JP2015527736A5 - - Google Patents

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Publication number
JP2015527736A5
JP2015527736A5 JP2015524392A JP2015524392A JP2015527736A5 JP 2015527736 A5 JP2015527736 A5 JP 2015527736A5 JP 2015524392 A JP2015524392 A JP 2015524392A JP 2015524392 A JP2015524392 A JP 2015524392A JP 2015527736 A5 JP2015527736 A5 JP 2015527736A5
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JP
Japan
Prior art keywords
die
semiconductor die
bond pads
edge
memory
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2015524392A
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English (en)
Japanese (ja)
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JP2015527736A (ja
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Publication date
Priority claimed from US13/947,936 external-priority patent/US9117790B2/en
Application filed filed Critical
Publication of JP2015527736A publication Critical patent/JP2015527736A/ja
Publication of JP2015527736A5 publication Critical patent/JP2015527736A5/ja
Pending legal-status Critical Current

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JP2015524392A 2012-07-23 2013-07-23 マルチメモリダイを含む半導体パッケージに関連する方法及び配置 Pending JP2015527736A (ja)

Applications Claiming Priority (7)

Application Number Priority Date Filing Date Title
US201261674703P 2012-07-23 2012-07-23
US61/674,703 2012-07-23
US201261675626P 2012-07-25 2012-07-25
US61/675,626 2012-07-25
US13/947,936 US9117790B2 (en) 2012-06-25 2013-07-22 Methods and arrangements relating to semiconductor packages including multi-memory dies
US13/947,936 2013-07-22
PCT/US2013/051694 WO2014018538A1 (en) 2012-07-23 2013-07-23 Methods and arrangements relating to semiconductor packages including multi-memory dies

Publications (2)

Publication Number Publication Date
JP2015527736A JP2015527736A (ja) 2015-09-17
JP2015527736A5 true JP2015527736A5 (enExample) 2016-09-15

Family

ID=49945870

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2015524392A Pending JP2015527736A (ja) 2012-07-23 2013-07-23 マルチメモリダイを含む半導体パッケージに関連する方法及び配置

Country Status (5)

Country Link
US (1) US9117790B2 (enExample)
JP (1) JP2015527736A (enExample)
KR (1) KR20150040893A (enExample)
CN (1) CN104769709A (enExample)
WO (1) WO2014018538A1 (enExample)

Families Citing this family (64)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US8674483B2 (en) 2011-06-27 2014-03-18 Marvell World Trade Ltd. Methods and arrangements relating to semiconductor packages including multi-memory dies
US9497861B2 (en) * 2012-12-06 2016-11-15 Taiwan Semiconductor Manufacturing Company, Ltd. Methods and apparatus for package with interposers
US9589927B2 (en) 2014-09-19 2017-03-07 Nxp Usa, Inc. Packaged RF amplifier devices with grounded isolation structures and methods of manufacture thereof
US9337774B2 (en) 2014-09-19 2016-05-10 Freescale Semiconductor, Inc. Packaged RF amplifier devices and methods of manufacture thereof
US11178818B2 (en) 2018-10-26 2021-11-23 Deere & Company Harvesting machine control system with fill level processing based on yield data
US11653588B2 (en) 2018-10-26 2023-05-23 Deere & Company Yield map generation and control system
US11240961B2 (en) 2018-10-26 2022-02-08 Deere & Company Controlling a harvesting machine based on a geo-spatial representation indicating where the harvesting machine is likely to reach capacity
US11079725B2 (en) 2019-04-10 2021-08-03 Deere & Company Machine control using real-time model
US11467605B2 (en) 2019-04-10 2022-10-11 Deere & Company Zonal machine control
US11589509B2 (en) 2018-10-26 2023-02-28 Deere & Company Predictive machine characteristic map generation and control system
US11672203B2 (en) 2018-10-26 2023-06-13 Deere & Company Predictive map generation and control
US11641800B2 (en) 2020-02-06 2023-05-09 Deere & Company Agricultural harvesting machine with pre-emergence weed detection and mitigation system
US11957072B2 (en) 2020-02-06 2024-04-16 Deere & Company Pre-emergence weed detection and mitigation system
US11024617B2 (en) * 2018-10-26 2021-06-01 Micron Technology, Inc. Semiconductor packages having photon integrated circuit (PIC) chips
US10928585B2 (en) 2018-10-26 2021-02-23 Micron Technology, Inc. Semiconductor devices having electro-optical substrates
US12069978B2 (en) 2018-10-26 2024-08-27 Deere & Company Predictive environmental characteristic map generation and control system
US11778945B2 (en) 2019-04-10 2023-10-10 Deere & Company Machine control using real-time model
US11234366B2 (en) 2019-04-10 2022-02-01 Deere & Company Image selection for machine control
US12329148B2 (en) 2020-02-06 2025-06-17 Deere & Company Predictive weed map and material application machine control
US12035648B2 (en) 2020-02-06 2024-07-16 Deere & Company Predictive weed map generation and control system
US12225846B2 (en) 2020-02-06 2025-02-18 Deere & Company Machine control using a predictive map
US11477940B2 (en) 2020-03-26 2022-10-25 Deere & Company Mobile work machine control based on zone parameter modification
US11410949B2 (en) * 2020-07-27 2022-08-09 Micron Technology, Inc. Memory devices with backside bond pads under a memory array
US11946747B2 (en) 2020-10-09 2024-04-02 Deere & Company Crop constituent map generation and control system
US11711995B2 (en) 2020-10-09 2023-08-01 Deere & Company Machine control using a predictive map
US11983009B2 (en) 2020-10-09 2024-05-14 Deere & Company Map generation and control system
US11849672B2 (en) 2020-10-09 2023-12-26 Deere & Company Machine control using a predictive map
US11635765B2 (en) 2020-10-09 2023-04-25 Deere & Company Crop state map generation and control system
US11727680B2 (en) 2020-10-09 2023-08-15 Deere & Company Predictive map generation based on seeding characteristics and control
US11871697B2 (en) 2020-10-09 2024-01-16 Deere & Company Crop moisture map generation and control system
US11650587B2 (en) 2020-10-09 2023-05-16 Deere & Company Predictive power map generation and control system
US12069986B2 (en) 2020-10-09 2024-08-27 Deere & Company Map generation and control system
US11845449B2 (en) 2020-10-09 2023-12-19 Deere & Company Map generation and control system
US11927459B2 (en) 2020-10-09 2024-03-12 Deere & Company Machine control using a predictive map
US12422847B2 (en) 2020-10-09 2025-09-23 Deere & Company Predictive agricultural model and map generation
US11849671B2 (en) 2020-10-09 2023-12-26 Deere & Company Crop state map generation and control system
US11592822B2 (en) 2020-10-09 2023-02-28 Deere & Company Machine control using a predictive map
US11844311B2 (en) 2020-10-09 2023-12-19 Deere & Company Machine control using a predictive map
US11474523B2 (en) 2020-10-09 2022-10-18 Deere & Company Machine control using a predictive speed map
US12013245B2 (en) 2020-10-09 2024-06-18 Deere & Company Predictive map generation and control system
US11825768B2 (en) 2020-10-09 2023-11-28 Deere & Company Machine control using a predictive map
US11874669B2 (en) 2020-10-09 2024-01-16 Deere & Company Map generation and control system
US11895948B2 (en) 2020-10-09 2024-02-13 Deere & Company Predictive map generation and control based on soil properties
US12419220B2 (en) 2020-10-09 2025-09-23 Deere & Company Predictive map generation and control system
US11889788B2 (en) 2020-10-09 2024-02-06 Deere & Company Predictive biomass map generation and control
US12178158B2 (en) 2020-10-09 2024-12-31 Deere & Company Predictive map generation and control system for an agricultural work machine
US12386354B2 (en) 2020-10-09 2025-08-12 Deere & Company Predictive power map generation and control system
US11864483B2 (en) 2020-10-09 2024-01-09 Deere & Company Predictive map generation and control system
US11675354B2 (en) 2020-10-09 2023-06-13 Deere & Company Machine control using a predictive map
US12250905B2 (en) 2020-10-09 2025-03-18 Deere & Company Machine control using a predictive map
US11889787B2 (en) 2020-10-09 2024-02-06 Deere & Company Predictive speed map generation and control system
US12127500B2 (en) 2021-01-27 2024-10-29 Deere & Company Machine control using a map with regime zones
CN117044424A (zh) * 2021-04-08 2023-11-10 超极存储器股份有限公司 模块及其制造方法
US12229886B2 (en) 2021-10-01 2025-02-18 Deere & Company Historical crop state model, predictive crop state map generation and control system
US12310286B2 (en) 2021-12-14 2025-05-27 Deere & Company Crop constituent sensing
US12302791B2 (en) 2021-12-20 2025-05-20 Deere & Company Crop constituents, predictive mapping, and agricultural harvester control
US12245549B2 (en) 2022-01-11 2025-03-11 Deere & Company Predictive response map generation and control system
US12082531B2 (en) 2022-01-26 2024-09-10 Deere & Company Systems and methods for predicting material dynamics
CN114242669B (zh) * 2022-02-28 2022-07-08 甬矽电子(宁波)股份有限公司 堆叠封装结构和堆叠结构封装方法
US12295288B2 (en) 2022-04-05 2025-05-13 Deere &Company Predictive machine setting map generation and control system
US12284934B2 (en) 2022-04-08 2025-04-29 Deere & Company Systems and methods for predictive tractive characteristics and control
US12058951B2 (en) 2022-04-08 2024-08-13 Deere & Company Predictive nutrient map and control
US12358493B2 (en) 2022-04-08 2025-07-15 Deere & Company Systems and methods for predictive power requirements and control
US12298767B2 (en) 2022-04-08 2025-05-13 Deere & Company Predictive material consumption map and control

Family Cites Families (24)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH01235264A (ja) * 1988-03-15 1989-09-20 Toshiba Corp 半導体集積回路装置
JP2001257307A (ja) * 2000-03-09 2001-09-21 Sharp Corp 半導体装置
US6638789B1 (en) * 2000-09-26 2003-10-28 Amkor Technology, Inc. Micromachine stacked wirebonded package fabrication method
WO2002082540A1 (en) * 2001-03-30 2002-10-17 Fujitsu Limited Semiconductor device, method of manufacture thereof, and semiconductor substrate
KR100868419B1 (ko) 2001-06-07 2008-11-11 가부시끼가이샤 르네사스 테크놀로지 반도체장치 및 그 제조방법
JP2003023135A (ja) * 2001-07-06 2003-01-24 Sharp Corp 半導体集積回路装置
JP2003023138A (ja) 2001-07-10 2003-01-24 Toshiba Corp メモリチップ及びこれを用いたcocデバイス、並びに、これらの製造方法
US6476506B1 (en) * 2001-09-28 2002-11-05 Motorola, Inc. Packaged semiconductor with multiple rows of bond pads and method therefor
TW588446B (en) * 2003-03-21 2004-05-21 Advanced Semiconductor Eng Multi-chips stacked package
US7095103B1 (en) * 2003-05-01 2006-08-22 Amkor Technology, Inc. Leadframe based memory card
KR100621547B1 (ko) * 2004-01-13 2006-09-14 삼성전자주식회사 멀티칩 패키지
JP2005317830A (ja) * 2004-04-30 2005-11-10 Elpida Memory Inc 半導体装置、マルチチップパッケージ、およびワイヤボンディング方法
US20080087999A1 (en) * 2006-10-16 2008-04-17 Powertech Technology Inc. Micro BGA package having multi-chip stack
US7560304B2 (en) * 2006-12-28 2009-07-14 Sandisk Corporation Method of making a semiconductor device having multiple die redistribution layer
JP5131812B2 (ja) * 2007-02-07 2013-01-30 ルネサスエレクトロニクス株式会社 半導体装置
KR101185886B1 (ko) * 2007-07-23 2012-09-25 삼성전자주식회사 유니버설 배선 라인들을 포함하는 반도체 칩, 반도체패키지, 카드 및 시스템
US8704379B2 (en) * 2007-09-10 2014-04-22 Invensas Corporation Semiconductor die mount by conformal die coating
US7872483B2 (en) * 2007-12-12 2011-01-18 Samsung Electronics Co., Ltd. Circuit board having bypass pad
US20090302483A1 (en) * 2008-06-04 2009-12-10 Himax Technologies Limited Stacked die package
CN101404279A (zh) * 2008-11-11 2009-04-08 华亚微电子(上海)有限公司 一种多芯片3d堆叠封装结构
KR20110041301A (ko) * 2009-10-15 2011-04-21 삼성전자주식회사 반도체 패키지 및 반도체 패키지의 제조 방법
US8421242B2 (en) * 2009-12-31 2013-04-16 Advanced Semiconductor Engineering, Inc. Semiconductor package
US8674483B2 (en) * 2011-06-27 2014-03-18 Marvell World Trade Ltd. Methods and arrangements relating to semiconductor packages including multi-memory dies
TWI565026B (zh) * 2012-01-05 2017-01-01 威盛電子股份有限公司 晶片封裝結構

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