的に設けられた第2導電形の第2半導体領域と、
前記第2半導体領域と前記第2電極との間に設けられ、前記第2半導体領域および前記第2電極に接するコンタクト領域と、
前記第2電極と前記第1半導体領域との間に設けられ、前記第2電極に接する複数の第2導電形の第3半導体領域と、
前記第2電極に接し、前記第2電極との接合部分が前記第3半導体領域の上に位置し前記コンタクト領域の上に位置していない配線と、
を備えた半導体装置。 - 前記第1半導体領域は、第1部と前記第1部よりも不純物濃度が低い第2部とを有し、
前記第1部は、前記第1電極の側に設けられ、
前記第2部は、前記第2電極の側に設けられている請求項1に記載の半導体装置。 - 前記第1半導体領域は、前記第2電極に接している請求項1または2に記載の半導体装置。
- 複数の前記第3半導体領域のそれぞれの間に、前記第1半導体領域の一部が設けられている請求項3に記載の半導体装置。
- 前記接合部分を上面視した場合、
前記接合部分は、前記コンタクト領域によって囲まれている請求項1〜4のいずれか1つに記載の半導体装置。 - 前記接合部分は、複数設けられ、
複数の前記接合部分を上面視した場合、
複数の前記接合部分のそれぞれが前記コンタクト領域によって囲まれている請求項1〜4のいずれか1つに記載の半導体装置。 - 前記配線は、複数設けられ、
複数の前記配線を上面視した場合、
複数の前記配線のそれぞれの前記接合部分が前記コンタクト領域によって囲まれている請求項1〜4のいずれか1つに記載の半導体装置。 - 前記コンタクト領域は、
前記第1電極から前記第2電極に向かう方向に対して交差する方向に延在する第1領域と、
前記第1領域を囲む第2領域と、
を有する請求項1〜7のいずれか1つに記載の半導体装置。 - 前記接合部分は、前記第1領域が延在する方向に延在している請求項8に記載の半導体装置。
- 前記第3半導体領域は、前記第1半導体領域の上で延在し、
前記コンタクト領域は、前記第3半導体領域が延在する方向において、前記第3半導体領域によって挟まれている請求項1〜9のいずれか1つに記載の半導体装置。
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Publication number | Priority date | Publication date | Assignee | Title |
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JP2012204411A (ja) * | 2011-03-23 | 2012-10-22 | Toshiba Corp | 半導体装置 |
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