JP2015178635A5 - - Google Patents
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- Publication number
- JP2015178635A5 JP2015178635A5 JP2015121164A JP2015121164A JP2015178635A5 JP 2015178635 A5 JP2015178635 A5 JP 2015178635A5 JP 2015121164 A JP2015121164 A JP 2015121164A JP 2015121164 A JP2015121164 A JP 2015121164A JP 2015178635 A5 JP2015178635 A5 JP 2015178635A5
- Authority
- JP
- Japan
- Prior art keywords
- electronic component
- resin sheet
- thermosetting resin
- manufacturing
- component package
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 229920001187 thermosetting polymer Polymers 0.000 claims 11
- 229920005989 resin Polymers 0.000 claims 9
- 239000011347 resin Substances 0.000 claims 9
- 238000004519 manufacturing process Methods 0.000 claims 5
- 239000011256 inorganic filler Substances 0.000 claims 3
- 229910003475 inorganic filler Inorganic materials 0.000 claims 3
- 238000007789 sealing Methods 0.000 claims 3
- 239000003822 epoxy resin Substances 0.000 claims 2
- 238000003475 lamination Methods 0.000 claims 2
- 238000000034 method Methods 0.000 claims 2
- 229920000647 polyepoxide Polymers 0.000 claims 2
- 239000004065 semiconductor Substances 0.000 claims 2
- 229920001971 elastomer Polymers 0.000 claims 1
- 239000000806 elastomer Substances 0.000 claims 1
- LNEPOXFFQSENCJ-UHFFFAOYSA-N haloperidol Chemical compound C1CC(O)(C=2C=CC(Cl)=CC=2)CCN1CCCC(=O)C1=CC=C(F)C=C1 LNEPOXFFQSENCJ-UHFFFAOYSA-N 0.000 claims 1
- 238000010030 laminating Methods 0.000 claims 1
- 239000002245 particle Substances 0.000 claims 1
- 239000005011 phenolic resin Substances 0.000 claims 1
- 238000004804 winding Methods 0.000 claims 1
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2015121164A JP6041933B2 (ja) | 2012-11-29 | 2015-06-16 | 熱硬化性樹脂シート及び電子部品パッケージの製造方法 |
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2012261384 | 2012-11-29 | ||
| JP2012261384 | 2012-11-29 | ||
| JP2015121164A JP6041933B2 (ja) | 2012-11-29 | 2015-06-16 | 熱硬化性樹脂シート及び電子部品パッケージの製造方法 |
Related Parent Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2013240591A Division JP5943898B2 (ja) | 2012-11-29 | 2013-11-21 | 熱硬化性樹脂シート及び電子部品パッケージの製造方法 |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JP2015178635A JP2015178635A (ja) | 2015-10-08 |
| JP2015178635A5 true JP2015178635A5 (enExample) | 2015-11-19 |
| JP6041933B2 JP6041933B2 (ja) | 2016-12-14 |
Family
ID=54262890
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2015121164A Active JP6041933B2 (ja) | 2012-11-29 | 2015-06-16 | 熱硬化性樹脂シート及び電子部品パッケージの製造方法 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP6041933B2 (enExample) |
Families Citing this family (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US10600748B2 (en) * | 2016-06-20 | 2020-03-24 | Samsung Electronics Co., Ltd. | Fan-out semiconductor package |
| JP7070559B2 (ja) | 2017-04-28 | 2022-05-18 | 昭和電工マテリアルズ株式会社 | 封止用フィルム及び封止構造体、並びにこれらの製造方法 |
| US20240071781A1 (en) | 2021-02-01 | 2024-02-29 | Nagase Chemtex Corporation | Method for sealing electronic component mounting substrate, and heat-curable sheet |
| CN119654708A (zh) | 2022-07-29 | 2025-03-18 | 长濑化成株式会社 | 模塑底部填充密封用片以及使用其的电子部件安装基板的密封方法 |
| JP2024019874A (ja) * | 2022-08-01 | 2024-02-14 | 信越ポリマー株式会社 | ドライフィルム、発光型電子部品、及び発光型電子部品の製造方法 |
Family Cites Families (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP3796648B2 (ja) * | 1999-04-15 | 2006-07-12 | 信越化学工業株式会社 | エポキシ樹脂組成物並びにこのエポキシ樹脂組成物を用いた積層フィルム及び半導体装置 |
| JP4754185B2 (ja) * | 2004-05-27 | 2011-08-24 | リンテック株式会社 | 半導体封止用樹脂シートおよびこれを用いた半導体装置の製造方法 |
| JP5180162B2 (ja) * | 2009-08-05 | 2013-04-10 | 日東電工株式会社 | 電子部品封止用シート状エポキシ樹脂組成物およびそれにより得られた電子部品装置集合体ならびに電子部品装置 |
| JP5385247B2 (ja) * | 2010-12-03 | 2014-01-08 | 信越化学工業株式会社 | ウエハモールド材及び半導体装置の製造方法 |
| JP5666335B2 (ja) * | 2011-02-15 | 2015-02-12 | 日東電工株式会社 | 保護層形成用フィルム |
-
2015
- 2015-06-16 JP JP2015121164A patent/JP6041933B2/ja active Active
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