JP6170856B2 - 半導体装置 - Google Patents
半導体装置 Download PDFInfo
- Publication number
- JP6170856B2 JP6170856B2 JP2014052801A JP2014052801A JP6170856B2 JP 6170856 B2 JP6170856 B2 JP 6170856B2 JP 2014052801 A JP2014052801 A JP 2014052801A JP 2014052801 A JP2014052801 A JP 2014052801A JP 6170856 B2 JP6170856 B2 JP 6170856B2
- Authority
- JP
- Japan
- Prior art keywords
- semiconductor region
- electrode
- region
- semiconductor
- semiconductor device
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
- 239000004065 semiconductor Substances 0.000 title claims description 175
- 239000012535 impurity Substances 0.000 claims description 42
- 230000004048 modification Effects 0.000 description 15
- 238000012986 modification Methods 0.000 description 15
- 239000000463 material Substances 0.000 description 13
- 239000010408 film Substances 0.000 description 12
- HBMJWWWQQXIZIP-UHFFFAOYSA-N silicon carbide Chemical compound [Si+]#[C-] HBMJWWWQQXIZIP-UHFFFAOYSA-N 0.000 description 6
- 230000004888 barrier function Effects 0.000 description 5
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 4
- 230000000630 rising effect Effects 0.000 description 4
- 229910052710 silicon Inorganic materials 0.000 description 4
- 239000010703 silicon Substances 0.000 description 4
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 3
- 229910052751 metal Inorganic materials 0.000 description 3
- 239000002184 metal Substances 0.000 description 3
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 description 2
- ZOXJGFHDIHLPTG-UHFFFAOYSA-N Boron Chemical compound [B] ZOXJGFHDIHLPTG-UHFFFAOYSA-N 0.000 description 2
- OAICVXFJPJFONN-UHFFFAOYSA-N Phosphorus Chemical compound [P] OAICVXFJPJFONN-UHFFFAOYSA-N 0.000 description 2
- 229910052782 aluminium Inorganic materials 0.000 description 2
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 2
- 229910052796 boron Inorganic materials 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- 239000010931 gold Substances 0.000 description 2
- 238000002347 injection Methods 0.000 description 2
- 239000007924 injection Substances 0.000 description 2
- 229910052698 phosphorus Inorganic materials 0.000 description 2
- 239000011574 phosphorus Substances 0.000 description 2
- 238000010992 reflux Methods 0.000 description 2
- 229910010271 silicon carbide Inorganic materials 0.000 description 2
- 239000010936 titanium Substances 0.000 description 2
- 229910052581 Si3N4 Inorganic materials 0.000 description 1
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 1
- RTAQQCXQSZGOHL-UHFFFAOYSA-N Titanium Chemical compound [Ti] RTAQQCXQSZGOHL-UHFFFAOYSA-N 0.000 description 1
- 229910052785 arsenic Inorganic materials 0.000 description 1
- RQNWIZPPADIBDY-UHFFFAOYSA-N arsenic atom Chemical compound [As] RQNWIZPPADIBDY-UHFFFAOYSA-N 0.000 description 1
- 239000013078 crystal Substances 0.000 description 1
- 230000007423 decrease Effects 0.000 description 1
- 230000005669 field effect Effects 0.000 description 1
- -1 for example Chemical compound 0.000 description 1
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 1
- 229910052737 gold Inorganic materials 0.000 description 1
- 230000009931 harmful effect Effects 0.000 description 1
- 238000009413 insulation Methods 0.000 description 1
- 229910044991 metal oxide Inorganic materials 0.000 description 1
- 150000004706 metal oxides Chemical class 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 229910052759 nickel Inorganic materials 0.000 description 1
- 229910052757 nitrogen Inorganic materials 0.000 description 1
- 229910021420 polycrystalline silicon Inorganic materials 0.000 description 1
- 229920005591 polysilicon Polymers 0.000 description 1
- 229910021332 silicide Inorganic materials 0.000 description 1
- FVBUAEGBCNSCDD-UHFFFAOYSA-N silicide(4-) Chemical compound [Si-4] FVBUAEGBCNSCDD-UHFFFAOYSA-N 0.000 description 1
- LIVNPJMFVYWSIS-UHFFFAOYSA-N silicon monoxide Chemical compound [Si-]#[O+] LIVNPJMFVYWSIS-UHFFFAOYSA-N 0.000 description 1
- HQVNEWCFYHHQES-UHFFFAOYSA-N silicon nitride Chemical compound N12[Si]34N5[Si]62N3[Si]51N64 HQVNEWCFYHHQES-UHFFFAOYSA-N 0.000 description 1
- 229910052814 silicon oxide Inorganic materials 0.000 description 1
- 239000010409 thin film Substances 0.000 description 1
- 229910052719 titanium Inorganic materials 0.000 description 1
- WFKWXMTUELFFGS-UHFFFAOYSA-N tungsten Chemical compound [W] WFKWXMTUELFFGS-UHFFFAOYSA-N 0.000 description 1
- 229910052721 tungsten Inorganic materials 0.000 description 1
- 239000010937 tungsten Substances 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L29/00—Semiconductor devices specially adapted for rectifying, amplifying, oscillating or switching and having potential barriers; Capacitors or resistors having potential barriers, e.g. a PN-junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
- H01L29/66—Types of semiconductor device ; Multistep manufacturing processes therefor
- H01L29/68—Types of semiconductor device ; Multistep manufacturing processes therefor controllable by only the electric current supplied, or only the electric potential applied, to an electrode which does not carry the current to be rectified, amplified or switched
- H01L29/76—Unipolar devices, e.g. field effect transistors
- H01L29/772—Field effect transistors
- H01L29/78—Field effect transistors with field effect produced by an insulated gate
- H01L29/7801—DMOS transistors, i.e. MISFETs with a channel accommodating body or base region adjoining a drain drift region
- H01L29/7802—Vertical DMOS transistors, i.e. VDMOS transistors
- H01L29/7803—Vertical DMOS transistors, i.e. VDMOS transistors structurally associated with at least one other device
- H01L29/7804—Vertical DMOS transistors, i.e. VDMOS transistors structurally associated with at least one other device the other device being a pn-junction diode
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L29/00—Semiconductor devices specially adapted for rectifying, amplifying, oscillating or switching and having potential barriers; Capacitors or resistors having potential barriers, e.g. a PN-junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
- H01L29/02—Semiconductor bodies ; Multistep manufacturing processes therefor
- H01L29/06—Semiconductor bodies ; Multistep manufacturing processes therefor characterised by their shape; characterised by the shapes, relative sizes, or dispositions of the semiconductor regions ; characterised by the concentration or distribution of impurities within semiconductor regions
- H01L29/0684—Semiconductor bodies ; Multistep manufacturing processes therefor characterised by their shape; characterised by the shapes, relative sizes, or dispositions of the semiconductor regions ; characterised by the concentration or distribution of impurities within semiconductor regions characterised by the shape, relative sizes or dispositions of the semiconductor regions or junctions between the regions
- H01L29/0692—Surface layout
- H01L29/0696—Surface layout of cellular field-effect devices, e.g. multicellular DMOS transistors or IGBTs
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L29/00—Semiconductor devices specially adapted for rectifying, amplifying, oscillating or switching and having potential barriers; Capacitors or resistors having potential barriers, e.g. a PN-junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
- H01L29/02—Semiconductor bodies ; Multistep manufacturing processes therefor
- H01L29/06—Semiconductor bodies ; Multistep manufacturing processes therefor characterised by their shape; characterised by the shapes, relative sizes, or dispositions of the semiconductor regions ; characterised by the concentration or distribution of impurities within semiconductor regions
- H01L29/08—Semiconductor bodies ; Multistep manufacturing processes therefor characterised by their shape; characterised by the shapes, relative sizes, or dispositions of the semiconductor regions ; characterised by the concentration or distribution of impurities within semiconductor regions with semiconductor regions connected to an electrode carrying current to be rectified, amplified or switched and such electrode being part of a semiconductor device which comprises three or more electrodes
- H01L29/0843—Source or drain regions of field-effect devices
- H01L29/0847—Source or drain regions of field-effect devices of field-effect transistors with insulated gate
- H01L29/0852—Source or drain regions of field-effect devices of field-effect transistors with insulated gate of DMOS transistors
- H01L29/0856—Source regions
- H01L29/086—Impurity concentration or distribution
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L29/00—Semiconductor devices specially adapted for rectifying, amplifying, oscillating or switching and having potential barriers; Capacitors or resistors having potential barriers, e.g. a PN-junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
- H01L29/02—Semiconductor bodies ; Multistep manufacturing processes therefor
- H01L29/06—Semiconductor bodies ; Multistep manufacturing processes therefor characterised by their shape; characterised by the shapes, relative sizes, or dispositions of the semiconductor regions ; characterised by the concentration or distribution of impurities within semiconductor regions
- H01L29/10—Semiconductor bodies ; Multistep manufacturing processes therefor characterised by their shape; characterised by the shapes, relative sizes, or dispositions of the semiconductor regions ; characterised by the concentration or distribution of impurities within semiconductor regions with semiconductor regions connected to an electrode not carrying current to be rectified, amplified or switched and such electrode being part of a semiconductor device which comprises three or more electrodes
- H01L29/1095—Body region, i.e. base region, of DMOS transistors or IGBTs
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L29/00—Semiconductor devices specially adapted for rectifying, amplifying, oscillating or switching and having potential barriers; Capacitors or resistors having potential barriers, e.g. a PN-junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
- H01L29/66—Types of semiconductor device ; Multistep manufacturing processes therefor
- H01L29/68—Types of semiconductor device ; Multistep manufacturing processes therefor controllable by only the electric current supplied, or only the electric potential applied, to an electrode which does not carry the current to be rectified, amplified or switched
- H01L29/76—Unipolar devices, e.g. field effect transistors
- H01L29/772—Field effect transistors
- H01L29/78—Field effect transistors with field effect produced by an insulated gate
- H01L29/7801—DMOS transistors, i.e. MISFETs with a channel accommodating body or base region adjoining a drain drift region
- H01L29/7802—Vertical DMOS transistors, i.e. VDMOS transistors
- H01L29/7803—Vertical DMOS transistors, i.e. VDMOS transistors structurally associated with at least one other device
- H01L29/7804—Vertical DMOS transistors, i.e. VDMOS transistors structurally associated with at least one other device the other device being a pn-junction diode
- H01L29/7805—Vertical DMOS transistors, i.e. VDMOS transistors structurally associated with at least one other device the other device being a pn-junction diode in antiparallel, e.g. freewheel diode
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L29/00—Semiconductor devices specially adapted for rectifying, amplifying, oscillating or switching and having potential barriers; Capacitors or resistors having potential barriers, e.g. a PN-junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
- H01L29/02—Semiconductor bodies ; Multistep manufacturing processes therefor
- H01L29/12—Semiconductor bodies ; Multistep manufacturing processes therefor characterised by the materials of which they are formed
- H01L29/16—Semiconductor bodies ; Multistep manufacturing processes therefor characterised by the materials of which they are formed including, apart from doping materials or other impurities, only elements of Group IV of the Periodic Table
- H01L29/1608—Silicon carbide
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Physics & Mathematics (AREA)
- Ceramic Engineering (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Metal-Oxide And Bipolar Metal-Oxide Semiconductor Integrated Circuits (AREA)
- Electrodes Of Semiconductors (AREA)
Description
または、実施形態の半導体装置は、第1電極と、第2電極と、前記第1電極と前記第2電極との間に設けられた第1導電形の第1半導体領域と、前記第1半導体領域と前記第2電極との間に設けられた第2導電形の第2半導体領域と、前記第2半導体領域と前記第2電極との間に設けられ、前記第2電極に接し、前記第1半導体領域よりも不純物濃度が高い第1導電形の第3半導体領域と、前記第3半導体領域、前記第2半導体領域、および前記第1半導体領域に、絶縁膜を介して接する第3電極と、前記第1半導体領域と前記第2電極との間に設けられ、前記第2半導体領域に隣接し、第1部分と前記第1部分よりも膜厚が厚い第2部分とを有する第2導電形の第4半導体領域と、前記第1部分と前記第2電極との間に設けられ、前記第2電極に接し、前記第1半導体領域よりも不純物濃度が高い第1導電形の第5半導体領域と、を備える。
図2は、本実施形態に係る半導体装置を表す模式的平面図である。
本実施形態では、半導体材が、炭化ケイ素(SiC)を主成分とする場合について説明する。半導体装置1において、ソース電極11に対しドレイン電極10に高い電圧を印加し、ゲート電極50に閾値電圧(Vth)以上の電圧を印加すると、ゲート絶縁膜51に沿ってベース領域30にチャネルが形成され、半導体装置1がオン状態になる。一方、ゲート電極50に閾値電圧(Vth)より低い電圧を印加すると、該チャネルは形成されず、半導体装置1はオフ状態になる。
図3(a)および図3(b)は、本実施形態に係る半導体装置を表す模式的断面図である。
図3(a)および図3(b)には、半導体領域31と、半導体領域31付近を拡大した図が示されている。
半導体領域31は、p−形の第1部分31aと、第1部分31aを挟むp形の第2部分31bと、を有している。第1部分31aの不純物濃度は、第2部分31bの不純物濃度よりも低い。第1部分31aの厚さは、第2部分31bの厚さよりも薄い。第1部分31aとソース電極11との間には、半導体領域41が設けられている。
図4(a)および図4(b)は、本実施形態に係るダイオードのエネルギーバンドを表す模式図である。
Claims (7)
- 第1電極と、
第2電極と、
前記第1電極と前記第2電極との間に設けられた第1導電形の第1半導体領域と、
前記第1半導体領域と前記第2電極との間に設けられた第2導電形の第2半導体領域と、
前記第2半導体領域と前記第2電極との間に設けられ、前記第2電極に接し、前記第1半導体領域よりも不純物濃度が高い第1導電形の第3半導体領域と、
前記第3半導体領域、前記第2半導体領域、および前記第1半導体領域に、絶縁膜を介して接する第3電極と、
前記第1半導体領域と前記第2電極との間に設けられ、前記第2半導体領域に隣接し、第1部分と前記第1部分よりも不純物濃度が高い第2部分とを有する第2導電形の第4半導体領域と、
前記第1部分と前記第2電極との間に設けられ、前記第2電極に接し、前記第1半導体領域よりも不純物濃度が高い第1導電形の第5半導体領域と、
を備えた半導体装置。 - 前記第4半導体領域の前記第2部分は、前記第1部分を挟み、前記第1部分よりも膜厚が厚い請求項1に記載の半導体装置。
- 第1電極と、
第2電極と、
前記第1電極と前記第2電極との間に設けられた第1導電形の第1半導体領域と、
前記第1半導体領域と前記第2電極との間に設けられた第2導電形の第2半導体領域と、
前記第2半導体領域と前記第2電極との間に設けられ、前記第2電極に接し、前記第1半導体領域よりも不純物濃度が高い第1導電形の第3半導体領域と、
前記第3半導体領域、前記第2半導体領域、および前記第1半導体領域に、絶縁膜を介して接する第3電極と、
前記第1半導体領域と前記第2電極との間に設けられ、前記第2半導体領域に隣接し、第1部分と前記第1部分よりも膜厚が厚い第2部分とを有する第2導電形の第4半導体領域と、
前記第1部分と前記第2電極との間に設けられ、前記第2電極に接し、前記第1半導体領域よりも不純物濃度が高い第1導電形の第5半導体領域と、
を備えた半導体装置。 - 前記第1電極から前記第2電極に向かう第1方向に対して交差する第2方向において、前記第2半導体領域と前記第4半導体領域とが配列されている請求項1〜3のいずれか1つに記載の半導体装置。
- 前記第3電極は、前記第2方向に延在し、
前記第5半導体領域、前記第4半導体領域、および前記第1半導体領域に、絶縁膜を介して前記第3電極が接している請求項4記載の半導体装置。 - 前記第2半導体領域と前記第2電極との間に設けられ、前記第3半導体領域に接し、前記第2半導体領域よりも不純物濃度が高い第2導電形の第6半導体領域をさらに備えた請求項1〜5のいずれか1つに記載の半導体装置。
- 前記第3半導体領域の不純物濃度と前記第5半導体領域の不純物濃度とが異なっている請求項1〜6のいずれか1つに記載の半導体装置。
Priority Applications (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2014052801A JP6170856B2 (ja) | 2014-03-14 | 2014-03-14 | 半導体装置 |
CN201410369570.8A CN104916688B (zh) | 2014-03-14 | 2014-07-30 | 半导体装置 |
US14/473,246 US9379234B2 (en) | 2014-03-14 | 2014-08-29 | Semiconductor device |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2014052801A JP6170856B2 (ja) | 2014-03-14 | 2014-03-14 | 半導体装置 |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2015177074A JP2015177074A (ja) | 2015-10-05 |
JP6170856B2 true JP6170856B2 (ja) | 2017-07-26 |
Family
ID=54069849
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2014052801A Active JP6170856B2 (ja) | 2014-03-14 | 2014-03-14 | 半導体装置 |
Country Status (3)
Country | Link |
---|---|
US (1) | US9379234B2 (ja) |
JP (1) | JP6170856B2 (ja) |
CN (1) | CN104916688B (ja) |
Families Citing this family (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN104282732B (zh) * | 2013-07-01 | 2017-06-27 | 株式会社东芝 | 半导体装置 |
US9998109B1 (en) * | 2017-05-15 | 2018-06-12 | Cree, Inc. | Power module with improved reliability |
JP6782213B2 (ja) * | 2017-09-19 | 2020-11-11 | 株式会社東芝 | 半導体装置 |
JP7292233B2 (ja) * | 2020-03-11 | 2023-06-16 | 株式会社東芝 | 半導体装置 |
Family Cites Families (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US3697827A (en) * | 1971-02-09 | 1972-10-10 | Unitrode Corp | Structure and formation of semiconductors with transverse conductivity gradients |
JPH03238871A (ja) * | 1990-02-15 | 1991-10-24 | Mitsubishi Electric Corp | 半導体装置およびその製造方法 |
JP3272242B2 (ja) | 1995-06-09 | 2002-04-08 | 三洋電機株式会社 | 半導体装置 |
KR100316723B1 (ko) * | 1999-03-26 | 2001-12-12 | 김덕중 | 낮은 온 저항과 큰 견고함을 갖는 전력용 모스 트랜지스터 |
JP4197400B2 (ja) | 2001-03-29 | 2008-12-17 | 三菱電機株式会社 | 炭化珪素半導体からなる半導体装置 |
JP2005243936A (ja) | 2004-02-26 | 2005-09-08 | Toyota Industries Corp | 半導体装置及びその製造方法 |
JP2006339516A (ja) * | 2005-06-03 | 2006-12-14 | Rohm Co Ltd | 半導体装置およびその製造方法 |
JP5995435B2 (ja) * | 2011-08-02 | 2016-09-21 | ローム株式会社 | 半導体装置およびその製造方法 |
-
2014
- 2014-03-14 JP JP2014052801A patent/JP6170856B2/ja active Active
- 2014-07-30 CN CN201410369570.8A patent/CN104916688B/zh active Active
- 2014-08-29 US US14/473,246 patent/US9379234B2/en active Active
Also Published As
Publication number | Publication date |
---|---|
CN104916688A (zh) | 2015-09-16 |
US20150263158A1 (en) | 2015-09-17 |
US9379234B2 (en) | 2016-06-28 |
CN104916688B (zh) | 2018-05-01 |
JP2015177074A (ja) | 2015-10-05 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
JP5940235B1 (ja) | 半導体装置 | |
US9219060B2 (en) | Semiconductor device | |
US10964686B2 (en) | Semiconductor device and method of manufacturing semiconductor device | |
JP6413104B2 (ja) | サージ保護素子 | |
JP2006073987A (ja) | 半導体素子 | |
JP6323556B2 (ja) | 半導体装置 | |
US9620595B2 (en) | Semiconductor device | |
US20160079369A1 (en) | Semiconductor device | |
JP6218462B2 (ja) | ワイドギャップ半導体装置 | |
JP6170856B2 (ja) | 半導体装置 | |
US9224844B2 (en) | Semiconductor device | |
US9721939B2 (en) | Semiconductor device | |
JP2012109599A (ja) | 半導体素子 | |
US20150263149A1 (en) | Semiconductor device | |
US10950723B2 (en) | Semiconductor device and circuit having the same | |
JP5465937B2 (ja) | 半導体装置、半導体装置の制御方法、半導体モジュール | |
JP2016058645A (ja) | 半導体装置 | |
CN112310191B (zh) | 半导体装置 | |
JP2014060299A (ja) | 半導体装置 | |
US9741872B2 (en) | Semiconductor device | |
JP2022130063A (ja) | 半導体装置 | |
KR20160047166A (ko) | 반도체 소자 |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
A621 | Written request for application examination |
Free format text: JAPANESE INTERMEDIATE CODE: A621 Effective date: 20160229 |
|
A977 | Report on retrieval |
Free format text: JAPANESE INTERMEDIATE CODE: A971007 Effective date: 20170117 |
|
A131 | Notification of reasons for refusal |
Free format text: JAPANESE INTERMEDIATE CODE: A131 Effective date: 20170125 |
|
A521 | Request for written amendment filed |
Free format text: JAPANESE INTERMEDIATE CODE: A523 Effective date: 20170327 |
|
TRDD | Decision of grant or rejection written | ||
A01 | Written decision to grant a patent or to grant a registration (utility model) |
Free format text: JAPANESE INTERMEDIATE CODE: A01 Effective date: 20170602 |
|
A61 | First payment of annual fees (during grant procedure) |
Free format text: JAPANESE INTERMEDIATE CODE: A61 Effective date: 20170703 |
|
R151 | Written notification of patent or utility model registration |
Ref document number: 6170856 Country of ref document: JP Free format text: JAPANESE INTERMEDIATE CODE: R151 |