JP2015534285A5 - - Google Patents

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Publication number
JP2015534285A5
JP2015534285A5 JP2015541717A JP2015541717A JP2015534285A5 JP 2015534285 A5 JP2015534285 A5 JP 2015534285A5 JP 2015541717 A JP2015541717 A JP 2015541717A JP 2015541717 A JP2015541717 A JP 2015541717A JP 2015534285 A5 JP2015534285 A5 JP 2015534285A5
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JP
Japan
Prior art keywords
pad
microelectronic component
pad structure
laser beam
donor film
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JP2015541717A
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English (en)
Japanese (ja)
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JP2015534285A (ja
JP6283679B2 (ja
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Priority claimed from EP12192091.2A external-priority patent/EP2731126A1/en
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Publication of JP2015534285A5 publication Critical patent/JP2015534285A5/ja
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JP2015541717A 2012-11-09 2013-11-08 ベア・チップ・ダイをボンディングする方法 Active JP6283679B2 (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
EP12192091.2 2012-11-09
EP12192091.2A EP2731126A1 (en) 2012-11-09 2012-11-09 Method for bonding bare chip dies
PCT/NL2013/050800 WO2014073963A1 (en) 2012-11-09 2013-11-08 Method for bonding bare chip dies

Publications (3)

Publication Number Publication Date
JP2015534285A JP2015534285A (ja) 2015-11-26
JP2015534285A5 true JP2015534285A5 (enExample) 2016-12-01
JP6283679B2 JP6283679B2 (ja) 2018-02-21

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JP2015541717A Active JP6283679B2 (ja) 2012-11-09 2013-11-08 ベア・チップ・ダイをボンディングする方法

Country Status (7)

Country Link
US (1) US9859247B2 (enExample)
EP (2) EP2731126A1 (enExample)
JP (1) JP6283679B2 (enExample)
KR (1) KR102160321B1 (enExample)
CN (1) CN104854686B (enExample)
TW (1) TWI674654B (enExample)
WO (1) WO2014073963A1 (enExample)

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